| Patents for H05K 1 - Printed circuits (98,583) |
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| 01/18/2007 | US20070015309 Electronic part manufacturing method |
| 01/18/2007 | US20070014051 Electrical connection between a suspension flexure cable and a head stack assembly flexible circuit |
| 01/18/2007 | US20070013061 System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards |
| 01/18/2007 | US20070013051 Multichip circuit module and method for the production thereof |
| 01/18/2007 | US20070013048 Electronic parts packaging structure and method of manufacturing the same |
| 01/18/2007 | US20070013041 Flexible wiring board and flex-rigid wiring board |
| 01/18/2007 | US20070012476 Circuit board with plating bar |
| 01/18/2007 | US20070012475 Rigid-flex wiring board and method for producing same |
| 01/18/2007 | DE112005000559T5 Vorrichtung zur Maximierung der Kapazität pro Flächeneinheit bei gleichzeitiger Minimierung der Signalverzögerung in Leiterplatten An apparatus for maximizing the capacitance per unit area while minimizing signal delay in the printed circuit boards |
| 01/18/2007 | DE112005000522T5 Platinen-Herstellungsverfahren und Platine PCB manufacturing process and board |
| 01/18/2007 | DE10343578B4 Umverdrahtungssubstratstreifen mit mehreren Halbleiterbauteilpositionen und Verfahren zu seiner Herstellung Rewiring substrate strip with a plurality of semiconductor device positions and process for its preparation |
| 01/18/2007 | DE102005033218A1 Dreidimensionale Schaltung Three-dimensional circuit |
| 01/18/2007 | DE102005032804A1 Multilayer structure for electronic circuit, especially circuit board, has conductively formed metallic conductor arranged on part of printed conductor elements |
| 01/18/2007 | DE102004045896B4 Transponder mit Antenne und Flip-Chip-Modul und Verfahren zu dessen Herstellung Transponder with antenna and flip chip module and method of producing the |
| 01/18/2007 | DE102004023688B4 Verfahren zur Bestückung einer flexiblen Leiterplatte Method for mounting a flexible printed circuit board |
| 01/18/2007 | DE10196914B4 Elektromagnetischer Koppler An electromagnetic coupler |
| 01/17/2007 | EP1744609A2 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
| 01/17/2007 | EP1744606A2 Printed circuit board and method for producing the printed circuit board |
| 01/17/2007 | EP1744605A2 Electronic board and manufacturing method thereof, electro-optical device, and electronic apparatus |
| 01/17/2007 | EP1744604A1 Amplifier with feedback bridge |
| 01/17/2007 | EP1744362A2 Semiconductor device and electronic apparatus |
| 01/17/2007 | EP1744327A1 High thermal cycle conductor system |
| 01/17/2007 | EP1744210A2 Positioning a flexible printed circuit board in a mobile telecommunication terminal |
| 01/17/2007 | EP1743399A2 A method to build robust mechanical structures on substrate surfaces |
| 01/17/2007 | EP1743396A2 Broadband balance-to-unbalance transformer |
| 01/17/2007 | EP1743159A1 Method of assessing the risk of whiskers appearing on the surface of a metallic deposit |
| 01/17/2007 | EP1652281B1 Device for the protection of electronic modules against short circuits in a multivoltage on-board electrical wiring system |
| 01/17/2007 | EP1142849B1 Silicon nitride composite substrate |
| 01/17/2007 | CN2859997Y Fixing structure for data-storage device |
| 01/17/2007 | CN2859996Y Circuit board prevents electromagnetic coupling among lines |
| 01/17/2007 | CN1899005A Ceramic substrate with chip type electronic component mounted thereon and process for manufacturing the same |
| 01/17/2007 | CN1899002A Printed-circuit board, its manufacturing method and circuit device |
| 01/17/2007 | CN1898795A An integrated circuit package substrate having a thin film capacitor structure |
| 01/17/2007 | CN1898764A Connecting structure and connecting method of circuit |
| 01/17/2007 | CN1898308A Polyimide film |
| 01/17/2007 | CN1898299A Polyamide acid resin having unsaturated group, photosensitive resin composition using same, and cured product thereof |
| 01/17/2007 | CN1898298A Aromatic polyamic acid and polyimide |
| 01/17/2007 | CN1898223A Epoxy compound and epoxy resin cured product obtained by curing the epoxy compound |
| 01/17/2007 | CN1897796A Production of multi-layer circuit board of built-in passive assembly |
| 01/17/2007 | CN1897792A Printing circuit board |
| 01/17/2007 | CN1897789A Semiconductor device |
| 01/17/2007 | CN1897788A Reinforced film for flexible printing circuit board |
| 01/17/2007 | CN1897787A Circuit board assembly and method for producing the same |
| 01/17/2007 | CN1897358A Connector device,circuit board for installing the connector and electronic apparatus containing the said electronic board |
| 01/17/2007 | CN1897264A Package substrate |
| 01/17/2007 | CN1897203A Surface-adhered fuse with bi-circuit construction and its production |
| 01/17/2007 | CN1896811A Flexible printed circuit and display device using the same |
| 01/17/2007 | CN1295951C Electromagnetically shielded circuit device and shielding method therefor |
| 01/17/2007 | CN1295948C Empty-core coil adopting printed circuit board structure |
| 01/17/2007 | CN1295947C Electronic component, component mounting equipment, and component mounting method |
| 01/17/2007 | CN1295861C Piezoelectric oscillator and its mfg. method |
| 01/17/2007 | CN1295783C 电子装置 Electronic devices |
| 01/17/2007 | CN1295770C Electronic interconnect devices and methods of making the same and coaxial electrical bonding pad |
| 01/16/2007 | US7164592 Semiconductor device |
| 01/16/2007 | US7164460 Mounting structure for semiconductor device, electro-optical device, and electronic apparatus |
| 01/16/2007 | US7164388 Low cost adjustable RF resonator devices manufactured from conductive loaded resin-based materials |
| 01/16/2007 | US7164281 Circuit board component ambient moisture exposure monitoring |
| 01/16/2007 | US7164198 Multilayered substrate for semiconductor device |
| 01/16/2007 | US7164197 Containing a toughened benzocyclobutene resin and about 50% by weight of an inorganic particulate filler, resin and inorganic particulate filler being compatibilized by means of a silane coupling agent; excellent dielectrical, thermal, and mechanical properties |
| 01/16/2007 | US7164196 Semiconductor device |
| 01/16/2007 | US7164195 Semiconductor device and semiconductor device manufacturing method |
| 01/16/2007 | US7164085 Multilayer wiring board including stacked via structure |
| 01/16/2007 | US7163846 Method for manufacturing circuit devices |
| 01/16/2007 | US7163780 Disposing on a substrate surface a B-staged dielectric matrix comprising dielectric matrix materials and a removable porogen; curing; patterning the dielectric matrix material; depositing a metal layer; removing porogen |
| 01/16/2007 | US7163613 Method of manufacturing a semiconductor device by forming plating layers having differing thicknesses |
| 01/16/2007 | US7163600 manufacturing a material for components that are as thin as possible |
| 01/16/2007 | US7163408 Electrical connector |
| 01/16/2007 | US7163405 Connector assembly apparatus for electronic equipment and method for using same |
| 01/16/2007 | US7162796 Method of making an interposer with contact structures |
| 01/16/2007 | US7162795 Power distribution system with a dedicated power structure and a high performance voltage regulator |
| 01/16/2007 | US7162794 Manufacturing method for multilayer ceramic elements |
| 01/16/2007 | US7162793 Apparatus for clamping printed circuit boards inside an electronic module housing |
| 01/11/2007 | WO2007004660A1 Device with mounted electronic parts, method of producing the same, protection circuit module of secondary battery, and battery package |
| 01/11/2007 | WO2007004579A1 Method for producing ceramic sheet, ceramic substrate using ceramic sheet obtained by such method, and use thereof |
| 01/11/2007 | WO2007003414A1 Multilayer printed circuit board structure comprising an integrated electrical component, and production method therefor |
| 01/11/2007 | WO2007003228A1 Hardware protection system for sensitive electronic-data modules protecting against external manipulations |
| 01/11/2007 | WO2007003227A1 Hardware protection system in the form of deep-drawn printed circuit boards as half-shells |
| 01/11/2007 | WO2007003226A1 Sensor for a hardware protection system for sensitive electronic-data modules protecting against external manipulations |
| 01/11/2007 | WO2007002995A1 Fabrication of electronic components in plastic |
| 01/11/2007 | WO2006118971A3 Generic patterned conductor for customizable electronic devices |
| 01/11/2007 | WO2006007166A3 Device and method of manufacture of an interconnection structure for printed circuit boards |
| 01/11/2007 | WO2006004909A3 Combined electromagnetic and optical communication system |
| 01/11/2007 | WO2005018293A3 Circuit board design |
| 01/11/2007 | US20070010112 Joint connector block |
| 01/11/2007 | US20070010086 Circuit board with a through hole wire and manufacturing method thereof |
| 01/11/2007 | US20070009710 Dimensional stability, heat resistance, chemical resistance (especially alkali resistance), adhesion; for use in prited boards; applyling solution of heat-resistant organic solvent-soluble aromatic polyimide and/or aromatic polyamide-imide to to a metal foil, winding, heat-treating the predried laminate |
| 01/11/2007 | US20070008694 Hard drive connecting device for notebook computer |
| 01/11/2007 | US20070007142 Methods for assembly and sorting of nanostructure-containing materials and related articles |
| 01/11/2007 | US20070007034 Connector-to-pad printed circuit board translator and method of fabrication |
| 01/11/2007 | US20070007033 Circuitized substrate with soler-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate |
| 01/11/2007 | US20070007032 Circuitized substrate with sintered paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same |
| 01/11/2007 | US20070007031 Method for Forming a Circuit Board Via Structure for High Speed Signaling |
| 01/11/2007 | US20070006456 Method for manufacturing circuit board with built-in electronic components |
| 01/11/2007 | DE10220983B4 Sensor für schwach magnetische Felder unter Verwendung der Herstellungstechnik für gedruckte Leiterplatten und Verfahren zum Herstellen eines solchen Sensors Sensor for weak magnetic fields using the manufacturing technology for printed circuit boards and methods for manufacturing of such a sensor |
| 01/11/2007 | DE10220982B4 Sensor für schwach magnetische Felder unter Verwendung der Herstellungstechnik für gedruckte Leiterplatten und Verfahren zum Herstellen eines solchen Sensors Sensor for weak magnetic fields using the manufacturing technology for printed circuit boards and methods for manufacturing of such a sensor |
| 01/11/2007 | DE102005031377A1 Plastics module with surface-applied metal layer, has layer of thermosetting plastic or highly thermally stable thermoplastic applied to module basic body |
| 01/11/2007 | DE102005027276B3 Production process for a stack of at least two base materials comprising printed circuit boards photostructures the boards applies solder stacks and melts with lacquer separating the boards |
| 01/10/2007 | EP1742522A2 Light emitting diode module, backlight assembly and display device provided with the same |
| 01/10/2007 | EP1742521A1 Printed circuit board |
| 01/10/2007 | EP1742520A1 Wiring board, electronic device, and power supply unit |