| Patents for H05K 1 - Printed circuits (98,583) |
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| 02/27/2007 | US7181834 Method of fabricating an RF substrate with selected electrical properties |
| 02/27/2007 | CA2284672C Computer system and process for capture, editing and playback of motion video compressed using interframe and intraframe techniques |
| 02/24/2007 | CA2556303A1 Printed circuit board for real-time clock ic and manufacturing method for printed circuit board for real-time clock ic |
| 02/22/2007 | WO2007020865A1 Iridium oxide powder, process for producing the same, and paste containing the same for thick film resistor |
| 02/22/2007 | WO2007020842A1 Plasma display device |
| 02/22/2007 | WO2007020793A1 Insulating curable composition , cured product thereof, and printed wiring board using same |
| 02/22/2007 | WO2007020764A1 Laminate to be used in flexible printed wiring boards and wiring boards made by using the same |
| 02/22/2007 | WO2007019732A1 Surface mount component having magnetic layer thereon and method of forming same |
| 02/22/2007 | WO2007002098A3 Flexible substrate for flex-on-suspension circuit and method of manufacture |
| 02/22/2007 | WO2005117509A3 High current charge pump for intelligent power switch driver |
| 02/22/2007 | US20070044062 Method for checking return path of printed board and cad apparatus for designing patterns of printed board |
| 02/22/2007 | US20070042618 Connector, a terminal fitting, a chained terminal and a mounting method for a connector |
| 02/22/2007 | US20070042617 Connector for receiving different sizes of memory cards |
| 02/22/2007 | US20070042616 Optical disc apparatus |
| 02/22/2007 | US20070042215 Aluminum/ceramic bonding substrate and method for producing same |
| 02/22/2007 | US20070042212 Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil |
| 02/22/2007 | US20070042202 Metallic layer at one side, resin layer of polyimide for improving adhesion with metal, resin layer of low expansion polyimide having thermal expansion coefficient of 5x10-6 to 2.5x10-5/degrees C. and metallic layer at other side; excellent flexibility and thermal resistance, noncurling; printed circuits |
| 02/22/2007 | US20070042201 Copper electrolytic solution containing quaternary amine compound with specific skeleton and organo-sulfur compound as additives, and electrolytic copper foil manufactured using the same |
| 02/22/2007 | US20070042167 Novel polymide film and use thereof |
| 02/22/2007 | US20070041166 High brieghtness LED lamp |
| 02/22/2007 | US20070041163 Method for producing an electronic component or module and a corresponding component or module |
| 02/22/2007 | US20070041123 Method for making noble metal conductive leads for suspension assemblies |
| 02/22/2007 | US20070040735 High frequency package, transmitting and receiving module and wireless equipment |
| 02/22/2007 | US20070040270 Electronic device and carrier substrate |
| 02/22/2007 | US20070040154 Flame retarder composition |
| 02/22/2007 | US20070040034 Image sensor based optical reader |
| 02/22/2007 | US20070039753 Built-up printed circuit board with stack type via-holes |
| 02/22/2007 | US20070039171 Method of Fabricating a High-Layer-Count Backplane |
| 02/22/2007 | DE19653132B4 Mehrspurkopf-Baueinheit für Festplattenlaufwerke Head stack assembly for hard disk drives |
| 02/22/2007 | DE19604319B4 Chipkarte Smart card |
| 02/22/2007 | DE112005000438T5 Eine Zwischenverbindungsstruktur und ein Verfahren zum Verbinden von vergrabenen Signalleitungen mit elektrischen Vorrichtungen An interconnect structure and a method of connecting signal lines with the buried electrical devices |
| 02/22/2007 | DE102006037070A1 Circuit board fabrication involves providing a conductive paste with metallic nanoparticles |
| 02/22/2007 | DE102006035114A1 Semiconductor package, useful for surface mounting, comprises substrate, semiconductor chips and transparent resin layer |
| 02/22/2007 | DE102006027653A1 Parallelchip-Eingebettete gedruckte Schaltungsplatine und Herstellungsverfahren dafür Parallel chip-embedded printed circuit board and manufacturing method thereof |
| 02/22/2007 | DE102005038760A1 Metal-ceramic hybrid substrate for power-semiconductor components, has top metal layer structured into conductor paths and pads |
| 02/22/2007 | DE10157026B4 Ultraschallendoskop Ultrasonic endoscope |
| 02/21/2007 | EP1755365A1 Positive photosensitive insulating resin composition, cured product thereof, and electronic component |
| 02/21/2007 | EP1755161A2 Interconnect module with reduced power distribution impedance |
| 02/21/2007 | EP1755071A2 Memory card |
| 02/21/2007 | EP1755070A2 Memory card |
| 02/21/2007 | EP1754986A1 Optical communication device and optical communication device manufacturing method |
| 02/21/2007 | EP1754399A1 Method for producing transverse connections in printed circuit board sets |
| 02/21/2007 | EP1754398A2 Printed wiring board with conductive constraining core including resin filled channels |
| 02/21/2007 | EP1754121A2 Methods and systems for providing lighting systems |
| 02/21/2007 | EP1606859B1 Interconnection system with improved high frequency performance |
| 02/21/2007 | EP1501756B1 Method of manufacturing an electronic device in a cavity with a cover |
| 02/21/2007 | EP1360067B1 Lightweight circuit board with conductive constraining cores |
| 02/21/2007 | EP1305838B1 Low-temperature fabrication of thin-film energy-storage devices |
| 02/21/2007 | EP1290054B1 Glyoxal-phenolic condensates with enhanced fluorescence |
| 02/21/2007 | EP1163389B1 Visible and fluorescent dye containing laminate materials |
| 02/21/2007 | CN2872796Y Electronic assembly |
| 02/21/2007 | CN2872795Y Fastener |
| 02/21/2007 | CN1918955A RF circuit with stacked printed circuit boards |
| 02/21/2007 | CN1918952A Preferential ground and via exit structures for printed circuit boards |
| 02/21/2007 | CN1918951A Flexible circuit board assembly |
| 02/21/2007 | CN1918587A Method and device for continuously producing electronic film components, and an electronic film component |
| 02/21/2007 | CN1918583A Electronic device |
| 02/21/2007 | CN1918577A An optical system, an analysis system and a modular unit for an electronic pen |
| 02/21/2007 | CN1918237A Resin composition for ghz-band electronic component and ghz-band electronic component |
| 02/21/2007 | CN1917994A Process for producing synthetic resin film having molecular orientation controlled in md direction |
| 02/21/2007 | CN1917742A Double ended guide pin assembly |
| 02/21/2007 | CN1917741A Flexible substrate, mounting structure, display unit and portable electronic apparatus |
| 02/21/2007 | CN1917740A Power amplification circuit board, and grounding method |
| 02/21/2007 | CN1917739A Anti-electrostatic substrate |
| 02/21/2007 | CN1917738A Build-up multilayer printed circuit board and its manufacture method |
| 02/21/2007 | CN1917204A Optical module with flexible substrate |
| 02/21/2007 | CN1917102A Mounting structure for three-terminal capacitor |
| 02/21/2007 | CN1916101A Flame retardant adhesive without halogen in use for flexible printed circuit |
| 02/21/2007 | CN1915900A Oxide ceramic material, and ceramic substrate, laminated ceramic device, and power amplifier module using the material |
| 02/21/2007 | CN1301636C Method for manufacturing printed wiring board and multi-printed wiring board |
| 02/21/2007 | CN1301634C 信号传输结构 Signal transmission structure |
| 02/21/2007 | CN1301508C Conductive paste and glass circuit structure |
| 02/21/2007 | CN1301483C Method for producing contactless chip card using transfer paper and intelligent card manufactured by such method |
| 02/21/2007 | CN1301437C LCD module and printed circuit board thereof |
| 02/20/2007 | US7181089 Method and apparatus for searching for fiducial marks, and method of detecting positions of the fiducial marks |
| 02/20/2007 | US7180752 Method and structures for implementing enhanced reliability for printed circuit board high power dissipation applications |
| 02/20/2007 | US7180749 Circuit board and its manufacturing method |
| 02/20/2007 | US7180394 Millimeter wave (MMW) radio frequency transceiver module and method of forming same |
| 02/20/2007 | US7180315 Substrate with patterned conductive layer |
| 02/20/2007 | US7180177 Power supply component assembly on a printed circuit and method for obtaining same |
| 02/20/2007 | US7180172 Circuits, multi-layer circuits, and methods of manufacture thereof |
| 02/20/2007 | US7180170 Lead-free integrated circuit package structure |
| 02/20/2007 | US7180169 Circuit component built-in module and method for manufacturing the same |
| 02/20/2007 | US7180167 Low profile stacking system and method |
| 02/20/2007 | US7180012 Module part |
| 02/20/2007 | US7180009 Transmission line with stripped semi-rigid cable |
| 02/20/2007 | US7180008 Tamper barrier for electronic device |
| 02/20/2007 | US7180007 Electronic circuit device and its manufacturing method |
| 02/20/2007 | US7180006 Tape substrate and method for fabricating the same |
| 02/20/2007 | US7180005 Printed wiring board |
| 02/20/2007 | US7179844 Dielectric resin foam and lens for radio waves using the same |
| 02/20/2007 | US7179738 Semiconductor assembly having substrate with electroplated contact pads |
| 02/20/2007 | US7179666 Method for manufacturing an electronic circuit device and electronic circuit device |
| 02/20/2007 | US7179520 Circuit substrate, electro-optic device and electronic equipment |
| 02/20/2007 | US7179519 Polyimide/metal laminate, and electric/electronic equipment bases, magnetic recording bases, solar battery bases, coating film for aerospace materials and filmy resistance elements with the use thereof |
| 02/20/2007 | US7179131 Methods and apparatus for reducing crosstalk in electrical connectors |
| 02/20/2007 | US7179115 Alien next compensation for adjacently placed connectors |
| 02/20/2007 | US7179098 Terminal and portable device using the same |
| 02/20/2007 | US7179096 First protocol to second protocol adapter |
| 02/20/2007 | US7178234 Method of manufacturing multi-layer printed circuit board |