Patents for H05K 1 - Printed circuits (98,583)
05/2007
05/16/2007CN1316862C Printed circuit board producing method
05/16/2007CN1316861C Multi-layer circuit board and mfg. method
05/16/2007CN1316860C Metal-containing resin particle, resin particle, electronic circuit substrate, and method of producing electronic circuit
05/16/2007CN1316859C Device for manufacture electronic circuit
05/16/2007CN1316858C High frequency circuit base board and its producing method
05/16/2007CN1316701C Discharge gap device
05/16/2007CN1316676C 无线终端 Wireless terminal
05/16/2007CN1316672C High-frequency circuit
05/16/2007CN1316612C Electronic assembly with llaterally connected capacitors and mfg. method
05/16/2007CN1316606C 半导体器件 Semiconductor devices
05/16/2007CN1316524C Multiple tier array capacitor and methods of fabrication therefor
05/16/2007CN1316509C Conductor composition and method for production thereof
05/16/2007CN1316508C Electric connecter
05/16/2007CN1316374C Memory module having a path for transmitting high-speed data and a path for transmitting low-speed data and memory system having the memory module
05/16/2007CN1316276C Optical/electrical components high speed signaling and optical/electrical printed circuit board
05/16/2007CN1316066C Surface treatment copper foil for low dielectric substrate, copper clad laminate including the same and printed wiring board
05/16/2007CN1315851C Arylamine functional silicon hydride for epoxy resin laminated board enhanced by glass fiber fabrics
05/15/2007US7219322 Multiple propagation speeds of signals in layered circuit apparatus
05/15/2007US7219242 Direct plane access power delivery
05/15/2007US7218530 Enhanced blind hole termination of pin to PCB
05/15/2007US7218529 Circuit arrangement with a programmable memory element on a circuit board, with security against reprogramming
05/15/2007US7218528 Dual connecting interface memory card
05/15/2007US7218527 Apparatuses and methods for forming smart labels
05/15/2007US7218266 Electromagnetic wave absorber, method of manufacturing the same and appliance using the same
05/15/2007US7218055 Discharge lamp lighting apparatus
05/15/2007US7218008 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
05/15/2007US7218002 Electronic device and intermediate product of electronic device
05/15/2007US7217990 Tape package having test pad on reverse surface and method for testing the same
05/15/2007US7217889 System and method for reducing crosstalk between vias in a printed circuit board
05/15/2007US7217888 Electronic parts packaging structure and method of manufacturing the same
05/15/2007US7217887 Power and ground shield mesh to remove both capacitive and inductive signal coupling effects of routing in integrated circuit device
05/15/2007US7217827 Halogen-containing aromatic compound
05/15/2007US7217370 Wiring board and process for producing the same
05/15/2007US7217142 Cable connector assembly with improved contacts
05/15/2007US7217136 Printed circuit board with right-angled trace and method for making the same
05/15/2007US7216425 Method of forming a non-continuous conductive layer for laminated substrates
05/15/2007US7216422 Method of forming a capacitor assembly in a circuit board
05/15/2007CA2432174C High efficiency quarter-wave transformer
05/15/2007CA2283181C Electric subassembly
05/10/2007WO2007052660A1 Laminate for printed wiring board, printed wiring board using same, method for manufacturing printed wiring board, electrical component, electronic component, and electrical device
05/10/2007WO2007052630A1 Method for manufacture of electrolytic copper foil, electrolytic copper foil manufactured by the method, surface-treated copper foil manufactured using the electrolytic copper foil, and copper-clad laminate manufactured using the electrolytic copper foil or surface-treated copper foil
05/10/2007WO2007052523A1 Rubber-modified polyamide resin, epoxy resin composition, and cured object obtained therefrom
05/10/2007WO2007052422A1 Circuit device manufacturing method and circuit device
05/10/2007WO2007026174A3 Method of printing
05/10/2007WO2007025753A3 Modular microelectronic component
05/10/2007WO2005109972A3 Design and method for plating pci express (pcie) edge connector
05/10/2007US20070106056 Crosslinked polyimide, composition comprising the same and method for producing the same
05/10/2007US20070105412 Electrical Connector For A Window Pane Of A Vehicle
05/10/2007US20070105411 Coupler for Cable Trough
05/10/2007US20070105410 Cable connector assembly with internal printed circuit board
05/10/2007US20070105283 Manufacturing method of semiconductor device and semiconductor device
05/10/2007US20070104884 High conductivity inks with low minimum curing temperatures
05/10/2007US20070104878 Precursor compositions for the deposition of passive electronic features
05/10/2007US20070104877 Precursor compositions for the deposition of passive electronic features
05/10/2007US20070104605 Silver-containing particles, method and apparatus of manufacture, silver-containing devices made therefrom
05/10/2007US20070103879 Lighting device of discharge lamp, illumination apparatus and illimination system
05/10/2007US20070103876 Miniaturized form factor wireless communications card for generic mobile information devices
05/10/2007US20070103144 Calibration pattern and calibration jig
05/10/2007US20070102826 Electronic Component Having at Least One Semiconductor Chip and Flip-Chip Contacts, and Method for Producing the Same
05/10/2007US20070102807 Coupling substrate for semiconductor components and method for producing the same
05/10/2007US20070102803 Method for making stacked integrated circuits (ICs) using prepackaged parts
05/10/2007US20070102710 Lighting Device And Method
05/10/2007US20070102675 Overvoltage protection materials and process for preparing same
05/10/2007US20070102649 System and method for attenuating the effect of ambient light on an optical sensor
05/10/2007US20070102490 Circuit board,method of mounting surface mounting component on circuit board, and electronic equipment using the same circuit board
05/10/2007US20070102191 Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate
05/10/2007US20070102190 Circuit device and method of manufacturing the same
05/10/2007US20070101800 Liquid or gas sensor and method
05/10/2007DE202007003815U1 Leiterplatten-Mehrschichtaufbau PCB multilayer structure
05/10/2007DE202004021259U1 Zellulosefasern mit erweiterten umkehrbaren thermischen Eigenschaften Cellulose fibers with enhanced reversible thermal properties
05/10/2007DE102006051874A1 Elektrochemischer Kondensator mit kleinem ESR und Steckverbinder The electrochemical capacitor with small ESR and Connectors
05/10/2007DE102005051940A1 Leiterplatte mit Schirmanschluß PCB with shield connection
05/10/2007DE102005051806A1 Optical light guide for arranging on circuit board, has coating with color weakened by light entering through first lateral surface
05/09/2007EP1784065A1 Electrode substrate
05/09/2007EP1784064A1 Flexible printed wiring board terminal part or flexible flat cable terminal part
05/09/2007EP1784063A1 Circuit board with microelectronic elements assembled thereon and method for producing such circuit board
05/09/2007EP1782333A2 Combined electromagnetic and optical communication system
05/09/2007EP1781984A2 Led lighting system with reflective board
05/09/2007EP1337494B1 Esd dissipative ceramics
05/09/2007EP1224847B1 Flexible circuit board and method for making a flexible circuit board
05/09/2007EP1104017B1 Method of flip-chip mounting a semiconductor chip to a circuit board
05/09/2007EP1093705B1 Cross-midplane switch topology
05/09/2007EP1060646B1 Method for manufacturing a resistor
05/09/2007CN2899390Y Surface installating shell splinter with welding fixer
05/09/2007CN2899389Y SMT printing template structure
05/09/2007CN2899388Y Wire fixer and stock band therewith
05/09/2007CN2899387Y Electromagnetic-radiation-resisting structure of circuit board with network module
05/09/2007CN2899106Y Chip electronic part
05/09/2007CN1961622A Circuit substrate and manufacturing method thereof
05/09/2007CN1961621A Method for producing through hole in printed circuit board structure
05/09/2007CN1961586A Patch board with modules
05/09/2007CN1961508A Wireless communications devices including circuit substrates with partially overlapping conductors thereon coupling power to/from power amplifier systems
05/09/2007CN1961422A 电路装置及其制造方法 Circuit device and manufacturing method thereof
05/09/2007CN1961421A Integrated circuit stacking system and method
05/09/2007CN1961381A Nanoscale metal paste for interconnect and method of use
05/09/2007CN1960826A Copper-containing tin powder and method for producing the copper-containing tin powder, and electroconductive paste using the copper-containing tin powder
05/09/2007CN1960607A Method for pressfitting flexible circuit boards and vacuum, quick pressing device
05/09/2007CN1960604A Method for handling electric circuitry, and structure
05/09/2007CN1960601A Multilayer routing substrate and manufacturing method thereof
05/09/2007CN1960600A Printing circuit board