Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
10/2005
10/12/2005CN1681379A 便携式电子装置 The portable electronic device
10/12/2005CN1681377A Method of manufacturing electronic component mounting body, electronic component mounting body, and electro-optical device
10/12/2005CN1681374A Three-dimensional mounting structure and method for producing the same
10/12/2005CN1681373A Copper alloy foil for laminate sheet
10/12/2005CN1681372A 电路衬底 Circuit substrate
10/12/2005CN1681371A 电路衬底 Circuit substrate
10/12/2005CN1681096A Chip-embedded modular circuit board
10/12/2005CN1681078A Semiconductor device, and method and apparatus for manufacturing semiconductor device
10/12/2005CN1681056A Electronic component and manufacturing method of electronic component
10/12/2005CN1681011A Pickup device
10/12/2005CN1680907A 触摸面板输入装置 Touch panel input device
10/12/2005CN1680067A Laser machining apparatus for sheet-like workpiece
10/12/2005CN1223244C Double-sided wiring board and its mfg. method
10/12/2005CN1223243C Flexible printed substrate
10/12/2005CN1223107C Energy conditioning circuit assembly
10/12/2005CN1223097C Thick film millimeter wave transceiver module
10/12/2005CN1222995C Mixed IC device
10/12/2005CN1222990C A method and an arrangement for providing vias in printed circuit boards
10/12/2005CN1222989C Ultrasonic generator, multi-layer flexible circuit board and manufacture thereof
10/11/2005US6954362 System and method for reducing apparent height of a board system
10/11/2005US6954075 Battery-powered test-configured electronic device with test-contact extensions
10/11/2005US6954013 Controller and rectifier for an electrical machine, and electrical machine
10/11/2005US6953989 Film carrier tape for mounting electronic devices thereon and final defect marking method using the same
10/11/2005US6953987 Composite integrated circuit device having restricted heat conduction
10/11/2005US6953899 Wiring board comprising granular magnetic film
10/11/2005US6953898 Anti-abrasive mechanism confining flat flexible cable in position in flatbed image scanner
10/11/2005US6953892 Connection housing for an electronic component
10/11/2005US6953761 produced under high pressure with a sintering aid of Nd, Sm, Eu, Gd, Er, Pr, Dy, Yb, oxides or nitrides; surface smoothness after mirror polishing; laser diodes
10/11/2005US6953756 Glass ceramic sintered body and wiring board using the sintered body
10/11/2005US6953745 Void-free metal interconnection structure and method of forming the same
10/11/2005US6953698 Methods for making microwave circuits
10/11/2005US6953349 Multilayer circuit board for high frequency signals
10/11/2005US6953291 Compact package design for vertical cavity surface emitting laser array to optical fiber cable connection
10/11/2005US6952870 Integrated circuit wiring method
10/06/2005WO2005094149A2 Support platform for electrical components, and module comprising said support platform
10/06/2005WO2005094148A1 Multilayer wiring board and manufacturing method thereof
10/06/2005WO2005094146A1 Circuit board panel with a plurality of circuit carriers, circuit carrier and method for individually separating circuit carriers belonging to a circuit board panel
10/06/2005WO2005094145A1 Device provided with an electric motor and a main printed circuit board and mounting method
10/06/2005WO2005094144A1 Circuit device and method for manufacturing same
10/06/2005WO2005094143A1 Flexible circuit board assembly
10/06/2005WO2005093828A1 High frequency package, transmitting and receiving module and wireless equipment
10/06/2005WO2005093827A1 Through wiring board and method for producing the same
10/06/2005WO2005093773A1 System comprising an automotive fuse and an a/d converter
10/06/2005WO2005093765A1 An inductive coupler
10/06/2005WO2005093763A1 Inorganic dielectric powder for composite dielectric material and composite dielectric material
10/06/2005WO2005093757A1 Interchangeable connection arrays for double-sided dimm placement
10/06/2005WO2005093009A1 Etched dielectric film in microfluidic devices
10/06/2005WO2005092964A1 Flame resistant thermal interface material
10/06/2005WO2005092789A1 Aluminum nitride powder and aluminum nitride sintered compact
10/06/2005WO2005091955A2 Conductive circuits or cables manufactured from conductive loaded resin-based materials
10/06/2005WO2005091941A2 Systems and methods for blocking microwave propagation in parallel plate structures
10/06/2005WO2005091913A2 Midspan patch panel with compensation circuit for data terminal equipment, power insertion and data collection
10/06/2005WO2005091817A2 Method and apparatus for venting an electronic control module
10/06/2005WO2005091811A2 Jettable ink
10/06/2005WO2005091700A2 Shared via decoupling for area arrays components
10/06/2005WO2005074336A3 Multilayered circuit board for high-speed, differential signals
10/06/2005WO2005062414A8 Thin film impedance termination
10/06/2005WO2005048664A3 High temperature circuits
10/06/2005WO2004113594A3 Metal plating of conductive loaded resin-based materials for low cost manufacturing of conductive articles
10/06/2005US20050222306 Vibration-damping engineering plastics
10/06/2005US20050221660 Patch panel with modules
10/06/2005US20050221638 Suppressor device
10/06/2005US20050221637 Dual segment molded lead frame connector for optical transceiver modules
10/06/2005US20050221635 Micro-bumps to enhance lga interconnections
10/06/2005US20050221633 High-density connection between multiple circuit boards
10/06/2005US20050221605 Microelectronic packages including nanocomposite dielectric build-up materials and nanocomposite solder resist
10/06/2005US20050221555 Embedded capacitors using conductor filled vias
10/06/2005US20050221538 Resin encapsulated semiconductor device and the production method
10/06/2005US20050221537 Plastic packaging with high heat dissipation and method for the same
10/06/2005US20050221534 Stress-relief layer and stress-compensation collar in contact arrays, and processes of making same
10/06/2005US20050221103 Polyimide complex sheet
10/06/2005US20050221101 Method of manufacturing laminated material for security tag
10/06/2005US20050221080 polyimide film with a metal layer laminated on one face and an adhesive layer laminated on the other face; printed wiring boards; high heat resistance, wiring patterns with narrow pitches, vias with a small diameter
10/06/2005US20050221068 Multilayer ceramic substrate and method for manufacture thereof
10/06/2005US20050221066 Carrier substrate with a thermochromatic coating
10/06/2005US20050220443 Liquid crystal television device mounted with recording/reproducing device such as a DVD or the like
10/06/2005US20050219830 Patch panel with modules
10/06/2005US20050219829 Printed circuit board and electronic apparatus using the same
10/06/2005US20050219828 Power conversion device frame packaging apparatus and methods
10/06/2005US20050219827 Electrical circuit device
10/06/2005US20050219825 ATCA integrated heatsink and core power distribution mechanism
10/06/2005US20050219774 Method for manufacture of multilayer ceramic substrate and multilayer ceramic substrate
10/06/2005US20050219738 Insulation sheet and disk device provided with the same
10/06/2005US20050219230 Touch panel input device
10/06/2005US20050219215 Optical mouse having image lights source with different colors
10/06/2005US20050219177 Liquid crystal display device
10/06/2005US20050219011 Lowpass filter formed in a multi-layer ceramic
10/06/2005US20050219009 Circuitry module
10/06/2005US20050218524 Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same
10/06/2005US20050218517 Semiconductor flip-chip package and method for the fabrication thereof
10/06/2005US20050218516 Sacrificial component
10/06/2005US20050218513 Semiconductor apparatus, manufacturing method thereof, semiconductor module apparatus using semiconductor apparatus, and wire substrate for semiconductor apparatus
10/06/2005US20050218512 Semiconductor device, electrical inspection method thereof, and electronic apparatus including the semiconductor device
10/06/2005US20050218511 Mounting structure of ball grid array
10/06/2005US20050218506 Non-magnetic, hermetically-sealed micro device package
10/06/2005US20050218505 Multi-substrate circuit assembly
10/06/2005US20050218503 Multilayer wiring board, method for producing the same, and method for producing fiber reinforced resin board
10/06/2005US20050218502 Capacitor-mounted wiring board and method of manufacturing the same
10/06/2005US20050218496 Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same
10/06/2005US20050218491 Circuit component module and method of manufacturing the same
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