Patents for H05K 1 - Printed circuits (98,583)
12/2008
12/25/2008US20080314623 Printed Circuit Board and Method for Manufacturing the Same
12/25/2008US20080314622 Method Of Fabricating Board Having High Density Core Layer And Structure Thereof
12/25/2008US20080314620 Skew Compensation by Changing Ground Parasitic For Traces
12/25/2008US20080314619 Conductive paste, printed circuit board, and manufacturing method thereof
12/25/2008US20080314618 Solution, Component for Plating, Insulating Sheet, Laminate, and Printed Circuit Board
12/24/2008WO2008157524A2 Methods for integration of thin-film capacitors into the build-up layers of a printed wiring board
12/24/2008WO2008156014A1 Printed circuit board
12/24/2008WO2008127970A3 Circuit materials, multilayer circuits, and methods of manufacture thereof
12/24/2008EP2007180A1 Circuit board, electronic circuit device, and display
12/24/2008EP2007176A1 Circuit board and connection substrate
12/24/2008EP2007009A2 Planar emi filter
12/24/2008EP2006909A2 Heat dissipating wiring board and method for manufacturing same
12/24/2008EP2005526A1 Electrical connector
12/24/2008EP2005525A1 Electrical connector
12/24/2008EP2005524A1 Electrical connector
12/24/2008EP2004936A1 Device for a motor vehicle lock with component mounting
12/24/2008EP2004564A1 Needled glass mat
12/24/2008EP1733410B1 System comprising an automotive fuse and an a/d converter
12/24/2008EP1688236B1 Film and magnetic-recording medium using the same
12/24/2008EP0953608B1 Heat-resistant, lowly dielectric high-molecular material, and films, substrates, electric components and heat-resistant resin moldings produced therefrom
12/24/2008DE10254910B4 Schaltkreisbildende Einheit und Verfahren zu deren Herstellung Circuit forming unit and process for their preparation
12/24/2008DE102007028520A1 Elektrisches/elektronisches Bauelement mit einem mechanischen und/oder elektrisch leitfähigen Anschlussmittel Electric / electronic component with a mechanical and / or electrically conductive connection means
12/24/2008DE102007028511A1 Elektronisches Gerät mit mindestens einem elektrischen Anschlusselement und Verfahren zur Herstellung eines Anschlusselements An electronic device having at least one electrical connection element and method for producing a connection element
12/24/2008DE102007028467A1 Messvorrichtung mit RFID-Transponder und Sensor Measuring device with an RFID transponder and sensor
12/24/2008DE102007028357A1 Transponderkarte Transponder card
12/24/2008CN201170806Y Pick-up head chip dimension die set with novel structure
12/24/2008CN101331606A Enhanced substrate using metamaterials
12/24/2008CN101330804A Printed circuit board and method of manufacturing the same
12/24/2008CN101330800A Methods for manufacturing circuit substrate
12/24/2008CN101330797A Circuit board structure of pipe leakage detector
12/24/2008CN101330796A Onstate structure and application thereof
12/24/2008CN101330793A Electrostatic safeguard structure
12/24/2008CN101330071A Mounting substrate and manufacturing method thereof
12/24/2008CN101329455A Electro-optical device and electronic apparatus
12/24/2008CN101329042A Light source component
12/24/2008CN101329017A Lighting arrangement with semiconductor light sources on flexible printed circuits
12/24/2008CN101328301A Liquid thermosetting resin composition and method for manufacturing printed circuit board using the same
12/24/2008CN100446643C Portable electronic device
12/24/2008CN100446305C Battery with connector
12/24/2008CN100446224C Wiring substrate and method of fabricating the same
12/24/2008CN100446137C Manufacturing method of ceramic raw sheet and manufacturing method of electronic member using the ceramic raw sheet
12/24/2008CN100444998C Silver powder and method for producing same
12/23/2008US7468648 Magnetic device
12/23/2008US7468645 Signal line circuit device
12/23/2008US7468551 Multiple chips bonded to packaging structure with low noise and multiple selectable functions
12/23/2008US7468490 Circuit substrate and electronic apparatus, fabrication process thereof
12/23/2008US7468197 Flexible metal-clad laminate and method for producing the same
12/18/2008WO2008154021A1 Latching power and data center
12/18/2008WO2008153185A1 Embedding copper plating method for manufacture of printed wiring board, and printed wiring board obtained by using the embedding copper plating method
12/18/2008WO2008152916A1 Composite material
12/18/2008WO2008152827A1 Printed-wiring board and method for manufacturing the same
12/18/2008WO2008152575A1 Flexible electronics package and method for manufacturing such a package
12/18/2008WO2008152438A1 Shielded circuit assembly and method
12/18/2008WO2008123766A3 High thermal-efficient metal core printed circuit board with selective electrical and thermal circuitry connectivity
12/18/2008WO2008116106A3 Circuit card assembly including individually testable layers
12/18/2008WO2007124146A8 Printed circuit boards with stacked micros vias
12/18/2008WO2007030596A3 Printed circuit board
12/18/2008WO2005048314A3 Tapered dielectric and conductor structures and applications thereof
12/18/2008US20080312383 Thermosetting Resin Composition, And Laminate and Circuit Substrate Using Same
12/18/2008US20080310129 Structure of tag integrated circuit flexible board
12/18/2008US20080310128 Variable Height Plug-In Pads and Equalizers
12/18/2008US20080310098 Circuit board
12/18/2008US20080310090 Display Module
12/18/2008US20080310076 Controlled esr decoupling capacitor
12/18/2008US20080309204 Circuit board and brushless motor using the same
12/18/2008US20080308943 Wiring structure and semiconductor device, and their fabrication methods
12/18/2008US20080308923 High performance chip carrier substrate
12/18/2008US20080308315 Multilayer printed circuit board and method of fabricating the same
12/18/2008US20080308312 Ceramic electronic component
12/18/2008US20080308311 Optical path converting member, multilayer print circuit board, and device for optical communication
12/18/2008US20080308310 Device Comprising a Substrate Including an Electronic Contact, and Transponder
12/18/2008US20080308309 Structure of packaging substrate having capacitor embedded therein and method for fabricating the same
12/18/2008US20080308308 Method of manufacturing wiring board, method of manufacturing semiconductor device and wiring board
12/18/2008US20080308307 Trace structure and method for fabricating the same
12/18/2008US20080308306 Shifted segment layout for differential signal traces to mitigate bundle weave effect
12/18/2008US20080308305 Wiring substrate with reinforcing member
12/18/2008US20080308304 Multilayer Wiring Board and Its Manufacturing Method
12/18/2008US20080308303 Chip carrier substrate and production method therefor
12/18/2008US20080308302 Printed circuit board with anti-oxidation layer
12/18/2008US20080308301 Photocurable and thermosetting resin composition, cured product thereof, and printed circuit board
12/18/2008US20080308300 Method of manufacturing electrically conductive strips
12/18/2008US20080308001 Metallic colloidal solution and inkjet-use metallic ink
12/18/2008US20080307640 Method for reinforcing the connection of flat cable member and method for manufacturing image display unit
12/18/2008DE10303446B4 Vorrichtung zum Schutz von auf Flachbaugruppen verwendeten elektronischen Bauteilen vor einer Zerstörung durch elektrostatische Entladungsvorgänge Protection device for use on printed circuit boards electronic components from damage by electrostatic discharge processes
12/18/2008DE102008025032A1 Spiralförmiger Induktor Spiral inductor
12/18/2008DE102007028089A1 Paste zur Herstellung einer Induktivität Paste for forming an inductance
12/18/2008CA2692024A1 Latching power and data center
12/17/2008EP2003938A2 Printed-circuit board of an improved type for an electronic device
12/17/2008EP2002697A1 Electronic module and procedure for at least the partial scrapping of the electronic module
12/17/2008EP2002377A2 Combined multi-frequency electromagnetic and optical communication system
12/17/2008EP2001676A1 Capacitive polyimide laminate
12/17/2008EP1810366A4 Antenna component
12/17/2008EP1739114B1 Polyimide resin, multilayer film, multilayer film with metal layer, and semiconductor device
12/17/2008EP1734542B1 Electromagnetic noise suppressing thin film
12/17/2008EP1500168B1 Completely integrated ethernet connector
12/17/2008EP1334649B1 Shielded housing
12/17/2008EP0787161B2 Low voc laminating formulations
12/17/2008CN201167455Y Apparatus for protecting printed circuit board
12/17/2008CN201167435Y Apparatus for processing backboard signal
12/17/2008CN101326867A Arrangement comprising at least one electronic component