Patents for H05K 1 - Printed circuits (98,583)
03/2007
03/22/2007US20070064192 Liquid crystal display apparatus
03/22/2007US20070063792 Circuit interconnection which reduces cross talk, simultaneous switching noise, required decoupling capacitance and method therefor
03/22/2007US20070063343 Substrate for semiconductor device and semiconductor device
03/22/2007US20070063342 System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards
03/22/2007US20070063056 Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications
03/22/2007US20070062925 Heater and the method for producing the same using pcb
03/22/2007US20070062730 Controlled depth etched vias
03/22/2007US20070062729 Printed wiring board and method for manufacturing the same
03/22/2007US20070062728 Printed wiring board and method for manufacturing the same
03/22/2007US20070062726 Embedded capacitor device having a common coupling area
03/22/2007US20070062725 Embedded capacitor core having a multiple-layer structure
03/22/2007US20070062724 Printed wiring board and method for manufacturing the same
03/22/2007US20070062723 Method of forming circuit pattern on printed circuit board
03/22/2007US20070062722 Hinge board and method for producing the same
03/22/2007US20070062640 Method of manufacturing copper foil with insulating layer, copper foil with insulating layer obtained with the same method, and printed circuit board using the same copper foil with insulating layer
03/22/2007US20070062031 Printed circuit board including a fuse
03/22/2007DE202007000582U1 Vorrichtung zum Herstellen einer leitenden Antenne An apparatus for manufacturing a conductive antenna
03/22/2007DE102006042005A1 Eingebetteter Kondensatorkern mit einem Mehrschichtaufbau Embedded capacitor core having a multi-layer structure
03/22/2007DE102006016400A1 Base material for making printed circuit boards, produced by pressing layers of glass fabric vacuum-impregnated with solvent-free epoxy resin, has defined properties
03/21/2007EP1764810A1 Acceptor doped barium titanate based thin film capacitors formed on metal foils and methods for making thereof
03/21/2007EP1764665A1 Programmable controller with RF wireless interface
03/21/2007EP1764214A2 Laminated polyester film, flame-retardant polyester film thereof copper-clad laminated plate and circuit substrate
03/21/2007EP1764206A1 Oriented polyester film
03/21/2007EP1459408B1 Grouped element transmission channel link termination assemblies
03/21/2007EP1181535B1 Method and apparatus for inspecting solder paste deposits on substrates
03/21/2007CN2882192Y Integral radio communication module
03/21/2007CN2882191Y Conduction substrate structure
03/21/2007CN1934917A Support platform for electrical components, and module comprising said support platform
03/21/2007CN1934916A Device provided with an electric motor and a main printed circuit board and mounting method
03/21/2007CN1934915A Printed circuit board comprising at least one connection borehole for a connecting wire or pin of a wired electronic component
03/21/2007CN1934718A Metal base circuit substrate for an optical device and method manufacturing the aforementioned substrate
03/21/2007CN1934702A Integrated electronic module structure for vehicles
03/21/2007CN1934659A Inorganic dielectric powder for composite dielectric material and composite dielectric material
03/21/2007CN1933959A Novel polymide film and use thereof
03/21/2007CN1933948A Process for producing ceramic sheet, ceramic substrate utilizing the same and use thereof
03/21/2007CN1933703A Printed circuit board having fine pattern and manufacturing method thereof
03/21/2007CN1933702A Forming method for resin layer of metal layer, printed wiring board and its manufacturing method
03/21/2007CN1933699A Method for producing antipressing linear circuit board and products thereof
03/21/2007CN1933697A Multilayered wiring substrate and manufacturing method thereof
03/21/2007CN1933696A Multilayer wiring board and fabricating method of the same
03/21/2007CN1933695A Flexible radiating circuit substrate
03/21/2007CN1933246A Connection cable and producing method thereof
03/21/2007CN1933139A Wiring board and method for manufacturing the same, and semiconductor device
03/21/2007CN1306859C Foldable electronic device and cable distribution method thereof
03/21/2007CN1306855C Flexible wiring board and electronic device using said board
03/21/2007CN1306627C Light-emitting diode light source unit
03/21/2007CN1306621C Light source coupler, illuninant device, patterned conductor and method for manufacturing light source coupler
03/21/2007CN1306605C Film carried belt for mounting electronic components thereon
03/21/2007CN1306604C Semiconductor device, its mfg. method and thin sheet interconnecting line parts
03/21/2007CN1306603C Laminated electronic component
03/21/2007CN1306601C Semiconductor package and its manufacture
03/21/2007CN1306333C Display board and liquid crystal display with the same
03/21/2007CN1305962C Cured resin composition and its cured product
03/20/2007US7193862 Ceramic laminated device, communication equipment and method of manufacturing ceramic laminated device
03/20/2007US7193861 Information-processing device having a crossbar-board connected to back panels on different sides
03/20/2007US7193860 Leadframe-based module DC bus design to reduce module inductance
03/20/2007US7193858 Organic electroluminescent display device in which an electromagnetic field preventing and protecting circuit is easily arranged
03/20/2007US7193841 Circuit assembly and heat-insulating member for circuit assembly
03/20/2007US7193838 Printed circuit dielectric foil and embedded capacitors
03/20/2007US7193490 High frequency transmission line and high frequency board
03/20/2007US7193472 Power amplifier
03/20/2007US7193328 Semiconductor device
03/20/2007US7193314 Semiconductor devices and substrates used in thereof
03/20/2007US7193307 Multi-layer FET array and method of fabricating
03/20/2007US7193300 Plastic leadframe and compliant fastener
03/20/2007US7193158 Wiring board device
03/20/2007US7193157 Flexible circuit board mounted with semiconductor chip and method for mounting semiconductor chip
03/20/2007US7193020 Film and laminate of the same
03/20/2007US7193009 Electronic device using low dielectric loss tangent insulators for high frequency signals
03/20/2007US7192801 Printed circuit board and fabrication method thereof
03/20/2007US7192651 Resin composition and prepreg for laminate and metal-clad laminate
03/20/2007US7192312 Design and method for plating PCI express (PCIE) edge connector
03/20/2007US7192289 Module with interconnected male power input receptacle, female power output receptable and female load receptable
03/20/2007US7192286 Printed circuit board and an image forming apparatus having the printed circuit board
03/20/2007US7192176 Backlight assembly for a hand-held liquid crystal display
03/20/2007US7191515 Method for manufacturing an interconnected circuit board assembly
03/20/2007US7191512 Tray system for holding and positioning components
03/20/2007US7191507 Method of producing a wireless communication device
03/20/2007US7191491 Hinge connector having a shaft member of a simple structure and electronic apparatus including the hinge connector
03/20/2007CA2377951C Optical-electrical wiring board, mounted board and method of manufacturing optical-electrical wiring board
03/15/2007WO2007030596A2 Printed circuit board
03/15/2007WO2007029657A1 Resin composition and hybrid integrated circuit board making use of the same
03/15/2007WO2007029505A1 Module
03/15/2007WO2007029452A1 Method of forming conductive pattern and wiring board
03/15/2007WO2007029355A1 Shield structure
03/15/2007WO2007028887A1 Control assembly, in particular for motor vehicle steering column top portion
03/15/2007WO2007028671A1 Pressfit-system for electrically contacting and method for mounting said pressfit-system
03/15/2007WO2006083615A3 Method for connecting two printed circuit boards and printed circuit board therefore
03/15/2007WO2006019593A3 Transmission line with stripped semi-rigid cable
03/15/2007WO2005060401A3 Direct contact power transfer pad and method of making same
03/15/2007US20070060720 Epoxy resin composition
03/15/2007US20070060674 Curable composition, varnish and laminate
03/15/2007US20070060672 Insulation material, film, circuit board and method of producing them
03/15/2007US20070060223 Manufacturing method for a wireless communication device and manufacturing apparatus
03/15/2007US20070059981 Compact radio equipment and method of mounting the same
03/15/2007US20070059963 Anti-abrasive mechanism confining flat flexible cable in position in flatbed image scanner
03/15/2007US20070059953 Electronic Modules Having An Integrated Connector Detachment Mechanism
03/15/2007US20070059951 Flexible assembly of stacked chips
03/15/2007US20070059939 Method of producing a conductive layer on a substrate
03/15/2007US20070059517 Comprising a highly heat resistant resin (polyimide) film having a fine porous structure with a mean pore size of 0.01-5 mu m and a porosity of 15-80%; low dielectric constant and dielectric loss