| Patents for H05K 1 - Printed circuits (98,583) |
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| 03/29/2007 | US20070069355 Package with barrier wall and method for manufacturing the same |
| 03/29/2007 | US20070069183 Composition, image-forming method employing the composition, and method for forming electroconductive pattern |
| 03/29/2007 | US20070068701 Air trapped circuit board test pad via |
| 03/29/2007 | US20070068700 Electric contact and method for producing the same and connector using the electric contacts |
| 03/29/2007 | US20070068699 AC coupling of power plane sections using improved capacitance stitching material |
| 03/29/2007 | US20070068218 Data capturing and processing system for a roller bearing and roller bearing with such system |
| 03/29/2007 | US20070067987 Printed circuit board with improved cooling of electrical component |
| 03/29/2007 | DE112005000245T5 Schaltkreismodul Circuit module |
| 03/29/2007 | DE102005044059A1 Gehäuse, insbesondere Kunststoffgehäuse, mit einem Halter und einem Kontaktelement Housing, in particular plastic housing, with a holder and a contact element |
| 03/29/2007 | DE10148550B4 Verfahren zum Herstellen von Metall-Keramik-Verbundmaterialien, insbesondere Metall-Keramik-Substraten A method for producing metal-ceramic composite materials, in particular metal-ceramic substrates |
| 03/28/2007 | EP1768474A1 Printed circuit board and manufacturing method thereof |
| 03/28/2007 | EP1768472A2 Connection structure between plurality of boards of portable terminal |
| 03/28/2007 | EP1768471A1 Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board |
| 03/28/2007 | EP1768470A1 Flex-rigid wiring board and manufacturing method thereof |
| 03/28/2007 | EP1767076A1 Housing for an electronic circuit |
| 03/28/2007 | EP1767073A1 Improved electronic device and method of forming an electronic device |
| 03/28/2007 | EP1766675A1 Method of manufacture of electronic or functional devices |
| 03/28/2007 | EP1766672A2 Parylene-based flexible multi-electrode arrays for neuronal stimulation and recording and methods for manufacturing the same |
| 03/28/2007 | EP1766467A1 Display device using printed circuit board as substrate of display panel |
| 03/28/2007 | EP1766427A1 Substrate with patterned conductive layer |
| 03/28/2007 | EP1766424A1 Non-intrusive power monitor |
| 03/28/2007 | EP1704759B1 Nozzle arrangement and method for processing a material for processing with a processing medium |
| 03/28/2007 | EP1665910B1 Mechanism for disabling an electronic assembly |
| 03/28/2007 | EP1265946B1 Poly(phenylene ether) - polyvinyl thermosetting resin |
| 03/28/2007 | CN2884806Y Radiation module structure of circuit board |
| 03/28/2007 | CN2884798Y Buckling means |
| 03/28/2007 | CN2884793Y Breaking-proof earthing elastic piece |
| 03/28/2007 | CN2884792Y Structure for replacing bad units in printed circuit board |
| 03/28/2007 | CN2884791Y Circuit board preventing electronic assembly from skew |
| 03/28/2007 | CN2884790Y Electrostatic protector of circuit board |
| 03/28/2007 | CN1939104A Rigid-flexible board and manufacturing method thereof |
| 03/28/2007 | CN1939103A Magnetically differential input |
| 03/28/2007 | CN1939102A Carrier substrate with a thermochromatic coating |
| 03/28/2007 | CN1939101A Circuit board, its manufacturing method, and joint box using circuit board |
| 03/28/2007 | CN1938852A Semiconductor package security features using thermochromatic inks and three-dimensional identification coding |
| 03/28/2007 | CN1938850A Optimized power delivery to high speed, high pin-count devices |
| 03/28/2007 | CN1938849A Microelectronic packages including nanocomposite dielectric build-up materials and nanocomposite solder resist |
| 03/28/2007 | CN1938799A Embedded capacitors using conductor filled vias |
| 03/28/2007 | CN1938777A Laminate for hdd suspension and process for producing the same |
| 03/28/2007 | CN1938707A Integrated power supply system ananyzing system, integrated power supply system ananyzing method, and multilayer printed circuit board |
| 03/28/2007 | CN1938456A Copper foil and its manufacturing method |
| 03/28/2007 | CN1938380A Thermosetting resin composition and multilayered printed wiring board comprising the same |
| 03/28/2007 | CN1938357A Thermosetting resin composition, laminated body using it, and circuit board |
| 03/28/2007 | CN1938221A Aluminum nitride powder and aluminum nitride sintered compact |
| 03/28/2007 | CN1937902A Cooling structure of heating element |
| 03/28/2007 | CN1937892A Multi-layered wiring board, fabricating method, electronic device and electronic instrument |
| 03/28/2007 | CN1937890A Method for manufacturing soft-hard composite board |
| 03/28/2007 | CN1937889A Method for manufacturing flexible circuit board |
| 03/28/2007 | CN1937888A Method for continuously producing flexible printed circuit board |
| 03/28/2007 | CN1937887A Structure and method for reducing warp of substrate |
| 03/28/2007 | CN1937886A High-layer circuit board and its manufacturing method |
| 03/28/2007 | CN1937885A Radiating type printed circuit board and its manufacturing process |
| 03/28/2007 | CN1937884A Embedded capacitor device having a common coupling area |
| 03/28/2007 | CN1937883A Light-emitting diode positioning device |
| 03/28/2007 | CN1937306A Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package |
| 03/28/2007 | CN1937055A Circuit board assembly |
| 03/28/2007 | CN1935896A Epoxy vesin complex and its use |
| 03/28/2007 | CN1307855C Tombstoning structures and methods of manufacture |
| 03/28/2007 | CN1307776C Power source system for microprocessor |
| 03/28/2007 | CN1307715C Using the wave soldering process to attach motherboard chipset heat sinks |
| 03/28/2007 | CN1307698C Device having resin package and method of producing the same |
| 03/28/2007 | CN1307658C Coil electric conductor, laminated coil conductor, production method of the same and electronic component using the same |
| 03/28/2007 | CN1307653C Current-carrying electronic component and method of manufacturing same |
| 03/28/2007 | CN1307650C Conductor compositions and use thereof |
| 03/28/2007 | CN1307233C Planarized microelectronic substrates |
| 03/28/2007 | CN1307124C Thick film conductor compositions for use on aluminum nitride substrates |
| 03/28/2007 | CN1307117C Glass ceramic mass and use thereof |
| 03/27/2007 | US7197202 Optical printed circuit board for long-distance signal transmission |
| 03/27/2007 | US7196909 AC coupling circuit having a large capacitance and a good frequency response |
| 03/27/2007 | US7196908 Dual pitch contact pad footprint for flip-chip chips and modules |
| 03/27/2007 | US7196898 Thin film capacitor, high-density packaging substrate incorporating thin film capacitor, and method for manufacturing thin-film capacitor |
| 03/27/2007 | US7196836 Rearview assembly having an integral crush zone |
| 03/27/2007 | US7196738 Tuner integrated circuit and television tuner using the same circuit |
| 03/27/2007 | US7196698 Display apparatus and assembly of its driving circuit |
| 03/27/2007 | US7196459 Light emitting assembly with heat dissipating support |
| 03/27/2007 | US7196426 Multilayered substrate for semiconductor device |
| 03/27/2007 | US7196275 EMI shield that adheres to and conforms with printed circuit board surfaces |
| 03/27/2007 | US7196274 Multi-layer integrated RF/IF circuit board |
| 03/27/2007 | US7195682 Method and apparatus for determining processing size of bonding material |
| 03/27/2007 | US7195403 Pluggable optical transceiver with highly shielded structure |
| 03/27/2007 | US7194801 Thin-film battery having ultra-thin electrolyte and associated method |
| 03/27/2007 | CA2381403C Method for manufacturing aluminum nitride sintered body in which via hole is made |
| 03/22/2007 | WO2007032463A1 Adhesive composition, adhesive sheet using same, and use of those |
| 03/22/2007 | WO2007032424A1 Resin composition, sheet-like formed body, prepreg, cured body, laminate, and multilayer laminate |
| 03/22/2007 | WO2007032222A1 Electroless plating catalyst for printed wiring board having through hole, and printed wiring board having through hole processed by using such catalyst |
| 03/22/2007 | WO2007032213A1 Printed circuit board, and semiconductor package |
| 03/22/2007 | WO2007032087A1 Mobile terminal device |
| 03/22/2007 | WO2006125947A3 Improved printed circuit board assembly |
| 03/22/2007 | US20070066098 Printed circuit card connector |
| 03/22/2007 | US20070066097 Fuse connnection box |
| 03/22/2007 | US20070066096 Hidden deck clip and hidden deck system |
| 03/22/2007 | US20070066095 Switch device |
| 03/22/2007 | US20070066093 Assembly of a mobile objective above an optical sensor |
| 03/22/2007 | US20070066092 Connecting component |
| 03/22/2007 | US20070066090 Wiring board, process for producing the same polyimide film for use in the wiring board, and etchant for use in the process |
| 03/22/2007 | US20070066089 Micro security digital card |
| 03/22/2007 | US20070066078 Method of producing a substrate having areas of different hydrophilicity and/or oleophilicity on the same surface |
| 03/22/2007 | US20070065956 Contact probe, measuring pad used for the contact probe, and method of manufacturing the contact probe |
| 03/22/2007 | US20070065647 Hot pressing ceramic distortion control |
| 03/22/2007 | US20070064346 Wireless suspension design to accommodate multiple drive designs |