Patents for H05K 1 - Printed circuits (98,583)
03/2007
03/08/2007US20070054112 Conductive layers and fabrication methods thereof
03/08/2007US20070054098 Multi-layer ceramic substrate and manufacturing method thereof
03/08/2007US20070053577 Production of test patterns for test inspection
03/08/2007US20070053170 Card connector
03/08/2007US20070053124 Device for protecting electronic modules in a multi-voltage on-baard electrical system against short circuits
03/08/2007US20070053119 Earth leakage detection device
03/08/2007US20070052757 Electronically addressable microencapsulated ink and display thereof
03/08/2007US20070051772 Modular rotary anvil
03/08/2007US20070051695 Printed wiring board and method for manufacturing the same
03/08/2007US20070051694 Formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate in which circuit is comprised of an electroless plated film and in which an electrolytic plated film and a roughened layer are formed on part of surface of circuit; prevents cracking
03/08/2007US20070051535 Circuit board assembly and electronic device utilizing the same
03/08/2007US20070051534 Wired circuit board
03/08/2007US20070051533 Optical electronics integrated semiconductor package
03/08/2007DE112005000232T5 Verfahren zur Verbindung von Keramik mit Kupfer, ohne dabei eine Wölbung im Kupfer zu erzeugen Method of joining ceramics with copper without thereby produce a curvature in the copper
03/08/2007DE102006033671A1 Verfahren und System zum elektrischen Verbinden mehrerer Leiterplatten A method and system for electrically connecting a plurality of printed circuit boards
03/07/2007EP1761119A1 Ceramic capacitor
03/07/2007EP1761118A1 Wiring board and capacitor
03/07/2007EP1761117A1 Wiring board with embedded ceramic capacitors
03/07/2007EP1761116A2 Circuit board having electronic parts mounted thereon by using under-fill material and method for producing the same
03/07/2007EP1761115A2 Printed wiring board and method for fabricating the same
03/07/2007EP1761114A2 Circuit board
03/07/2007EP1758735A2 Laminate composition for producing reduced curl flat thin core laminate
03/07/2007EP1758734A1 Textile structures for heating or warming
03/07/2007EP1758732A1 Perforated functional textile structures
03/07/2007EP1601624B1 Glass fibre for the reinforcement of organic and/or inorganic materials, method for production of said glass fibres and corresponding composition
03/07/2007EP1451872B1 Light emitting diode-based luminous panel and carrier plate
03/07/2007EP1436237B1 Bonding method and product
03/07/2007EP1181848B1 Ultraviolet curable silver composition and related method
03/07/2007EP1068642B1 An inductance device
03/07/2007EP0901744B1 Electronic card with shield cover having tabs where each tab engages with recess of corresponding shield cover
03/07/2007CN2877197Y Collision-proof device for printed circuitboard device
03/07/2007CN2877188Y Electronic element pin positioning structure
03/07/2007CN2876829Y Optical display module structure
03/07/2007CN1926932A Module heat dissipating structure and control device using the same
03/07/2007CN1926931A Multilayer board manufacturing method
03/07/2007CN1926929A Electronic component mounting method and electronic component mounting structure
03/07/2007CN1926928A Circuit device and method for manufacturing same
03/07/2007CN1926685A Light-emitting diode arrangement for a high-power light-emitting diode, and method for producing a light-emitting diode arrangement
03/07/2007CN1926646A Magnetic part
03/07/2007CN1926632A Interchangeable connection arrays for double-sided memory module placement
03/07/2007CN1926270A Double glass cloth, and prepreg and substrate for printed wiring board using the glass cloth
03/07/2007CN1926174A Active energy line cured resin, optical solidified and thermosetting resin composition containing said resin and its condensate
03/07/2007CN1925982A Carrier foil-attached electrolytic copper foil proviuded with insulation layer forming resin layer, copper-clad laminated sheet, printed circuit board, production method for multilayer copper-clad lam
03/07/2007CN1925724A Method of forming circuit pattern on printed circuit board
03/07/2007CN1925722A Wiring board construction including embedded ceramic capacitors(s)
03/07/2007CN1925721A Wiring board and ceramic capacitor
03/07/2007CN1925720A Wiring board and capacitor
03/07/2007CN1925719A Module, method of manufacturing module, and electronic apparatus using module
03/07/2007CN1925718A Radiator fixing device
03/07/2007CN1925717A Circuit board and electronic device including same and method for manufacturing same
03/07/2007CN1925148A Multilayer wiring substrate and method for manufacturing same
03/07/2007CN1925004A Flexible wiring board for magnetic head assembly
03/07/2007CN1924578A Piezo-electric protein chip analyzer
03/07/2007CN1303851C 软体印刷电路板 Software printed circuit board
03/07/2007CN1303677C Circuit substrate, mounting structure of semiconductor element with lug and electrio-optical device
03/07/2007CN1303646C Sticking device for reinforcing plate
03/07/2007CN1303401C Encoder system and method of assembly of such a system
03/07/2007CN1303285C Completely aromatic-polyamide-fiber synthesized paper sheet
03/07/2007CN1302899C Punching tool with re-usable, neutral structural groups
03/06/2007US7187559 Circuit board device and its manufacturing method
03/06/2007US7187558 Leadframe-based module DC bus design to reduce module inductance
03/06/2007US7187556 Power distribution system
03/06/2007US7187518 Flexible printed circuit for spindle motor and disk drive having the same
03/06/2007US7187263 Printed circuit transformer
03/06/2007US7187249 Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package
03/06/2007US7187086 Integrated circuit arrangement
03/06/2007US7187074 Semiconductor and electronic device with spring terminal
03/06/2007US7187071 Composite electronic component
03/06/2007US7186928 Electronic device including chip parts and a method for manufacturing the same
03/06/2007US7186927 High frequency via with stripped semi-rigid cable
03/06/2007US7186926 Surface mounting structure for surface mounting an electronic component
03/06/2007US7186925 Electronic circuit device and method of manufacturing the same
03/06/2007US7186924 Dielectric structure for printed circuit board traces
03/06/2007US7186923 Printed wiring boards and methods for making them
03/06/2007US7186922 Circuit board
03/06/2007US7186921 Circuit device and manufacturing method thereof
03/06/2007US7186920 Flexible wiring board, an intermediate product of a flexible wiring board, and a multi-layer flexible wiring board
03/06/2007US7186919 Printed circuit board including embedded capacitors and method of manufacturing the same
03/06/2007US7186584 Integrated circuit chip, electronic device and method of manufacturing the same, and electronic instrument
03/06/2007US7186461 Oxides of Silicon, Aluminum, Magnesium, Barium, strontium and Zinc; as a multi-layer substrate in high frequency electronic packaging applications such as low temperature co-fired ceramic (LTCC) applications, co-fired ceramic on metal applications, high frequency electronic applications
03/06/2007US7186456 Easily slidable polyimide film and substrate employing it
03/06/2007US7186311 Process for producing substrate for flexible circuit board
03/06/2007US7186307 Method for manufacturing a ceramic multilayer circuit board
03/06/2007US7186122 Snap electrode, its bonding method and using method
03/06/2007US7186120 Automotive relay and electrical connector box
03/06/2007US7185799 Method of creating solder bar connections on electronic packages
03/06/2007US7185429 Manufacture method of a flexible multilayer wiring board
03/06/2007US7185427 Method for making electrical connections to an element on printed circuit board
03/06/2007US7185426 Method of manufacturing a semiconductor package
03/06/2007US7185425 Method for connecting printed circuit boards
03/06/2007US7185423 Method of a supporting a CGA integrated package on a circuit board with improved shock and vibration isolation
03/01/2007WO2007024567A2 Controlled depth etched vias
03/01/2007WO2007024005A1 Microminiature contact and method for manufacturing same, and electronic component
03/01/2007WO2007023944A1 Composite resin molded article, laminate, multi-layer circuit board, and electronic device
03/01/2007WO2006076611A3 Production of metal nanoparticles
03/01/2007WO2005115068A8 High density interconnect system having rapid fabrication cycle
03/01/2007WO2005104226A8 Method for production of through-contacts in a plastic mass and semiconductor component with said through contacts
03/01/2007WO2005036644A3 Electronic device and carrier substrate
03/01/2007US20070049869 Warming apparatus with heater produced by pcb
03/01/2007US20070049485 Inorganic dielectric powder for composite dielectric material and composite dielectric material