Patents for H05K 1 - Printed circuits (98,583)
04/2007
04/04/2007CN1943290A Midspan patch panel with compensation circuit for data terminal equipment, power insertion and data collection
04/04/2007CN1943286A Preferential asymmetric through-hole positoning for printed circuit boards
04/04/2007CN1943285A Laminate for wiring board
04/04/2007CN1942629A Aramid paper blend
04/04/2007CN1942502A Epoxy resin composition
04/04/2007CN1942496A Novel phenolic resins
04/04/2007CN1942495A Phenolic resins
04/04/2007CN1942493A Modified polytetrafluoroethylene powder and method for producing tetrafluoroethylene polymer
04/04/2007CN1942310A Process for producing double-sided metal clad laminate and double-sided metal clad laminate produced by the process
04/04/2007CN1942269A Silver powder coated with silver compound and manufacturing method thereof
04/04/2007CN1942080A Cooler of heating component for audio/video device
04/04/2007CN1942060A Method for fastly recovering circuit board, clamping and cutting circuit board block and circuit base plate
04/04/2007CN1942056A Production of flexible circuit board
04/04/2007CN1942054A Multilayer printed wiring board, method of manufacturing multilayer printed wiring board and electronic apparatus
04/04/2007CN1942053A Component-fixing device, and printed circuit board and electronic apparatus with component-fixing device
04/04/2007CN1942052A Circuit assembling structure
04/04/2007CN1942051A Welding disk of printing circuit board
04/04/2007CN1942050A Coated radiating circuit board and its production
04/04/2007CN1942049A Circuit board and method of manufacturing circuit board
04/04/2007CN1942048A Circuit board with verified laminated layer sequence
04/04/2007CN1942047A Printed wiring board and fabrication method for printed wiring board
04/04/2007CN1942046A Alternating micro-vias and through-hole in order to create improved PCB routing channels
04/04/2007CN1942042A Protecting component of electronic circuit
04/04/2007CN1941361A Electronic module having a three dimensional array of carrier-mounted integrated circuit packages
04/04/2007CN1941354A Wiring board
04/04/2007CN1941353A Circuit board, and semiconductor device
04/04/2007CN1941352A Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the same
04/04/2007CN1941347A High-heat conductive efficency circuit board
04/04/2007CN1941346A High-heat conductive efficiency circuit board
04/04/2007CN1941339A Semiconductor IC-embedded substrate and method for manufacturing same
04/04/2007CN1940675A Liquid crystal display device
04/04/2007CN1940145A Nickel plating solution and its preparation method, nickel plating method and printed wiring board copper foil
04/04/2007CN1939612A Plate material cutting method, printed circuit board, and electronic device
04/04/2007CN1309288C Package assembly of electronic apparatus and assembling method thereof
04/04/2007CN1309285C High frequency circuit block member, its manufacturing method, high refrequency module device and its manufacturing method
04/04/2007CN1309284C Electric circuit base board assembling body
04/04/2007CN1309283C Manufacturing method of circuit device
04/04/2007CN1309282C Method for the manufacture of a printed circuit and planar antenna manufactured with this printed circuit
04/04/2007CN1309281C Circuit board and method for manufacturing the same
04/04/2007CN1309271C Electronic component and mobile communicating device using the same
04/04/2007CN1309073C High-density chip carrier and its constituent method
04/04/2007CN1309038C High density area array solder microjoining interconnect structure and fabrication method
04/04/2007CN1308978C Method for making ceramic laminate product, laminate electronic element and making method
04/04/2007CN1308975C Method for manufacturing ceramic green sheet and method for manufacturing electronic part using that ceramic green sheet
04/04/2007CN1308158C Pedalling force testing device
04/04/2007CN1308141C Method for controlling screen printer
04/03/2007USRE39546 Jack including crosstalk compensation for printed circuit board
04/03/2007US7200294 Light-transmitting module capable of heating the light-emitting module and the substrate included therein
04/03/2007US7200293 Reconfigurable optoelectronic circuit
04/03/2007US7200022 Apparatus and method for mounting microelectronic devices on a mirrored board assembly
04/03/2007US7200009 Integrated electromechanical arrangement and method of production
04/03/2007US7199478 Printed circuit board having an improved land structure
04/03/2007US7199476 Electronic device
04/03/2007US7199468 Hybrid integrated circuit device with high melting point brazing material
04/03/2007US7199457 Thin film circuit board device and its manufacturing method
04/03/2007US7199445 Integrated capacitor on packaging substrate
04/03/2007US7199440 Techniques for joining an opto-electronic module to a semiconductor package
04/03/2007US7199329 Method of soldering semiconductor part and mounted structure of semiconductor part
04/03/2007US7199309 Structure for repairing or modifying surface connections on circuit boards
04/03/2007US7199308 Multi-layered printed wiring board
04/03/2007US7199307 Structure and method for embedding capacitors in z-connected multi-chip modules
04/03/2007US7199306 Multi-strand substrate for ball-grid array assemblies and method
04/03/2007US7199305 Protosubstrates
04/03/2007US7199304 Configurable microelectronic package using electrically conductive material
04/03/2007US7198996 Component built-in module and method for producing the same
04/03/2007US7198989 Method of producing a COF flexible printed wiring board
04/03/2007US7198986 Electronic parts built-in substrate and method of manufacturing the same
04/03/2007US7198984 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
04/03/2007US7198736 Conductive silver paste and conductive film formed using the same
04/03/2007US7198735 Homogenizing electroconductive fibers, powders and/or mixtures in polymers, and molding into construction materials
04/03/2007US7198491 Multi-pin RF field replaceable coaxial mounting flange structure
04/03/2007US7198173 Receiving device for drug blisters
04/03/2007US7197820 Circuit board and its manufacturing method
04/03/2007US7197819 Method of assembling an electric power
04/03/2007US7197818 Method and structures for implementing customizable dielectric printed circuit card traces
04/03/2007US7197817 Method for forming contact bumps for circuit board
04/03/2007US7197800 Method of making a high impedance surface
04/03/2007CA2142178C Method for manufacturing of a multilayer microwave board and boards obtained on the basis of this method
03/2007
03/29/2007WO2007034801A1 Flexible printed wiring board and method for manufacturing same
03/29/2007WO2007034072A1 Electronic device comprising a power support which bears a control support, and assembly method
03/29/2007WO2007004033A3 An electrically conductive composite
03/29/2007WO2007002628A3 Optical transponder module with dual board flexible circuit
03/29/2007WO2006082480A3 Component navigation system for a sailing vessel
03/29/2007US20070072963 Thermoplastic resin composition, material for substrate and film for substrate
03/29/2007US20070072453 Surface-mount connector with anti-wicking structure
03/29/2007US20070072452 Electronic control unit
03/29/2007US20070072451 Optical transmission apparatus
03/29/2007US20070072447 Printed Wiring Board Having Edge Plating Interconnects
03/29/2007US20070072445 Flat image detector for recording digital x-ray images
03/29/2007US20070072444 Thin film transistor substrate and manufacturing method of the same
03/29/2007US20070072425 Substrate and method for producing same
03/29/2007US20070072342 Depopulation of a ball grid array to allow via placement
03/29/2007US20070072122 Photosensitive polymer composition, method of forming relief patterns, and electronic equipment
03/29/2007US20070071984 Epoxy resin adhesive layer with nonthermoplastic polyimide insulating layers stacked on both sides; outer conductive layers; insulating layers 2 to 10 times thicker than the adhesive layer; adhesive strength between insulating layers is 7.0 N/cm or more; no curling, twisting, warping; etch resistance
03/29/2007US20070071910 Organic insulating film having controlled molecular orientation, and adhesive film, flexible metal-clad laminate, multilayer flexible metal-clad laminate, coverlay film, tab tape, and COF base tape including the organic insulating film
03/29/2007US20070071886 Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces
03/29/2007US20070070613 Method of manufacturing high density printed circuit boad
03/29/2007US20070070611 Folding USB drive
03/29/2007US20070070609 Connection structure between plurality of boards of portable terminal
03/29/2007US20070069393 Wiring board embedded with spherical semiconductor element