| Patents for H05K 1 - Printed circuits (98,583) |
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| 05/02/2007 | CN1957322A Interchangeable graphics card for a computing device |
| 05/02/2007 | CN1956640A Radiator fastener and radiator device assembly |
| 05/02/2007 | CN1956635A Structure of thin wire of multi-dielectric layer circuit board and its manufacturing method |
| 05/02/2007 | CN1956633A Common rolled separation board |
| 05/02/2007 | CN1956632A Method for plating printed circuit board and printed circuit board manufactured therefrom |
| 05/02/2007 | CN1956629A Flexible printed circuit board and its manufacturing method |
| 05/02/2007 | CN1956627A Printed circuit board, method of manufacturing a printed circuit board and electronic apparatus |
| 05/02/2007 | CN1956626A Wiring structure of printed circuit board |
| 05/02/2007 | CN1956625A 印刷电路板 A printed circuit board |
| 05/02/2007 | CN1956624A Rigid-flexible printed circuit board and method for manufacturing the same |
| 05/02/2007 | CN1956623A Two-layer flexible printed wiring board and method for manufacturing the same |
| 05/02/2007 | CN1956622A Signal line capable of overlay combined |
| 05/02/2007 | CN1956621A High speed holding-wire wiring structure |
| 05/02/2007 | CN1956620A Paste composition and printing circuit substrate for forming dielectric layer, and a method for forming a dielectric layer of plasma display panel |
| 05/02/2007 | CN1956619A Flexible board |
| 05/02/2007 | CN1956505A Image sensor module, camera assembly using the same, and method of manufacturing the camera assembly |
| 05/02/2007 | CN1956263A Printing circuit board with shielded joint |
| 05/02/2007 | CN1955253A Resin-impregnated base substrate and method for producing the same |
| 05/02/2007 | CN1314114C Electronic device carrier adapted for transmitting high frequency signals |
| 05/02/2007 | CN1314109C Multilayer chip carrier and substrate thereof, deallocation method for expanding signal panel weldering plate on chip carrier |
| 05/02/2007 | CN1313966C IC card producing method |
| 05/01/2007 | US7212713 Optical transmission substrate, method for manufacturing optical transmission substrate and optoelectronic integrated circuit |
| 05/01/2007 | US7212698 Circuit board integrated optical coupling elements |
| 05/01/2007 | US7212413 Electronic device with flexible printed circuit board structure |
| 05/01/2007 | US7211899 Circuit substrate and method for fabricating the same |
| 05/01/2007 | US7211894 Capacitor-related systems for addressing package/motherboard resonance |
| 05/01/2007 | US7211830 Circuit interconnect for optoelectronic device |
| 05/01/2007 | US7211738 Bonding pad structure for a display device and fabrication method thereof |
| 05/01/2007 | US7211737 Installation substrate, method of mounting installation substrate, and bulb socket using installation substrate |
| 05/01/2007 | US7211736 Connection pad layouts |
| 05/01/2007 | US7211735 Processes for manufacturing multilayer flexible wiring boards |
| 05/01/2007 | US7211528 Formed by immersing an aromatic liquid crystalline polyester fiber sheet in an aromatic liquid crystalline polyester solution containing a unit derived from an aromatic diamine or an aminophenol containing a solvent; high heat resistance in soldering conditions |
| 05/01/2007 | US7211527 Resin-impregnated substrate |
| 05/01/2007 | US7211345 Membrane electrode assemblies for use in fuel cells |
| 05/01/2007 | US7211289 Conductive thru-holes are formed within two dielectric layers of the board's structure so as to connect designated conductive layers, holes may be filled, e.g., with metal plating, or conductive or non-conductive paste, In the case of the latter, it providing a top covering conductive layer |
| 05/01/2007 | US7211205 High conductivity inks with improved adhesion |
| 05/01/2007 | US7211135 Shelf-life, results in a written or printed image having an excellent gold-metallic sheen, can especially be used also in inkjet printers |
| 05/01/2007 | US7211103 Biocompatible bonding method and electronics package suitable for implantation |
| 05/01/2007 | US7210942 Connection structure for printed wiring board |
| 05/01/2007 | US7210833 Method of fixing a power light-emitting diode on a radiator, and a signalling device comprising such a diode |
| 05/01/2007 | US7210818 Flexible LED lighting strip |
| 05/01/2007 | US7210817 Method, system and device for delivering phototherapy to a patient |
| 05/01/2007 | CA2445217C Method for field programmable radio frequency document identification devices |
| 04/26/2007 | WO2007047221A2 Alignment features for dicing multi element acoustic arrays |
| 04/26/2007 | WO2007046776A1 Capacitor interconnection |
| 04/26/2007 | WO2007046459A1 Multilayer printed wiring board and its manufacturing method |
| 04/26/2007 | WO2007046221A1 Hermetically sealing member with optical transmission means, optoelectronic device and optical transmission method |
| 04/26/2007 | WO2007046045A2 A component adapted for being mounted on a substrate and a method of mounting a surface mounted device |
| 04/26/2007 | WO2007045436A1 Method for preparing a conductive circuit device |
| 04/26/2007 | WO2006109206A3 Electronic circuit module comprising a heat producing component |
| 04/26/2007 | WO2006068803A3 Electrical power connector |
| 04/26/2007 | US20070093614 Epoxy resin composition |
| 04/26/2007 | US20070093091 Control unit of oven |
| 04/26/2007 | US20070093090 Relay module and electrical component unit |
| 04/26/2007 | US20070093089 Relay-fuse system and method thereof |
| 04/26/2007 | US20070093088 Electrostatic discharge protection device |
| 04/26/2007 | US20070093087 Communication Adapter |
| 04/26/2007 | US20070093086 Method and apparatus for fixed and replaceable module architecture |
| 04/26/2007 | US20070092185 Optical connection structure between optical backplane and circuit substrate |
| 04/26/2007 | US20070091581 Via stub termination structures and methods for making same |
| 04/26/2007 | US20070091579 Information technology (IT) equipment position locating system using jumper connections |
| 04/26/2007 | US20070090164 System and Methods for Data-Driven Control of Manufacturing Processes |
| 04/26/2007 | US20070090084 Reclaim method for extreme ultraviolet lithography mask blank and associated products |
| 04/26/2007 | US20070089903 Printed circuit board |
| 04/26/2007 | US20070089902 Circuit board having a multi-signal via |
| 04/26/2007 | US20070089901 Circuit board providing coplanarity of solders and high soldering reliability for semiconductor component |
| 04/26/2007 | US20070089900 Flexible board |
| 04/26/2007 | US20070089565 reducing ions of a metal by precipitation with a reducing agent in a liquid-phase reaction system so that the metal is precipitated as metal powder particles; reducing agent is a reducing saccharide or a glycitol |
| 04/26/2007 | US20070089292 Circuit board having a backdrilled multi-signal via |
| 04/26/2007 | US20070089291 Electronic part mounting substrate and method for producing same |
| 04/26/2007 | US20070089290 Method of making a printed circuit board with low cross-talk noise |
| 04/26/2007 | DE4436523B4 Verfahren zur Herstellung eines elektronischen Gerätes und Drehzahlsensor mit einer elektronischen Schaltung A method of manufacturing an electronic device, and rotational speed sensor with an electronic circuit |
| 04/26/2007 | DE202007002940U1 Elektronisches Bauteil und elektrischer Schaltungsträger Electronic component and electrical circuit carrier |
| 04/26/2007 | DE202005019497U1 Induktives Miniatur-Bauelement für SMD-Montage Inductive miniature component for SMD mounting |
| 04/26/2007 | DE10243637B4 Leiterplatte mit mindestens einem starren und mindestens einem flexiblen Bereich sowie Verfahren zur Herstellung von starr-flexiblen Leiterplatten Circuit board with at least one rigid and at least one flexible portion and method for the production of rigid-flexible PCB |
| 04/26/2007 | DE102005050830A1 Distance arrangement method e.g. for components on assembly area of circuit board, involves applying three-dimensional printing in environment of component hole on assembly surface of PCB |
| 04/26/2007 | DE102005050515A1 Flächensubstrat mit elektrisch leitender Struktur Surface substrate with conductive structure |
| 04/26/2007 | CA2622456A1 Systems and methods for electromagnetic noise suppression using hybrid electromagnetic bandgap structures |
| 04/26/2007 | CA2565644A1 Led pool and spa light |
| 04/25/2007 | EP1778000A2 Multilayer printed wiring board |
| 04/25/2007 | EP1777998A2 Method and apparatus for fixed and replaceable module architecture |
| 04/25/2007 | EP1777997A1 Method for preparing a conductive circuit device |
| 04/25/2007 | EP1777745A2 Power core device including a capacitor and method of making thereof |
| 04/25/2007 | EP1777744A2 IC-package having an array of embedded capacitors for low noise power delivery and for decoupling in the mid-frequency range of 1MHz to 3GHz. Methods of forming the IC-package. |
| 04/25/2007 | EP1777714A1 Design of low inductance embedded capacitor layer connections |
| 04/25/2007 | EP1777645A2 Semiconductor device |
| 04/25/2007 | EP1776850A1 Solderless component packaging and mounting |
| 04/25/2007 | EP1776849A1 Interface module |
| 04/25/2007 | EP1776827A1 Reduction of near field electro-magnetic scattering using high impedance metallization terminations |
| 04/25/2007 | EP1723836A4 A radio frequency circuit board topology |
| 04/25/2007 | EP1358675B1 Electronic assembly comprising substrate with embedded capacitors and methods of manufacture |
| 04/25/2007 | CN2894201Y Flexible printed board |
| 04/25/2007 | CN2894200Y Fast regulating circuit board antielectrostatic collecting frame |
| 04/25/2007 | CN2894199Y Printed circuit board |
| 04/25/2007 | CN2894198Y Heat conduction structure for radiating circuit board and thermal pipe |
| 04/25/2007 | CN1954651A Circuit board and electronic apparatus employing it |
| 04/25/2007 | CN1954221A Earth leakage detection device |
| 04/25/2007 | CN1954015A Polyimide resin, multilayer film, multilayer film with metal layer, and semiconductor device |
| 04/25/2007 | CN1953642A Circuit board with through hole type heat radiation |
| 04/25/2007 | CN1953641A A circuit structure to regulate the character impedance via the different reference plane and its circuit substrate |