Patents for H05K 1 - Printed circuits (98,583)
01/2007
01/04/2007US20070000688 Substrates for high performance packages including plated metal on ceramic substrates and thick organic substrates
01/04/2007US20070000687 Apparatus and method for an embedded air dielectric for a package and a printed circuit board
01/04/2007US20070000686 System, method and apparatus for routing signals from an integrated circuit using thickfilm and printed circuit interconnects
01/04/2007US20070000685 Connection sheet
01/04/2007US20070000684 Circuit board and visual inspection method of mount position of electronic component
01/04/2007DE10248112B4 Verfahren zur Herstellung von gedruckten elektrischen Schaltungen A process for the production of printed electrical circuits
01/04/2007DE102006030217A1 Anordnung eines flexiblen Schaltungsträgers in einer Abbildungseinrichtung Arrangement of a flexible printed circuit board in an imaging device
01/04/2007DE102004009567B4 Verdrahtungsträger zur Aufnahme von Chips Wiring carrier to hold chips
01/04/2007CA2613282A1 Dielectric substrate with holes and method of manufacture
01/04/2007CA2612776A1 Passive electrical article
01/03/2007EP1740029A1 Circuit substrate
01/03/2007EP1740025A2 Wiring board and method for manufacturing the same
01/03/2007EP1740024A2 Electronic device
01/03/2007EP1739739A1 Through wiring board and method for producing the same
01/03/2007EP1739689A1 Conductive paste for multilayer electronic components and multilayer electronic component using same
01/03/2007EP1739114A1 Polyimide resin, multilayer film, multilayer film with metal layer, and semiconductor device
01/03/2007EP1739105A1 Modified polytetrafluoroethylene powder and method for producing tetrafluoroethylene polymer
01/03/2007EP1738627A2 Method and apparatus for venting an electronic control module
01/03/2007EP1738626A1 Process for manufacturing a power electronic appliance by bending
01/03/2007EP1738622A1 Circuit board panel with a plurality of circuit carriers, circuit carrier and method for individually separating circuit carriers belonging to a circuit board panel
01/03/2007EP1738442A1 Electrical connector with improved crosstalk compensation
01/03/2007EP1738431A2 Embedded capacitors using conductor filled vias
01/03/2007EP1738418A1 Metal base circuit substrate for an optical device and method manufacturing the aforementioned substrate
01/03/2007EP1516372B1 Surface-mountable light-emitting diode and/or photodiode and method for the production thereof
01/03/2007EP1415522A4 Electromagnetic filter for display screens
01/03/2007EP1354385B1 Securing electrical conductors
01/03/2007EP1060647B1 Method of making microwave, multifunction modules using fluoropolymer composite substrates
01/03/2007CN2855007Y Printed circuit board replacement structure
01/03/2007CN2855006Y Internal storage module
01/03/2007CN2855005Y Printed circuit board replacement structure
01/03/2007CN1891023A Method for constructing emi shielding around a component embedded in a circuit board
01/03/2007CN1891019A Electric sub-assembly comprising an electrically conductive contact pin for pressing into an opening of a printed circuit board
01/03/2007CN1890854A Internally shielded energy conditioner
01/03/2007CN1890325A Thermosetting resin composition, material for substrate and film for substrate
01/03/2007CN1890286A Thermosetting resin composition, resin sheet and resin sheet for insulated substrate
01/03/2007CN1889810A Printed circuit board with improved hole
01/03/2007CN1889809A Jafani effect improving method
01/03/2007CN1889808A Printed circuit board overlap pad wiring structure
01/03/2007CN1887594A Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure
01/03/2007CN1887593A Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure
01/03/2007CN1887592A Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure
01/03/2007CN1293793C Line base-plate
01/03/2007CN1293792C Manufacturing fire retardant circuit boards without the use of fire retardant resin additives
01/03/2007CN1293791C Earthing structure for electronic card connector
01/03/2007CN1293790C Built-in module in element and its making process
01/03/2007CN1293573C Dielectric ceramic composition and ceramic electronic component employing the same
01/03/2007CN1293236C Electrolytic copper foil with carrier foil and method for manufacturing the same
01/03/2007CN1293235C Copper electrolyte and electrolytic copper foil prepared using the same
01/03/2007CN1293234C Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil
01/03/2007CN1293147C Thermosetting resin composition and prepreg and laminated sheet using the same
01/03/2007CN1292905C Flexible printed circuit board
01/03/2007CN1292861C Copper flake powder, method for producing same
01/02/2007USRE39453 Low profile inductive component
01/02/2007US7158387 Film carrier tape for mounting electronic part
01/02/2007US7158383 Techniques for fabricating a resistor on a flexible base material
01/02/2007US7158382 Uninterruptible power supply socket
01/02/2007US7158372 Electronic control unit
01/02/2007US7158365 Method of producing a multilayer microelectronic substrate
01/02/2007US7158348 Integrated lead suspension for use in a disk drive using a tri-metal laminate and method for fabrication
01/02/2007US7158331 Disk drive having control circuit board mounted outside casing and head actuator coupled capacitor mounted inside casing on printed circuit board
01/02/2007US7157992 Systems and methods for blocking microwave propagation in parallel plate structures
01/02/2007US7157987 Transmission line having a transforming impedance
01/02/2007US7157903 Inductive sensor and rotary encoder provided with an inductive sensor
01/02/2007US7157800 Bonded structure using conductive adhesives, and a manufacturing method thereof
01/02/2007US7157723 System and method for attenuating the effect of ambient light on an optical sensor
01/02/2007US7157647 Circuitized substrate with filled isolation border, method of making same, electrical assembly utilizing same, and information handling system utilizing same
01/02/2007US7157646 Circuitized substrate with split conductive layer, method of making same, electrical assembly utilizing same, and information handling system utilizing same
01/02/2007US7157507 Mixture of photopolymers, silver flakes or powder and photoinitiator
01/02/2007US7157506 Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepeg made with these, and metal-clad laminate
01/02/2007US7157362 Electronic circuit unit and method of fabricating the same
01/02/2007US7157301 Semiconductor package security features using thermochromatic inks and three-dimensional identification coding
01/02/2007US7157290 Magnetically shielded circuit board
01/02/2007US7157187 Heat resistance; performance; ultrathin electrolyte/dielectric films
01/02/2007US7156935 Unfired first ceramic layers and unfired second ceramic layer of different color from the unfired first layer are laminated, surface is notched to the proper depth using second layer as a reference, firing, and dividing along the notches into ceramic composites; little deformation and few cracks
01/02/2007US7156666 Connecting device for a multilayer flat element equipped with electrical functional elements and flat element
01/02/2007US7156562 Opto-electronic module form factor having adjustable optical plane height
01/02/2007US7155820 Method for manufacturing printed circuit board
01/02/2007US7155816 Method for producing a multilayer ceramic substrate
01/02/2007US7155815 Electrical contacting method
01/02/2007CA2418683C Area-array with low inductance connecting device
12/2006
12/28/2006WO2006137432A1 Filler for substrate and composition for use as material for inorganic/organic composite substrate formation
12/28/2006WO2006137304A1 Adhesive and adhesive sheet
12/28/2006WO2006137240A1 Copper foil for printed wiring board
12/28/2006WO2006137043A1 Warpage preventing substrates and method of making same
12/28/2006WO2005107345A3 Microelectronic connection components having bondable wires
12/28/2006WO2004082180A3 Method for optimizing high frequency performance of via structures
12/28/2006US20060293498 Polyamide-imide resin, flexible metal-clad laminate, and flexible printed wiring board
12/28/2006US20060293459 Blend of polytetrafluoroethylene and a thermoplastic such as perfluoropropyl perfluorovinyl ether-tetrafluoroethylene copolymer; low in permittivity and dielectric loss, and excellent in mechanical strength and terminal processability; antenna covers and printed wiring boards
12/28/2006US20060293168 Forsterite powder; calcium titanate-based, strontium titanate-based, strontium titanate, or titanium oxide-based ceramic powder; borosilicate glass powder containing Li, Mg, Zn and optionally Al; may be fired at low temperatures; monolithic
12/28/2006US20060292904 Electric connection box
12/28/2006US20060292903 Electric connection box
12/28/2006US20060292902 Attachment structure for electric junction box
12/28/2006US20060292901 Invertible, pluggable module for variable I/O densities
12/28/2006US20060292898 Electrical interconnection system
12/28/2006US20060292813 Electronic component and method for manufacturing the same
12/28/2006US20060292722 Flexible interconnect structures for electrical devices and light sources incorporating the same
12/28/2006US20060292434 Method of producing membrane electrode assemblies for use in proton exchange membrane and direct methanol fuel cells
12/28/2006US20060292383 Metal-coated substrate and manufacturing method of the same
12/28/2006US20060291180 PCI mezzanine card
12/28/2006US20060291176 Device and method for damping cavity resonance in a multi-layer carrier module