| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 01/10/2007 | EP1741323A2 Fusion bonded assembly with attached leads |
| 01/10/2007 | EP1741322A1 Method for the production of circuit boards and/or corresponding constructs |
| 01/10/2007 | EP1741134A2 Stacked module systems and methods |
| 01/10/2007 | EP1741111A1 Compliant electrical contact assembly |
| 01/10/2007 | EP1387367B1 Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof |
| 01/10/2007 | EP1360720A4 Process for the manufacture of printed circuit boards with plated resistors |
| 01/10/2007 | EP1262509B1 Imide-benzoxazole polycondensate and process for producing the same |
| 01/10/2007 | EP1127387B1 Non-circular micro-via |
| 01/10/2007 | EP1044472A4 Multi-chip module having interconnect dies |
| 01/10/2007 | EP0997060B1 High frequencies printed board assembly with improved signal transmission |
| 01/10/2007 | CN2857407Y Locally stiffened flexible circuit board |
| 01/10/2007 | CN2857249Y RF short balanced oscillator small antenna |
| 01/10/2007 | CN1894758A Printed circuit embedded capacitors |
| 01/10/2007 | CN1894588A Systems and methods for connecting electrical components |
| 01/10/2007 | CN1894342A Thermoplastic resin composition, material for substrate and film for substrate |
| 01/10/2007 | CN1894087A Method of producing flexible laminate sheet |
| 01/10/2007 | CN1893790A Plastics module with surface-applied metal layer communicated with electric contact point of electric component |
| 01/10/2007 | CN1893785A 通讯电路模块 Communication circuit module |
| 01/10/2007 | CN1893779A Housing of circuit boards |
| 01/10/2007 | CN1893776A Method for manufacturing circuit board with built-in electronic components |
| 01/10/2007 | CN1893775A Board assembly apparatus having electronic components disposed in a space between circuit boards and a manufacturing method thereof |
| 01/10/2007 | CN1893772A Circuit substrate |
| 01/10/2007 | CN1893769A Drive circuit board and flat display apparatus including the same |
| 01/10/2007 | CN1893768A Electronic equipment and method for mounting electronic component |
| 01/10/2007 | CN1893767A Wired circuit board |
| 01/10/2007 | CN1893766A Multilayer printed wiring board |
| 01/10/2007 | CN1893765A Printed wiring board, solder resist resin composition, and method for manufacturing printed wiring board |
| 01/10/2007 | CN1893764A Composite printed circuit board and electronic apparatus |
| 01/10/2007 | CN1893763A Wiring board, electronic device, and power supply unit |
| 01/10/2007 | CN1893762A Flexible printed circuit board assembly, method for manufacturing the same, and portable terminal comprising the same |
| 01/10/2007 | CN1893054A Printed circuit board |
| 01/10/2007 | CN1892934A Embedded thin layer capacitor, layered structure, and fabrication method of the same |
| 01/10/2007 | CN1892427A Photosensitive thermosetting resin composition, and photosensitive cover lay and flexible printed wiring board using the composition |
| 01/10/2007 | CN1891454A Multi-component ltcc substrate with a core of high dielectric constant ceramic material and processes for the development thereof |
| 01/10/2007 | CN1891453A Resin coated metal foil, metal-clad laminate, printed wiring board using the same, and its manufacturing process |
| 01/10/2007 | CN1294789C Manufacture of printed circuits using single layer processing techniques |
| 01/10/2007 | CN1294788C Method of manufacturing multilayer printed wiring board |
| 01/10/2007 | CN1294601C Mounting structure of two-terminal capacitor and three-terminal capacitor |
| 01/10/2007 | CN1294004C Composite material |
| 01/09/2007 | US7162592 Method for bus capacitance reduction |
| 01/09/2007 | US7162561 Electronic device with card interface |
| 01/09/2007 | US7161821 Apparatus and method for mounting microelectronic devices on a mirrored board assembly |
| 01/09/2007 | US7161810 Stacked chip electronic package having laminate carrier and method of making same |
| 01/09/2007 | US7161371 Module part |
| 01/09/2007 | US7161252 Module component |
| 01/09/2007 | US7161241 Multi-layer board |
| 01/09/2007 | US7161240 Insitu-cooled electrical assemblage |
| 01/09/2007 | US7161238 Structural reinforcement for electronic substrate |
| 01/09/2007 | US7161237 Flip chip packaging using recessed interposer terminals |
| 01/09/2007 | US7161104 Trip-free PCB mountable relay configuration and method |
| 01/09/2007 | US7161090 Element for electromagnetic shielding and method for manufacturing thereof |
| 01/09/2007 | US7161089 Electronic component |
| 01/09/2007 | US7161088 System, method and apparatus for optimizing power delivery and signal routing in printed circuit board design |
| 01/09/2007 | US7160823 comprises borosilicate-based glass containing silicon/aluminum/alkali earth metal oxide; controlled shrinkage while maintaining electrical properties |
| 01/09/2007 | US7160770 Method of manufacturing an electronic component including an inter-line insulating layer and a conductor pattern |
| 01/09/2007 | US7160636 Magnetic grains; axial anisotropy , isotropy; plating in presence of magnetic field |
| 01/09/2007 | US7160623 Peak melting temperature of >/= 320 degrees C. and good mechanical properties |
| 01/09/2007 | US7160612 Multi-component fibers having enhanced reversible thermal properties and methods of manufacturing thereof |
| 01/09/2007 | US7160609 Curable composition, varnish, and layered product |
| 01/09/2007 | US7160476 Method of manufacturing an electronic device |
| 01/09/2007 | US7160428 Plating tank for wire patterns on film carrier; prevent bubble adhesion |
| 01/09/2007 | US7160406 Sintering a stack of layers containing an unsintered ceramic material and a sintering agent with a forcing layer on the top layer; one of the layers contains an increased proportion of sintering agent relative to an adjacent layer; after sintering the forcing layer is removed |
| 01/09/2007 | US7160154 Grouped element transmission channel link termination assemblies |
| 01/09/2007 | US7160105 Temperature controlled vacuum chuck |
| 01/09/2007 | US7160039 Compact optical sub-assembly with integrated flexible circuit |
| 01/09/2007 | US7159754 Apparatus and method for corrective soldering |
| 01/09/2007 | US7159311 Method of making an interposer with contact structures |
| 01/09/2007 | US7159310 Electronic part mounting substrate and method for producing same |
| 01/09/2007 | US7159308 Method of making a circuit board |
| 01/09/2007 | US7159306 Modular rotary anvil |
| 01/09/2007 | CA2176285C Encapsulated anti-shock electronic device |
| 01/04/2007 | WO2007002628A2 Optical transponder module with dual board flexible circuit |
| 01/04/2007 | WO2007002268A1 Electrical interconnection system |
| 01/04/2007 | WO2007002100A1 Passive electrical article |
| 01/04/2007 | WO2007002098A2 Flexible substrate for flex-on-suspension circuit and method of manufacture |
| 01/04/2007 | WO2007001995A1 Dielectric substrate with holes and method of manufacture |
| 01/04/2007 | WO2007001505A2 Die module system and method |
| 01/04/2007 | WO2007000963A1 Process for producing nonflat ceramic substrate |
| 01/04/2007 | WO2007000855A1 Porous resin base, method for manufacturing same, and multilayer substrate |
| 01/04/2007 | WO2006110868A3 Inductor |
| 01/04/2007 | WO2006031206A3 An improved backup board |
| 01/04/2007 | US20070005112 Biocompatible bonding method and electronics package suitable for implantation |
| 01/04/2007 | US20070004249 Central power distributing member for a brushless motor, a brushless motor provided therewith and a method of assembling it |
| 01/04/2007 | US20070004248 Memory card connector system for stabilizing the position of a contacted memory card |
| 01/04/2007 | US20070004242 Socket features for aligning and orienting components |
| 01/04/2007 | US20070004241 High speed active flex cable link |
| 01/04/2007 | US20070004240 System and method for processor power delivery and thermal management |
| 01/04/2007 | US20070004238 Compliant electro-mechanical device |
| 01/04/2007 | US20070004237 Printed circuit board |
| 01/04/2007 | US20070004089 Stacked memory and manufacturing method thereof |
| 01/04/2007 | US20070002599 Circuit board and arrangement for minimizing thermal and electromagnetic effects |
| 01/04/2007 | US20070002551 Printed circuit board assembly |
| 01/04/2007 | US20070002520 Controlled-resistance capacitors, and methods of assembling same |
| 01/04/2007 | US20070002254 Liquid crystal display device |
| 01/04/2007 | US20070001796 Printed circuit board with integrated inductor |
| 01/04/2007 | US20070001300 Semiconductor device |
| 01/04/2007 | US20070000783 Method of forming an electrocoating film, electrocoating film, and electrodeposited article |
| 01/04/2007 | US20070000691 Printed circuit board having vias |
| 01/04/2007 | US20070000690 Printed circuit board assembly and method for preventing EMI of crystal oscillator thereof |
| 01/04/2007 | US20070000689 Printed circuit board |