Patents for H05K 1 - Printed circuits (98,583)
02/2007
02/13/2007US7176154 Ceramic composition and ceramic wiring board
02/13/2007US7176152 Mae of barium oxide, silicon and boron oxides, and titanium oxide as first glass components, zinc oxide, silicon and boron oxides as second glass components; and copper; applying above paste to the substarte, firing to form a thick film of desirable properties, such as good rheology
02/13/2007US7176131 Electronic component having at least one semiconductor chip and flip-chip contacts, and method for producing the same
02/13/2007US7176063 High density 3-D integrated circuit package
02/13/2007US7176057 Power module comprising at least two substrates and method for producing the same
02/13/2007US7176055 Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component
02/13/2007US7176052 Capacitor, circuit board, method of formation of capacitor, and method of production of circuit board
02/13/2007US7175736 Laminate for electronic circuit
02/13/2007US7175305 LED symbol signal
02/13/2007US7174632 Method of manufacturing a double-sided circuit board
02/13/2007US7174627 Method of fabricating known good dies from packaged integrated circuits
02/08/2007WO2007016224A1 Mounting electrical components
02/08/2007WO2007015545A1 Metal-coated polyimide film
02/08/2007WO2007015396A1 Flexible metal-clad laminate plate
02/08/2007WO2007015372A1 Anisotropic conductive film and method for producing same
02/08/2007WO2005022965A3 Expansion constrained die stack
02/08/2007US20070032128 Test socket
02/08/2007US20070032104 Electrical connector
02/08/2007US20070032103 Electronic device housing
02/08/2007US20070032101 Memory Cards Having Two Standard Sets of Contacts
02/08/2007US20070032078 Suspension for filling via holes in silicon and method for making the same
02/08/2007US20070031279 Solder composition for electronic devices
02/08/2007US20070031091 Optical module with flexible substrate
02/08/2007US20070030683 Mounting arrangement for light emitting diodes
02/08/2007US20070030659 Multilayer laminated circuit board
02/08/2007US20070030648 Circuit board, device mounting structure, device mounting method, and electronic apparatus
02/08/2007US20070030107 Fractional turns transformers with ferrite polymer core
02/08/2007US20070029880 Computer power supply and cable
02/08/2007US20070029670 Semiconductor device and radiation detector employing it
02/08/2007US20070029391 Method for producing a contactless ticket and ticket and ticket obtained by means of said method
02/08/2007US20070029109 Multilayer printed wiring board and production method therefor
02/08/2007US20070029108 Printed circuit board and soldering method and apparatus
02/08/2007US20070029107 Wiring board and production method of wiring board
02/08/2007US20070029106 Multilayer printed wiring board
02/08/2007DE202006016626U1 Conducting antenna arrangement used as a radio frequency antenna comprises a plastic film substrate made from polyethylene terephthalate and a conducting antenna made from a conducting material and applied to the surface of the substrate
02/08/2007DE202005015585U1 Fastener attaching printed circuit board to e.g. wall of computer casing, has head and rectangular body passed through rectangular holes, with projecting resilient side tabs
02/08/2007DE202005015466U1 Circuit board system has two parallel circuit boards joined by solder rods engaging in the boards by through openings that form a pattern for connecting an electrical plug
02/07/2007EP1750491A2 System and method for manufacturing flexible copper clad laminate film
02/07/2007EP1750490A1 Cooling of an electronic power device
02/07/2007EP1750417A2 Mobile terminal having camera
02/07/2007EP1749667A1 Printer with temperature sensor
02/07/2007EP1749600A1 Silver powder coated with silver compound and manufacturing method thereof
02/07/2007EP1749310A1 Substrate for electronic application comprising a flexible support and method for production thereof
02/07/2007EP1623369B1 Method for mounting an electronic component on a substrate
02/07/2007EP1430565B1 Wireless terminal
02/07/2007EP1040736B1 Synthetic jet actuators for cooling heated bodies and environments
02/07/2007EP0961809B1 Low temperature method and compositions for producing electrical conductors
02/07/2007CN2867792Y Radiator clamping mechanism
02/07/2007CN2867791Y Element lock with clamping apparatus
02/07/2007CN2867425Y Display card
02/07/2007CN1910972A Nozzle arrangement and method for processing a material for processing with a processing medium
02/07/2007CN1910970A Circuit board and method for mounting chip component
02/07/2007CN1910749A Multilayer ceramic substrate with single via anchored pad and method of forming
02/07/2007CN1910486A Optical wiring board and method for manufacturing optical wiring board
02/07/2007CN1910041A Polyimide metal laminate and circuit substrate
02/07/2007CN1910013A Production method for pattern-worked porous molding or nonwoven fabric, and electric circuit components
02/07/2007CN1909775A Connector unit, circuit assembly, and electronic device
02/07/2007CN1909769A Retaining and connecting device for opto-electronic element
02/07/2007CN1909764A Multi-layer printed circuit board
02/07/2007CN1909763A Multi-layer printed circuit board
02/07/2007CN1909762A Multi-layer printed circuit board
02/07/2007CN1909761A Cabling configuration for transmission line in high-speed printed circuit board
02/07/2007CN1909226A Package substrate
02/07/2007CN1909220A Chip type electric device and liquid crystal display module including the same
02/07/2007CN1909207A Method for forming film pattern, and method for manufacturing device, electro-optical device, electronic apparatus
02/07/2007CN1299546C Use of metallic treatment on copper foil to produce fine lines and replace oxide process in printed circuit board production
02/07/2007CN1299545C Electronic device
02/07/2007CN1299544C Nickel coated copper as electrodes for embedded passive devices
02/07/2007CN1299543C Flexible circuit board
02/07/2007CN1299542C Through hole wiring board
02/07/2007CN1299355C Mfg. tech. of packaged interface substrate wafer having wholly metallized through hole
02/07/2007CN1299325C Substrate element and soft substrate
02/06/2007US7174276 System and method for tracking engineering changes relating to a circuit card
02/06/2007US7173828 Ground pad structure for preventing solder extrusion and semiconductor package having the ground pad structure
02/06/2007US7173827 Printed board and meter unit provided therewith
02/06/2007US7173826 PC card assembly with frame having longitudinal slot
02/06/2007US7173824 Cooled power switching device
02/06/2007US7173817 Front side hot-swap chassis management module
02/06/2007US7173433 Circuit property measurement method
02/06/2007US7173336 Hybrid integrated circuit device
02/06/2007US7173335 Semiconductor apparatus with decoupling capacitor
02/06/2007US7173325 Expansion constrained die stack
02/06/2007US7173322 COF flexible printed wiring board and method of producing the wiring board
02/06/2007US7173193 Method and structure for implementing enhanced interconnection performance of a land grid array (LGA) module and a printed wiring board
02/06/2007US7173192 Position fixing in printed circuit boards
02/06/2007US7172958 High-frequency wiring structure and method for producing the same
02/06/2007US7172818 Copper foil for chip-on-film use, plasma display panel, or high-frequency printed circuit board
02/06/2007US7172469 Structure of bonding plastic part insert-molded with wiring board and method of bonding the same
02/06/2007US7172450 High temperature open ended zero insertion force (ZIF) test socket
02/06/2007US7172439 DVD integrated CRT television and connector fixing structure
02/06/2007US7172436 Circuit board assembling structure
02/06/2007US7172119 Modular architecture sensing and computing platform
02/06/2007US7171897 System and methods for data-driven control of manufacturing processes
02/06/2007US7171746 Process for applying conductor tracks to the surface of plastics moldings
02/01/2007WO2007013595A1 Bending-type rigid printed wiring board and process for producing the same
02/01/2007WO2007013538A1 Inorganic composition
02/01/2007WO2007013365A1 Solder mounting structure, method for manufacturing such solder mounting structure and use of such solder mounting structure
02/01/2007WO2007013344A1 Solder mounting structure, method for manufacturing such solder mounting structure and use of such solder mounting structure
02/01/2007WO2007012833A1 A package for a die
02/01/2007WO2007012514A1 Electrically conductive connection and method for producing the same