Patents for H05K 1 - Printed circuits (98,583)
03/2007
03/15/2007US20070058352 Package structure for an interface card
03/15/2007US20070057908 Electronically addressable microencapsulated ink and display thereof
03/15/2007US20070057857 Wireless Network Card with Antenna Selection Option
03/15/2007US20070057738 Oscillator device and transmission and reception device
03/15/2007US20070056924 Printed wiring board and method for manufacturing the same
03/15/2007US20070056767 Printed wiring board and method for manufacturing the same
03/15/2007US20070056766 Electronic component embedded board and its manufacturing method
03/15/2007US20070056765 Printed circuit board
03/15/2007US20070056764 Transmission line apparatus
03/15/2007US20070056159 Electronic transformer/inductor devices and methods for making same
03/15/2007DE102005044659A1 Generating addressed electrically conducting polymer structures as conducting tracks, component supports involves using mask to produce addressed radiation dose acting on electrically conducting polymer coating to destroy conductivity
03/15/2007DE102005042083A1 Substrate arrangement and production process has thickness of passive components on a substrate surface greater that that of the conductive traces
03/15/2007DE102005041640A1 Modulares mikroelektronisches Bauteil Modular microelectronic components
03/15/2007DE102005038392A1 Verfahren zum Herstellen von ein Muster bildenden Metallstrukturen auf einem Trägersubstrat A method for producing a pattern-forming of metal structures on a carrier substrate
03/15/2007CA2621505A1 3-dimensional multi-layered modular computer architecture
03/15/2007CA2621131A1 Resin composition and hybrid integrated circuit board making use of the same
03/14/2007EP1763295A2 Electronic component embedded board and its manufacturing method
03/14/2007EP1763294A1 Area array routing masks for improved escape of devices on PCB
03/14/2007EP1762582A1 Epoxy resin composition
03/14/2007EP1761951A2 Lead solder indicator and method
03/14/2007EP1761936A2 Electrical multi-layered component having a reliable soldering contact
03/14/2007EP1761934A1 Fabrics with high thermal conductivity coatings
03/14/2007EP1761814A1 Apparatus for electrical and optical interconnection
03/14/2007EP1761380A1 Functional textile structures
03/14/2007EP1346614B1 Guide and support structure
03/14/2007EP0959648B1 Printed wiring board and manufacturing method therefor
03/14/2007CN1930931A 控制设备 Control Equipment
03/14/2007CN1930930A Via transmission lines for multilayer printed circuit boards
03/14/2007CN1930929A Multilayer printed wiring board and test body for printed wiring board
03/14/2007CN1930927A A method of creating solder bar connections on electronic packages
03/14/2007CN1930746A Methods and apparatus for reducing crosstalk in electrical connectors
03/14/2007CN1930738A Maximizing capacitance per unit area while minimizing signal transmission delay in PCB
03/14/2007CN1930696A Production method of circuit board for light emitting body, precursor of circuit board for light emitting body, circuit board for light emitting body, and light emitting body
03/14/2007CN1930684A Component with encapsulation suitable for WLP and production method
03/14/2007CN1930660A Wireless substrate-like sensor
03/14/2007CN1930659A Wireless substrate-like sensor
03/14/2007CN1930658A Wireless substrate-like sensor
03/14/2007CN1930643A Electromagnetic noise suppressing thin film
03/14/2007CN1930638A Metal-containing fine particle, liquid dispersion of metal-containing fine particle, and conductive metal-containing material
03/14/2007CN1930241A Resin molded article with reduced dielectric loss tangent and method of manufacturing thereof
03/14/2007CN1930240A Metal-coated resin molded product and method for producing the same
03/14/2007CN1930223A Flame resistant thermal interface material
03/14/2007CN1930219A Prepreg and metal foil-clad laminate and printed circuit board obtained by using the same
03/14/2007CN1929994A Heat-resistant resin laminated film, multilayer film with metal layer including same, and semiconductor device
03/14/2007CN1929730A Grounding device for reducing electromagnetic interference
03/14/2007CN1929718A Improved electrodes, inner layers, capacitors, electronic devices and methods of making thereof
03/14/2007CN1929717A Lead-type electronic-part-mounted printed circuit board, method of soldering lead-type electronic part and air-conditioner
03/14/2007CN1929716A Polyimide copper foil laminates and method for manufacturing same
03/14/2007CN1929715A Wired circuit board
03/14/2007CN1929714A Screening device for reducing electromagnetic interference
03/14/2007CN1929132A Electronic apparatus
03/14/2007CN1929131A Electronic apparatus
03/14/2007CN1929123A Multilayered wiring substrate and method of manufacturing the same
03/14/2007CN1928675A Circuit member connection structure and liquid crystal display panel
03/14/2007CN1928639A Electro-optical device, electronic apparatus, and interface board
03/14/2007CN1928591A Radiation detection module, printed circuit board, and radiological imaging apparatus
03/14/2007CN1305360C Method and device for searching standard and method for detecting standard position
03/14/2007CN1305356C Wiring base material, electrical equipment and switching device possessing the same
03/14/2007CN1305355C Rolled copper foil for making flexible printed circuit board and its production method
03/14/2007CN1305354C High speed differential signal edge card connector and circuit board layouts therefor
03/14/2007CN1305338C Cover pivoted mobile communication terminal
03/14/2007CN1305181C Connecting component
03/14/2007CN1305038C Optical pick up apparatus
03/14/2007CN1305004C IC card and manufacturing method thereof
03/14/2007CN1304681C Collecting agent for glass fiber yarn and glass fiber yarn using the same
03/14/2007CN1304460C Polyamideimide resin, method for producing polyamideimide resin, polyamideimide resin composition, film-forming material and adhesive for electronic parts
03/14/2007CN1304196C Laminar composition and method for preparing the same
03/13/2007US7190970 Multiplexer
03/13/2007US7190594 Next high frequency improvement by using frequency dependent effective capacitance
03/13/2007US7190592 Integrated library core for embedded passive components and method for forming electronic device thereon
03/13/2007US7190556 Method for suppressing tribocharge in the assembly of magnetic heads
03/13/2007US7190404 Solid state imaging apparatus
03/13/2007US7190243 Waveguide coupler
03/13/2007US7190069 Method and system of tape automated bonding
03/13/2007US7189929 Flexible circuit with cover layer
03/13/2007US7189927 Electronic component with bump electrodes, and manufacturing method thereof
03/13/2007US7189669 Dielectric ceramic material and multilayer ceramic substrate
03/13/2007US7189630 Layer sequence for producing a composite material for electromechanical components
03/13/2007US7189600 Methods for fabricating stiffeners for flexible substrates
03/13/2007US7189593 Elimination of RDL using tape base flip chip on flex for die stacking
03/13/2007US7189449 Metal/ceramic bonding substrate and method for producing same
03/13/2007US7189343 Use of conductor compositions in electronic circuits
03/13/2007US7189302 Multi-layer printed circuit board and fabricating method thereof
03/13/2007US7189082 Electrical connection box
03/13/2007US7189081 Method of mounting terminal and terminal mounting structure
03/13/2007US7189079 Electro-formed ring interconnection system
03/13/2007US7188414 Method of assembling a flat electrical cable
03/13/2007US7188412 Method for manufacturing printed wiring board
03/13/2007US7188410 Insertion of electrical component within a via of a printed circuit board
03/13/2007US7188408 Method of making a straddle mount connector
03/08/2007WO2007027884A2 System and method for shielded coaxial cable attachment
03/08/2007WO2007027604A1 Polyester flex circuit constructions and fabrication methods for ink-resistant flex circuits used in ink jet printing
03/08/2007WO2007026812A1 Conductive paste and wiring board using same
03/08/2007WO2007026601A1 Optical waveguide film, method for manufacturing the film, optoelectrical hybrid film including the waveguide film, and electronic device
03/08/2007WO2007026174A2 Method of printing
03/08/2007WO2007025753A2 Modular microelectronic component
03/08/2007WO2006009850A3 Semiconductor assembly having substrate with electroplated contact pads
03/08/2007US20070055041 Novel phenolic resins
03/08/2007US20070054517 Wiring structure using flexible printed circuit board and optical module using the same
03/08/2007US20070054510 System and method for shielded coaxial cable attachment