Patents for H05K 1 - Printed circuits (98,583)
02/2007
02/20/2007US7178233 Process for producing a collapsed filled via hole
02/20/2007US7178229 Method of making interlayer panels
02/15/2007WO2007018600A1 Acoustic path for a wireless communications device
02/15/2007WO2007018050A1 Silicon nitride substrate, silicon nitride circuit substrate using the same, and its use
02/15/2007WO2007017938A1 Chip part mounting member
02/15/2007WO2007016909A1 Electrical component
02/15/2007WO2006077163A3 Wire-printed circuit board or card comprising conductors with a rectangular or square cross-section
02/15/2007WO2005109458A3 Method of laminating low temperature co-fired ceramic (ltcc) material and product formed thereby
02/15/2007US20070037950 Thermosetting resin composition, resin film, metallic foil provided with an insulation material, insulation film provided with a metallic foil on each side, metal-clad laminate, multi-layered metal-clad laminate, and multi-layered printed wiring board
02/15/2007US20070037440 Connection structure for printed wiring board
02/15/2007US20070037417 Connector improved in reliability of electrostatic protection
02/15/2007US20070037315 Silicone Metalization
02/15/2007US20070037074 Use of alternative polymer materials for "soft" polymer pellicles
02/15/2007US20070036954 Wiring circuit board
02/15/2007US20070036490 Methods for manufacturing optical modules having an optical sub-assembly
02/15/2007US20070035935 Circuit arrangement for emc interference suppression for a direct current motor and a swwitching module
02/15/2007US20070035688 Electronic apparatus with a wiring terminal
02/15/2007US20070035583 Nozzle arrangement incorporating a lever based ink displacement mechanism
02/15/2007US20070035013 Module with built-in circuit elements
02/15/2007US20070035004 Semiconductor module
02/15/2007US20070034695 Method of determining at least one marking element on a substrate
02/15/2007US20070034405 Using rows/columns of micro-vias to create PCB routing channels in BGA interconnect grid (micro-via channels)
02/15/2007US20070034403 Four-way lead flat package IC-mount printed circuit board, method of soldering four-way-lead flat package IC and air conditioner
02/15/2007US20070034402 Tape substrate, tape package and flat panel display using same
02/15/2007US20070034401 Circuit board and manufacturing method thereof
02/15/2007US20070033800 Method for electrically contacting a component to a flat cable
02/15/2007US20070033796 Cross-over of conductive interconnects and a method of crossing conductive interconnects
02/15/2007DE10343279B4 Elektrisches Leitungssystem Electrical conduction system
02/15/2007DE102006027586A1 Integrierte Schaltungen mit Induktionsspulen in mehreren leitenden Schichten Integrated circuits with inductors in multiple conductive layers
02/15/2007DE102005037948A1 Sensoranordnung mit einem Sensorbauelement und einem Träger und Verfahren zur Herstellung einer Sensoranordnung Sensor arrangement having a sensor device and a support and method for manufacturing a sensor arrangement
02/15/2007DE102005037460A1 Arrangement with at least one IC has components with circuit carrier and conductive electrodes with separation of conductive sections on IC and carrier to ensure electromagnetic compatibility
02/15/2007DE102005036563A1 Electrical component or module esp. for frequency converters, has electrical contact on support element running through protective layer
02/15/2007DE102005036445A1 Ignition coil for an internal combustion engine comprises a damping composition partially surrounded by an insulating composition which fills intermediate spaces in a housing
02/14/2007EP1753278A1 Multilayer printed wiring board
02/14/2007EP1753275A2 Using rows/columns of micro-vias in a BGA interconnect grid to create improved PCB routing channels
02/14/2007EP1753274A2 Alternating micro-vias and through-hole vias for a BGA interconnect grid in order to create improved PCB routing channels
02/14/2007EP1753023A2 Method of manufacturing an electronic device in a cavity with a cover
02/14/2007EP1751894A2 Multiple channel optical transceiver modules
02/14/2007EP1751798A1 Tamper respondent covering
02/14/2007EP1751796A1 Organic matrices containing nanomaterials to enhance bulk thermal conductivity
02/14/2007EP1751200A1 Phenolic resin
02/14/2007EP1751199A1 Novel phenolic resins
02/14/2007EP1750946A1 Flexible printhead circuit
02/14/2007EP1578612B1 Continuous web process for the manufacture of electrochemical sensors
02/14/2007EP1278405B1 Circuit board producing method and circuit board producing device
02/14/2007EP1100096B1 Electronic device and manufacture thereof
02/14/2007EP1043922B1 Multilayer printed wiring board
02/14/2007CN2870387Y Microcircuit baseboard with good high-frequency characteristics
02/14/2007CN2870386Y Electronic element protection cover
02/14/2007CN2870381Y Electrostatic-discharge-leaf and corresponding metal slideway
02/14/2007CN2870380Y Electrostatic discharge leaf and corresponding metal slide-way
02/14/2007CN2870090Y Flexible cable
02/14/2007CN1914966A 多层印刷配线板 Multilayer printed wiring board
02/14/2007CN1914964A Circuits, multilayer circuits, and method of manufacture thereof
02/14/2007CN1914963A Method for disposing a conductor structure on a substrate, and substrate comprising said conductor structure
02/14/2007CN1914962A Method for increasing a routing density for a circuit board and such a circuit board
02/14/2007CN1914961A Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof
02/14/2007CN1914774A Housing comprising a liquid-tight electric bushing
02/14/2007CN1914455A Deformable illumination module
02/14/2007CN1914246A Thermosetting resin composition and use thereof
02/14/2007CN1913751A Wiring circuit board
02/14/2007CN1913748A Method of soldering a quad flat package IC on a printed circuit board
02/14/2007CN1913747A Using rows/columns of micro-vias in a BGA interconnect grid to create improved PCB routing channels
02/14/2007CN1913746A Printed circuit board and liquid crystal display having the same
02/14/2007CN1913745A Fastening prefabricated element for fixing double-layer printing circuit board
02/14/2007CN1913744A Printed circuit board with improved hole
02/14/2007CN1913743A 电路板 Circuit board
02/14/2007CN1913742A Wiring structure of printed circuit board
02/14/2007CN1913150A Method for fabricating electronic circuit module and integrated circuit device
02/14/2007CN1913144A Printed circuit board and electronic apparatus including printed circuit board
02/14/2007CN1913142A Circuit board and circuit apparatus using the same
02/14/2007CN1913044A Thick film conductor composition, and its use in ltcc circuit and device
02/14/2007CN1301051C Printed circuitboard
02/14/2007CN1301048C Method for producing distributing base board
02/14/2007CN1301047C Welding disk pattern structure and substrate for carrging electrical components
02/14/2007CN1301046C Flexible printed wiring board for chip-on-film
02/14/2007CN1301045C Multilayer terminal plate assembly, multilayer terminal plate assembly unit and its manufacturing method
02/14/2007CN1301044C 电路装置 Circuit device
02/14/2007CN1301043C Circuit device and its mfg. method
02/14/2007CN1300939C High-frequency switch assembly and high-frequency instrument mounting said high-frequency switch assembly
02/14/2007CN1300844C Ball gate array packaging and printed circuit board using same
02/14/2007CN1300633C Backlight module and heat sink structure
02/13/2007US7177548 Optical module
02/13/2007US7177161 Compact radio equipment and method of mounting the same
02/13/2007US7177159 Packaging structure of electronic card
02/13/2007US7177158 Press-activated electronic component discharging facilitating apparatus
02/13/2007US7177064 Display device using printed circuit board as substrate of display panel
02/13/2007US7176900 Method and apparatus for field programming radio frequency identification devices
02/13/2007US7176849 Wireless security badge
02/13/2007US7176773 High density inductor and method for producing same
02/13/2007US7176762 Radio frequency power amplifier
02/13/2007US7176756 Inductor element containing circuit board and power amplifier module
02/13/2007US7176582 Semiconductor device and method of manufacturing same
02/13/2007US7176579 Semiconductor module
02/13/2007US7176578 Method for processing a thin film substrate
02/13/2007US7176568 Semiconductor device and its manufacturing method, electronic module, and electronic unit
02/13/2007US7176384 Electronic component
02/13/2007US7176383 Printed circuit board with low cross-talk noise
02/13/2007US7176382 Electrical circuit board and method for making the same
02/13/2007US7176381 Printed circuit board and method of printing identification marks