| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 05/23/2007 | CN1968565A High density printed circuit board and method of manufacturing the same |
| 05/23/2007 | CN1968564A Printed circuit board with dual type inner structure |
| 05/23/2007 | CN1968298A Fpc and a portable terminal having the fpc |
| 05/23/2007 | CN1967832A Wiring board and semiconductor device using the same |
| 05/23/2007 | CN1967831A Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon |
| 05/23/2007 | CN1967830A Mounting structure and method of electronic component |
| 05/23/2007 | CN1967829A Mounting structure of electronic component |
| 05/23/2007 | CN1317923C A base plate structure having built-in capacitor |
| 05/23/2007 | CN1317922C Wiring circuit board |
| 05/23/2007 | CN1317788C Electronic line embedded cell |
| 05/23/2007 | CN1317785C Adapter type fuel cell and assembling structure thereof |
| 05/23/2007 | CN1317759C Printed circuit board, semiconductor package, base insulating film, and manufacturing method for interconnect substrate |
| 05/23/2007 | CN1317750C Wiring base board and its producing method, semiconductor device and electronic machine |
| 05/23/2007 | CN1317329C Resin composition, prepreg and laminate using the composition |
| 05/23/2007 | CN1317214C Conductive paste and ceramic electronic component |
| 05/22/2007 | US7222243 Power delivery system for a microprocessor |
| 05/22/2007 | US7221868 Camera and photographing lens barrel |
| 05/22/2007 | US7221626 Magneto-optical head and magneto-optical storage device |
| 05/22/2007 | US7221340 Self light emitting type display device |
| 05/22/2007 | US7221244 Localized enhancement of multilayer substrate thickness for high Q RF components |
| 05/22/2007 | US7221066 Energy supply unit for transmitting auxiliary energy to an electrical device |
| 05/22/2007 | US7221050 Substrate having a functionally gradient coefficient of thermal expansion |
| 05/22/2007 | US7221049 Circuit device and manufacturing method thereof |
| 05/22/2007 | US7221048 Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier |
| 05/22/2007 | US7221043 Integrated circuit carrier with recesses |
| 05/22/2007 | US7220922 Electronic component, component mounting equipment, and component mounting method |
| 05/22/2007 | US7220921 Sheet-like board member and method of manufacturing a semiconductor device |
| 05/22/2007 | US7220920 Flexible electrical circuit with slotted coverlay |
| 05/22/2007 | US7220785 Anisotropically conductive adhesive comprising crushable microcapsules adhered to a surface of conductive particles |
| 05/22/2007 | US7220615 Alternative method used to package multimedia card by transfer molding |
| 05/22/2007 | US7220507 Flat panel direct methanol fuel cell and method of making the same |
| 05/22/2007 | US7220490 Polyimide based adhesive compositions useful in flexible circuit applications, and compositions and methods relating thereto |
| 05/22/2007 | US7220485 Bulk high thermal conductivity feedstock and method of making thereof |
| 05/22/2007 | US7220481 High dielectric constant composite material and multilayer wiring board using the same |
| 05/22/2007 | US7220131 Electromechanical device having a plurality of bundles of fibers for interconnecting two planar surfaces |
| 05/22/2007 | US7219845 Electronic device having multilayer printed wiring board and method for manufacturing electronic device |
| 05/22/2007 | US7219843 Optical reader having a plurality of imaging modules |
| 05/22/2007 | US7219826 Method for producing metal/ceramic bonding substrate |
| 05/22/2007 | US7219418 Method to prevent damage to probe card |
| 05/22/2007 | CA2405830C Process for the manufacture of printed circuit boards with plated resistors |
| 05/18/2007 | WO2007056557A1 Methods and devices for providing flexible electronics |
| 05/18/2007 | WO2007056169A2 Electrical connector on a flexible carrier |
| 05/18/2007 | WO2007055871A1 Coaxial cable connector with threaded outer body |
| 05/18/2007 | WO2007055380A1 Led lamp |
| 05/18/2007 | WO2007055223A1 Method for forming metal film and method for forming metal pattern |
| 05/18/2007 | WO2007055091A1 Holding member, packaging structure, and electronic component |
| 05/18/2007 | WO2007055034A1 Connecting structure for circuit board |
| 05/18/2007 | WO2007055027A1 Connecting structure for circuit board |
| 05/18/2007 | WO2007054557A1 Sensor module |
| 05/18/2007 | WO2007054409A1 Electronic circuit arrangement and method for producing an electronic circuit arrangement |
| 05/18/2007 | WO2007053995A1 Atca backboard, hub board connecting with it and system thereof |
| 05/18/2007 | WO2005122695A3 A system for mapping defective printed circuits |
| 05/17/2007 | US20070113305 Electrical device comprising conductors made of carbonized plastic, and method and apparatus for the production thereof |
| 05/17/2007 | US20070111565 Alien next compensation for adjacently placed connectors |
| 05/17/2007 | US20070111563 Connector |
| 05/17/2007 | US20070111562 Circuit Board Manufacturing Technique and Resulting Circuit Board |
| 05/17/2007 | US20070111561 Circuit board and method of manufacture thereof |
| 05/17/2007 | US20070111559 Multiple flexible wiring board, method for producing same, method for producing flexible wiring board, and flexible wiring board |
| 05/17/2007 | US20070111555 Conductor connecting module for printed circuit boards |
| 05/17/2007 | US20070111353 Hybrid microfluidic chip and method for manufacturing same |
| 05/17/2007 | US20070110956 Multilayer ceramic substrate and its production method |
| 05/17/2007 | US20070109748 Adjusting device especially for a throttle valve of an internal combustion engine |
| 05/17/2007 | US20070109709 Internally shielded energy conditioner |
| 05/17/2007 | US20070108588 Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device |
| 05/17/2007 | US20070108584 Transmitter module with improved heat dissipation |
| 05/17/2007 | US20070108424 Conductive pattern forming composition, formation method of conductive pattern and production method of conductive pattern forming composition |
| 05/17/2007 | US20070108423 Made of zinc oxide, silicon and boron oxides, and titanium oxide as first glass components, bismuth oxide, silicon and boron oxides as second glass components; and copper; applying above paste to substrate, firing to form a thick film of desirable properties, such as good rheology |
| 05/17/2007 | US20070108335 System, Method And Apparatus For Optimizing Power Delivery And Signal Routing In Printed Circuit Board Design |
| 05/17/2007 | US20070108295 Packaging structure of mini SD memory card |
| 05/17/2007 | US20070107935 Method and apparatus for electrically connecting printed circuit boards or other panels |
| 05/17/2007 | US20070107934 Printed circuit board using paste bump and manufacturing method thereof |
| 05/17/2007 | US20070107933 Internal conductor connection structure and multilayer substrate |
| 05/17/2007 | US20070107932 Moisture resistant chip package |
| 05/17/2007 | US20070107931 Circuit board |
| 05/17/2007 | US20070107930 Printed circuit board and method for manufacturing the same |
| 05/17/2007 | US20070107213 Methods for trimming electrical parameters in an electrical circuit |
| 05/16/2007 | EP1786249A1 Ceramic substrate with chip type electronic component mounted thereon and process for manufacturing the same |
| 05/16/2007 | EP1786247A2 Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon |
| 05/16/2007 | EP1786246A1 Manufacturing method of a three-dimensional circuit board |
| 05/16/2007 | EP1786078A1 Method of continuously forming an electrical cable |
| 05/16/2007 | EP1786035A2 Circuit arrangement, especially frequency converter |
| 05/16/2007 | EP1784367A2 Lead-free and cadmium-free conductive copper thick film pastes |
| 05/16/2007 | EP1478796B1 Fabric woven with flat glass fibers and production method |
| 05/16/2007 | EP1436142B1 Metal-containing web processed with a continuous etch process |
| 05/16/2007 | CN1965618A Aluminum substrate for printed circuits, manufacturing method thereof, printed circuit board, and manufacturing method thereof |
| 05/16/2007 | CN1965617A Printed wiring board and method for mounting component on the printed wiring board |
| 05/16/2007 | CN1965468A 高电压单元 High voltage unit |
| 05/16/2007 | CN1965263A Display device using printed circuit board as substrate of display panel |
| 05/16/2007 | CN1965227A Method of assessing the risk of whiskers appearing on the surface of a metallic deposit |
| 05/16/2007 | CN1964604A Method of manufacturing multilayer printed wiring board |
| 05/16/2007 | CN1964603A Method of manufacturing multilayer printed wiring board |
| 05/16/2007 | CN1964601A A board stacking method pressed by flexible PCB and its board stacking structure |
| 05/16/2007 | CN1964598A Electronic parts mounting structure |
| 05/16/2007 | CN1964597A Pcb |
| 05/16/2007 | CN1964596A A multilayer PCB and its manufacture method |
| 05/16/2007 | CN1964595A A matching capacitor and PCB using same and impedance matching device |
| 05/16/2007 | CN1964165A Dc无刷电动机 Dc brushless motor |
| 05/16/2007 | CN1964034A An electronic assembly and circuit board for same |
| 05/16/2007 | CN1964006A Method for fabricating a multilayer wiring board, multilayer wiring board, and electronic device using the same |
| 05/16/2007 | CN1962755A Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using same |