| Patents for H05K 1 - Printed circuits (98,583) |
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| 04/25/2007 | CN1953640A A glueless soft circuit substrate |
| 04/25/2007 | CN1953639A A wiring structure and method to reduce the far-end cross talk between parallel signal circuits |
| 04/25/2007 | CN1953169A Power core devices and methods of making thereof |
| 04/25/2007 | CN1953151A Underlay embedded passive device |
| 04/25/2007 | CN1952653A Disposable whole blood uric acid testing electrode indicator bar and manufacturing method thereof |
| 04/25/2007 | CN1312966C Method for mutually connecting multolayer printed circuit board |
| 04/25/2007 | CN1312965C Wiring layer of silver or silver alloy, mfg. method thereof and display screen substrate therewith |
| 04/25/2007 | CN1312764C Electronic component device and producing method thereof |
| 04/25/2007 | CN1312763C Structure for constructing and installing chip embedded typed semiconductor components |
| 04/25/2007 | CN1312626C Method for producing an electrical circuit |
| 04/25/2007 | CN1312553C Connector receptacle |
| 04/25/2007 | CN1312533C Etching method and method for mfg circuit device thereby |
| 04/25/2007 | CN1311914C Silicone resin based composites interleaved for improved toughness |
| 04/24/2007 | US7209368 Circuitized substrate with signal wire shielding, electrical assembly utilizing same and method of making |
| 04/24/2007 | US7209367 Electronic apparatus and method for manufacturing the same |
| 04/24/2007 | US7209366 Delivery regions for power, ground and I/O signal paths in an IC package |
| 04/24/2007 | US7209362 Multilayer ceramic substrate with a cavity |
| 04/24/2007 | US7209361 Electronic device |
| 04/24/2007 | US7209354 Ball grid array package with heat sink device |
| 04/24/2007 | US7208966 Contact probe, measuring pad used for the contact probe, and method of manufacturing the contact probe |
| 04/24/2007 | US7208841 Semiconductor device with strain relieving bump design |
| 04/24/2007 | US7208833 Electronic circuit device having circuit board electrically connected to semiconductor element via metallic plate |
| 04/24/2007 | US7208716 Image-generation device, in particular for installation in the roof area or exterior rearview mirror of a motor vehicle |
| 04/24/2007 | US7208539 Mixture with metal salt of a disubstituted phosphinic acid; fireproofing, heat resistance, waterproofing, and adhesives |
| 04/24/2007 | US7208403 Tile-based routing method of a multi-layer circuit board and related structure |
| 04/24/2007 | US7208348 Methods of fabricating a via-in-pad with off-center geometry |
| 04/24/2007 | US7208218 Method of suppressing the oxidation characteristics of nickel |
| 04/24/2007 | US7207691 Light emitting device |
| 04/24/2007 | US7207653 Ink-jet head unit |
| 04/24/2007 | US7207105 Method for producing an integral ceramic circuit board |
| 04/24/2007 | CA2445218C Method for field programming radio frequency identification devices that control remote control devices |
| 04/24/2007 | CA2130004C Rigid-rod polymers |
| 04/19/2007 | WO2007043972A1 Device carrying an integrated circuit/components and method of producing the same |
| 04/19/2007 | WO2007043682A1 Method for producing high dielectric sheet |
| 04/19/2007 | WO2007042963A1 Electronic device or circuit and method for fabricating the same |
| 04/19/2007 | WO2007042497A2 Sensor module |
| 04/19/2007 | WO2005091811A3 Jettable ink |
| 04/19/2007 | US20070089113 Circuit substrate production method and system, substrate used therein, and circuit substrate using the same |
| 04/19/2007 | US20070087593 Structure for monitoring semiconductor polysilicon gate profile |
| 04/19/2007 | US20070087585 Electromagnetic relay |
| 04/19/2007 | US20070087230 Method and apparatus for integrated-circuit battery devices |
| 04/19/2007 | US20070087175 Wired circuit board |
| 04/19/2007 | US20070087122 Semiconductor device, mounting substrate and method of manufacturing mounting substrate, circuit board, and electronic instrument |
| 04/19/2007 | US20070086189 LED Assembly with Vented Circuit Board |
| 04/19/2007 | US20070086188 LED Assembly with Vented Circuit Board |
| 04/19/2007 | US20070086187 LED Assembly with Vented Circuit Board |
| 04/19/2007 | US20070086175 Configurable chassis guidance system and method |
| 04/19/2007 | US20070086174 Module with embedded electronic components |
| 04/19/2007 | US20070085636 Waveguide coupler |
| 04/19/2007 | US20070085635 Waveguide coupler |
| 04/19/2007 | US20070085215 Silicon based optical vias |
| 04/19/2007 | US20070085212 Dielectric composite material |
| 04/19/2007 | US20070085203 Multilayer printed wiring board |
| 04/19/2007 | US20070085194 Dielectric composite material |
| 04/19/2007 | US20070085108 Liquid crystalline polymer and multilayer polymer-based passive signal processing components for rf/wireless multi-band applications |
| 04/19/2007 | US20070084630 Coreless substrate and manufacturing method thereof |
| 04/19/2007 | US20070084629 Low stress conductive polymer bump |
| 04/19/2007 | US20070084628 Stack structure of carrier boards embedded with semiconductor components and method for fabricating the same |
| 04/19/2007 | US20070084575 Composite papyraceous material |
| 04/19/2007 | DE102006046594A1 Electrical switching arrangement used in electrical household appliances or in electric tools comprises a substrate with a metal part having spring clips arranged so that the substrate is held on the metal part |
| 04/19/2007 | DE102006042688A1 Starr-Flexible gedruckte Leiterplatte für gehäuseweise Übereinanderstapelung und Herstellungsverfahren Rigid-Flexible printed circuit board for housing as stacking of and manufacturing processes |
| 04/19/2007 | DE102005048702A1 Electrical arrangement for starter generator, has plate and undercoating arranged such that border path of undercoating runs at distance to that of plate, where undercoating is superimposed on surface of other plate by screen printing |
| 04/19/2007 | DE102005047106A1 Leistungshalbleitermodul The power semiconductor module |
| 04/19/2007 | DE102005037950B3 Simplified construction of microwave circuits in LTCC technology with fewer through holes |
| 04/19/2007 | DE10103807B4 Verdrahtungssubstrat und Prozess zu seiner Herstellung Wiring substrate and process for its manufacture |
| 04/18/2007 | EP1776003A2 Component support with conductor structure |
| 04/18/2007 | EP1776002A1 Hybrid electronic component and method for manufacturing the same |
| 04/18/2007 | EP1776001A2 Printed wiring board and manufacturing method therefor |
| 04/18/2007 | EP1775765A1 Multilayer dielectric substrate and semiconductor package |
| 04/18/2007 | EP1775761A1 Through substrate and interposer, and method for manufacturing through substrate |
| 04/18/2007 | EP1775734A2 Electrically conductive composition, electrically conductive coating and electrically conductive coating formation method |
| 04/18/2007 | EP1774453A2 System and method for mounting an image capture device on a flexible substrate |
| 04/18/2007 | EP1773928A2 Ethoxysilane containing fiberglass binder |
| 04/18/2007 | EP1639869B1 Printed circuit board |
| 04/18/2007 | EP1543558A4 Radio frequency identificaton device and method |
| 04/18/2007 | EP1483722B1 Memory module assembly using partially defective chips |
| 04/18/2007 | EP1468042B1 Material for the production of functional elements comprising at least one foamable area and use of said functional elements for positioning and mounting objects |
| 04/18/2007 | EP1247343B1 A slanted connector |
| 04/18/2007 | EP1119111B1 Isolator with built-in power amplifier |
| 04/18/2007 | CN2891585Y Circuit board and locking parts on it |
| 04/18/2007 | CN2891584Y Fastener |
| 04/18/2007 | CN2891583Y Improved circuit board structure |
| 04/18/2007 | CN1951161A Shared via decoupling for area arrays components |
| 04/18/2007 | CN1951160A Method for the production of circuit boards and/or corresponding constructs |
| 04/18/2007 | CN1950837A Polymeric film substrate for use in radio-frequency responsive tags |
| 04/18/2007 | CN1950163A Colloidal solution of fine metal particles, electroconductive pasty material, electroconductive ink material and method for producting them |
| 04/18/2007 | CN1950162A Flaky copper powder, process for producing the same, and conductive paste |
| 04/18/2007 | CN1949953A Wiring method for printed circuitboard and printed circuitboard |
| 04/18/2007 | CN1949952A Multilayered wiring board, semiconductor device in which multilayered wiring board is used, and method for manufacturing the same |
| 04/18/2007 | CN1949951A Flexible substrate capable of preventing pin from breaking |
| 04/18/2007 | CN1949950A Composite dielectric composition having small variation of capacitance with temperature and signal-matching embedded capacitor prepared using the same |
| 04/18/2007 | CN1949500A Wiring board, semiconductor device, and method for manufacturing the same |
| 04/18/2007 | CN1949498A Void-free circuit board and semiconductor package having the same |
| 04/18/2007 | CN1949421A Method of manufacturing thin flim capacitor and printed circuit board embedded capacitor |
| 04/18/2007 | CN1949420A Method of producing ceramic laminates, laminate electronic components and manufacturing method thereof |
| 04/18/2007 | CN1311723C Holding/convey jig and holding/convey method |
| 04/18/2007 | CN1311721C Circuit board comprising a contact sleeve that is mounted thereon |
| 04/18/2007 | CN1311720C Method for forming image on object surface including circuit substrate |
| 04/18/2007 | CN1311719C Printed wiring board and production method thereof |
| 04/18/2007 | CN1311718C Anti-alter multilayer board and its design device and method |