| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 02/01/2007 | WO2006118908A3 Apertures for signal shaping using ground and signal pth back-drilling |
| 02/01/2007 | WO2006076613A3 Metal nanoparticle compositions |
| 02/01/2007 | WO2005089510A3 Method of forming one or more base structures on an ltcc cofired module |
| 02/01/2007 | US20070027298 Photosetting, thermosetting liquid ink |
| 02/01/2007 | US20070027246 Thermoplastic or thermosetting resin; semiconductive filler (ZnO); and BaTiO3, PbTiO3, PMN-PT, SrTiO3, CaTiO3, or MgTiO3 as a ferroelectric insulator; the mixture is used to produce an embedded capacitor with a high dielectric constant |
| 02/01/2007 | US20070027233 Process for producing modified epoxy resin |
| 02/01/2007 | US20070026710 Electrical connection component |
| 02/01/2007 | US20070026700 Surface mount connector |
| 02/01/2007 | US20070026698 Coaxial plug-and-socket connector having resilient tolerance compensation |
| 02/01/2007 | US20070026697 Interface card with a control chip |
| 02/01/2007 | US20070026678 Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film |
| 02/01/2007 | US20070026196 Laminated electronic component and method for producing the same |
| 02/01/2007 | US20070025667 Connecting a component with an embedded optical fiber |
| 02/01/2007 | US20070025093 Computer enclosure |
| 02/01/2007 | US20070025092 Embedded actives and discrete passives in a cavity within build-up layers |
| 02/01/2007 | US20070025091 Printed wiring board and production method therefor |
| 02/01/2007 | US20070025077 Circuit board, device mounting structure, device mounting method, and electronic apparatus |
| 02/01/2007 | US20070023419 Variable watt density layered heater |
| 02/01/2007 | US20070023388 Conductor composition for use in LTCC photosensitive tape on substrate applications |
| 02/01/2007 | US20070023202 Circuit board and circuit apparatus using the same |
| 02/01/2007 | US20070022590 Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same |
| 02/01/2007 | DE202006016542U1 Releasable bare chip module is fitted on substrate with printed circuit and one or more setting frames, each with inner rubber spring connector |
| 02/01/2007 | DE19718029B4 Elektrisches Verbindungssystem An electrical interconnect system |
| 02/01/2007 | DE10325550B4 Elektrisches Kontaktierungsverfahren Electrical contacting methods |
| 02/01/2007 | DE102005049858B3 Multilayer circuit-board for communication terminals, has one or more transparent layers joined to one or more decoupling points |
| 02/01/2007 | DE102005035809A1 Electronic module is formed by mounting of wired sensor onto a ceramic circuit plate carrying a control module |
| 02/01/2007 | DE102005035102A1 Elektrisch leitende Verbindung und Verfahren zum Herstellen einer solchen Electrically conductive connection and methods for producing such |
| 02/01/2007 | DE102005032422A1 Anordnung aus Träger und supraleitendem Film, Vortexdiode, umfassend eine derartige Anordnung sowie Verwendung von Vortexdioden für Filter Arrangement of carrier and superconducting film, vortex diode comprising such an arrangement and use of vortex diodes for filters |
| 02/01/2007 | DE102005015656B4 Verfahren zum elektrischen Verbinden von RFID-Chipmodulen mit RFID-Antennen und Transpondern A method of electrically connecting the RFID chip modules with RFID transponders and antennas |
| 02/01/2007 | DE102004055616B4 Verfahren zum Verbinden einer Modulbrücke mit einem Substrat und mehrschichtiger Transponder Method for connecting a bridge module comprising a substrate and multilayered transponder |
| 02/01/2007 | CA2616793A1 Bending-type rigid printed wiring board and process for producing the same |
| 01/31/2007 | EP1748381A1 Installation for production of electronic modules or circuit boards comprising RFID-chips |
| 01/31/2007 | EP1748347A2 Computer system and computer slot module |
| 01/31/2007 | EP1748092A1 Copper foil and its manufacturing method |
| 01/31/2007 | EP1747830A1 Flaky copper powder, process for producing the same, and conductive paste |
| 01/31/2007 | EP1747704A1 Printed wiring board, manufacturing method and electronic device |
| 01/31/2007 | EP1747438A1 Temperature sensor and temperature monitoring device |
| 01/31/2007 | CN2865191Y Fixing member for function board |
| 01/31/2007 | CN2865190Y Bond device for circuit board |
| 01/31/2007 | CN1906988A Device for the vibration-proof mounting of electric special components and/or electric circuits |
| 01/31/2007 | CN1906984A Printed circuit board, a printed circuit assembly and electronic apparatus |
| 01/31/2007 | CN1906816A Inductive and capacitive coupling balancing electrical connector |
| 01/31/2007 | CN1906799A Coupler resource module |
| 01/31/2007 | CN1906797A Triangular conforming transmission structure |
| 01/31/2007 | CN1906651A Electronic circuit wire and display device |
| 01/31/2007 | CN1906566A Acoustic wave touch detecting apparatus |
| 01/31/2007 | CN1906526A Method for gravure printing transparent electrodes, and ink composition therefor |
| 01/31/2007 | CN1906367A Faade covering |
| 01/31/2007 | CN1906265A Circuit connection material, film-shaped circuit connection material using the same, circuit member connection structure, and manufacturing method thereof |
| 01/31/2007 | CN1906234A Polymer composite formed article, printed wiring board using the formed article and method for producing them |
| 01/31/2007 | CN1906027A Continuous production method for both-sided conductor polyimide laminate |
| 01/31/2007 | CN1905779A Circuitboard and method for preventing crystal oscillator electromagnetic interference on circuitaboard |
| 01/31/2007 | CN1905778A Circuit substrate structure |
| 01/31/2007 | CN1905200A Wiring base plate and making method, electro-optic device and method of manufacturing same, electronic device and making method |
| 01/31/2007 | CN1905183A TAB tape carrier |
| 01/31/2007 | CN1905182A Circuit base board, mounting structure for semiconductor device with bumps, and electro-optic device |
| 01/31/2007 | CN1298203C Circuit apparatus |
| 01/31/2007 | CN1298202C Electrostatic discharge protecting conductor |
| 01/31/2007 | CN1298201C Electrostatic protection structure on circuit board and method thereof |
| 01/31/2007 | CN1298113C Monolithic direct converting transceiver and producing method thereof |
| 01/31/2007 | CN1298083C Electrical connector housing |
| 01/31/2007 | CN1298082C 图像传感器模块 The image sensor module |
| 01/31/2007 | CN1298033C Anisotropic conductive adhesive, assembling method, and electrooptical device module |
| 01/31/2007 | CN1297996C Method for manufacturing ceramic green sheet and method for manufacturing electronic part using that ceramic green sheet |
| 01/31/2007 | CN1297852C Photosensitive ceramics composition and method for making multi-layer substrate using it |
| 01/30/2007 | US7170757 Field changeable graphics system for a computing device |
| 01/30/2007 | US7170756 Trimming electrical parameters in a power supply switching regulator electrical circuit |
| 01/30/2007 | US7170754 SDIO memory and interface card |
| 01/30/2007 | US7170753 Interface enhancement for modular platform applications |
| 01/30/2007 | US7170314 Multiple channel modules and bus systems using same |
| 01/30/2007 | US7170183 Wafer level stacked package |
| 01/30/2007 | US7170165 Circuit board assembly with a brace surrounding a ball-grid array device |
| 01/30/2007 | US7170012 Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus |
| 01/30/2007 | US7170011 System and method for modifying electrical characteristics |
| 01/30/2007 | US7169646 Interconnect assemblies and methods |
| 01/30/2007 | US7169640 Card manufacturing technique and resulting card |
| 01/30/2007 | US7169331 decreases the warp of the ceramic multilayer substrate; comprises a copper powder coated with a first metal oxide having a melting point exceeding the melting point of copper |
| 01/30/2007 | US7169330 Composition of conductive paste |
| 01/30/2007 | US7169327 Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof |
| 01/30/2007 | US7169195 Capacitor, circuit board with built-in capacitor and method of manufacturing the same |
| 01/30/2007 | US7168961 Expansible interface for modularized printed circuit boards |
| 01/30/2007 | US7168960 Connecting mechanism |
| 01/30/2007 | US7168164 Methods for forming via shielding |
| 01/30/2007 | US7168154 Method of constructing an integrated lead suspension |
| 01/25/2007 | WO2007010932A1 Polyamide resin, epoxy resin compositions, and cured articles thereof |
| 01/25/2007 | WO2007010758A1 Wiring board, wiring material, copper-clad laminate, and wiring board fabrication method |
| 01/25/2007 | WO2007010684A1 Composite porous resin base material and method for manufacturing same |
| 01/25/2007 | WO2007009639A1 Method for producing a three-dimensional circuit |
| 01/25/2007 | WO2007009510A1 Method for applying electrical conductor patterns to a target component of plastic |
| 01/25/2007 | WO2005115068A3 High density interconnect system having rapid fabrication cycle |
| 01/25/2007 | US20070021787 Biocompatible bonding method and electronics package suitable for implantation |
| 01/25/2007 | US20070020971 Housing of circuit boards |
| 01/25/2007 | US20070020969 Solenoid antenna |
| 01/25/2007 | US20070020968 Electrical junction box |
| 01/25/2007 | US20070020962 Connecting element and circuit connecting device using the connecting element |
| 01/25/2007 | US20070020959 Circuit board including jacks |
| 01/25/2007 | US20070019352 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| 01/25/2007 | US20070019333 Wireless suspension design to accommodate multiple drive designs |
| 01/25/2007 | US20070018771 Inductive-system |
| 01/25/2007 | US20070018757 Systems and methods for blocking microwave propagation in parallel plate structures utilizing cluster vias |