Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
10/2008
10/30/2008WO2008128944A1 Component having a ceramic base the surface of which is metalized
10/30/2008WO2008128808A1 Module for an integrated control electronic system having a simplified design
10/30/2008WO2008128675A1 Data carrier/transmission device and method for the production thereof
10/30/2008WO2008010978A3 Metal compositions, thermal imaging donors and patterned multilayer compositions derived therefrom
10/30/2008US20080270964 Integrated Power Supply System Analysis System, Integrated Power Supply System Analysis Method, and Multilayer Printed Circuit Board
10/30/2008US20080269427 Polyphenylene ether oligomer compound, derivatives thereof and use thereof
10/30/2008US20080268710 Next High Frequency Improvement by Using Frequency Dependent Effective Capacitance
10/30/2008US20080268666 Apparatus for providing controlled impedance in an electrical contact
10/30/2008US20080268257 Printed circuits; improved heat resistance, fireproofing and stability; epoxy resin with layered silicate dispersed in 5 layers or less
10/30/2008US20080268237 Material for insulating substrate, printed board, laminate, copper foil with resin, copper-clad laminate, polyimide film for tab, and prepreg
10/30/2008US20080266825 Electronic component package, electronic component mounted apparatus, method of inspecting bonding portion therein, and circuit board
10/30/2008US20080266823 Circuit board assembly
10/30/2008US20080266822 Electronic elements carrier and manufacturing method thereof
10/30/2008US20080266816 Light-Weight Solid State Drive With Rivet Sets
10/30/2008US20080266778 Memory module routing
10/30/2008US20080265391 Etched interposer for integrated circuit devices
10/30/2008US20080265244 Alignment Tolerant Patterning on Flexible Substrates
10/30/2008US20080264687 Printed circuit board and manufacturing method thereof
10/30/2008US20080264685 Electromagnetic bandgap structure and printed circuit board
10/30/2008US20080264684 Carrier member for transmitting circuits, coreless printed circuit board using the carrier member, and method of manufacturing the same
10/30/2008US20080264683 Metal wiring plate
10/30/2008US20080264682 Substrate and negative imaging method for providing transparent conducting patterns
10/30/2008US20080264681 Printed Wiring Board and Method for Manufacturing Printed Wiring Board
10/30/2008US20080264680 Voltage-Operated Layer Arrangement
10/30/2008US20080264679 Printed Circuit Board With Combined Digital and High Frequency Applications
10/30/2008US20080264678 Member for Interconnecting Wiring Films and Method for Producing the Same
10/30/2008US20080264677 Circuit board structure having embedded capacitor and fabrication method thereof
10/30/2008US20080264676 Circuit board and method for manufaturing thereof
10/30/2008US20080264675 Printed circuit board and method for manufacturing the same
10/30/2008US20080264674 Electronic device having power connection interface
10/30/2008US20080264673 Differential signal layout printed circuit board
10/30/2008US20080264672 Photoimprintable Low Dielectric Constant Material and Method for Making and Using Same
10/30/2008DE4412364B4 Leiterplatte mit einem auf einem Träger laminierten Foliensystem Printed circuit board with a laminated on a support film system
10/30/2008DE102007020016A1 Flexibler Leiterbahnträger und Leiterbahnträgervorrichtung Flexible conductor carrier and conductor carrier device
10/30/2008DE102007019111A1 Elektronisches Bauelement Electronic component
10/30/2008DE102007019110A1 Elektronisches Bauelement Electronic component
10/30/2008DE102007017848A1 Components e.g. application-specific integrated circuit, connecting system, has arrangement of boards and switching unit forming structure such that shortest connection possibilities between adjacent components have same signal running time
10/30/2008DE102007017546A1 Multichipmodul Multi-chip module
10/30/2008DE10019840B4 Mehrschichtkondensator, dessen Verwendung als Entkopplungskondensator und eine Verdrahtungsplatine mit dem Mehrschichtkondensator A multilayer capacitor, its use as a decoupling capacitor and a wiring board having the multilayer capacitor
10/30/2008CA2679084A1 Electronic card and aircraft including same
10/29/2008EP1986481A1 Ceramic laminated device and method for manufacturing same
10/29/2008EP1986479A2 Wiring substrate and current detection device
10/29/2008EP1986478A2 Metal wiring plate
10/29/2008EP1986477A2 Connecting structure in mobile terminal RF circuits and antennas
10/29/2008EP1986319A2 Variable filter element, variable filter module and fabrication method thereof
10/29/2008EP1986260A1 Printed circuit board and fuel cell
10/29/2008EP1986244A2 Mounting structure
10/29/2008EP1985665A1 Preparing composition for composite laminates
10/29/2008EP1985654A1 Thermocurable resin composition comprising semi-ipn-type complex, and varnish, prepreg and metal-clad laminate sheet using the same
10/29/2008EP1985163A1 Flexible printed circuit board with additional functional element and a milled notch, method of production and use
10/29/2008EP1985162A2 Holder for a flexible circuit board
10/29/2008EP1984982A2 Printed circuit connector
10/29/2008EP1984211A2 Electrical power distribution unit and electrical punched grid therefor
10/29/2008EP1680795A4 Switch element
10/29/2008EP1660763B1 Adjusting device, especially for the throttle valve of an internal combustion engine
10/29/2008EP1658661B1 Lamp base for a high-pressure discharge lamp, and corresponding high-pressure discharge lamp
10/29/2008EP1334542A4 Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node
10/29/2008EP1277278A4 Isolating energy conditioning shield assembly
10/29/2008EP1264377A4 Passive electrostatic shielding structure for electrical circuitry and energy conditioning with outer partial-shielded energy pathways
10/29/2008CN201142814Y Single-plate structure
10/29/2008CN201142785Y Differential pairs compatible circuit board
10/29/2008CN201142370Y Circuit connecting structure of touch panel
10/29/2008CN201142332Y LED apparatus
10/29/2008CN201142328Y Chip module
10/29/2008CN201141563Y Circuit board assembly of low-power LED reflectoscope module group
10/29/2008CN201141553Y LED lamp with reflecting film
10/29/2008CN101297610A Bending-type rigid printed wiring board and process for producing the same
10/29/2008CN101297470A An electro-mechanical wave device
10/29/2008CN101297442A Device for plate connection
10/29/2008CN101297305A A system for mapping defective printed circuits
10/29/2008CN101297067A Method for manufacture of electrolytic copper foil, electrolytic copper foil manufactured by the method, surface-treated copper foil manufactured using the electrolytic copper foil, and copper-clad la
10/29/2008CN101296998A Resin composition, resin film, cover lay film, interlayer adhesive, metal clad laminate and multilayer printed circuit board
10/29/2008CN101296977A Composite resin molded article, laminate, multi-layer circuit board, and electronic device
10/29/2008CN101296757A Flexible laminate board, process for manufacture of the board, and flexible print wiring board
10/29/2008CN101296590A Fixing element and electronic device using the same
10/29/2008CN101296589A Fixing element and electronic device using the same
10/29/2008CN101296582A Method for replacing and mending bad circuit area on multi-layer printed circuit board
10/29/2008CN101296580A Printed circuit board, method of manufacturing the same, and apparatus for perforating via holes
10/29/2008CN101296570A Circuit board and production method thereof
10/29/2008CN101296567A Connector device, method of manufacturing the same, and battery pack using the same
10/29/2008CN101296566A Electric element carrier plate and manufacturing method thereof
10/29/2008CN101296565A Electronic component and assembling method thereof
10/29/2008CN101296564A Light source module group with excellent heat dispersion performance
10/29/2008CN101296563A Circuit board, electronic component and circuit board assembly
10/29/2008CN101296562A Copper foil substrates and method for making flexible printed circuit board of the same
10/29/2008CN101296561A Flexible printing patchboard and sliding lid type mobile phone terminal using the same
10/29/2008CN101296560A Direct insertion type chip soldering seat and direct insertion type chip assembly structure
10/29/2008CN101296559A Solder pad, circuit board and electronic device with the same
10/29/2008CN101296558A Flexible printing circuit board
10/29/2008CN101296557A Flexible printing circuit board
10/29/2008CN101296556A Flexible circuit board
10/29/2008CN101296336A Television tuner apparatus
10/29/2008CN101295725A Image capturing device
10/29/2008CN101295701A Package for semiconductor devices
10/29/2008CN101295700A Package for semiconductor devices
10/29/2008CN101295585A Capacitor, circuit board containing the capacitor, and integrated circuit bearing substrate
10/29/2008CN101295580A Capacitor devices and its manufacturing method
10/29/2008CN101295142A Printed circuit board and manufacturing method thereof
10/29/2008CN100429963C Semiconductor device and manufacturing method of the same
10/29/2008CN100429962C FPC golden finger for improving connection strength
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