Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
12/2008
12/03/2008CN100440391C Improved method for forming magnetic layers in printed circuit boards
12/03/2008CN100440227C Printed circuit board design method, program thereof, recording medium containing the program, printed circuit board design device using them, and CAD system
12/03/2008CN100439428C Polymer composite formed article, printed wiring board using the formed article and method for producing them
12/02/2008US7460381 Programmable power supply
12/02/2008US7460112 Electro-optical module, power supply substrate, wiring substrate, and electronic apparatus
12/02/2008US7459987 Electrical adaption network with a transformation line
12/02/2008US7459986 Method and apparatus for rejecting common mode signals on a printed circuit board and method for making same
12/02/2008US7459765 Semiconductor apparatus with decoupling capacitor
12/02/2008US7459640 NEXT high frequency improvement using hybrid substrates of two materials with different dielectric constant frequency slopes
12/02/2008US7459638 Absorbing boundary for a multi-layer circuit board structure
12/02/2008US7459637 Semiconductor device, manufacturing method thereof, circuit board, and electronic appliance
12/02/2008US7459217 Flame retardant polyester film and processed product including the same
12/02/2008US7459216 Polyimide copolymer and metal laminate using the same
12/02/2008US7459202 Printed circuit board
12/02/2008US7459201 Compound for forming wiring conductor, fabrication method of circuit board using the same and circuit board
12/02/2008US7459200 Circuit board design
12/02/2008US7459055 Bonding structure with buffer layer and method of forming the same
12/02/2008US7459044 Sheet material especially useful for circuit boards
12/02/2008US7458146 Method for manufacturing image display unit
11/2008
11/27/2008WO2008143359A1 Electronic circuit device
11/27/2008WO2008143196A1 Polyphenylene ether resin composition
11/27/2008WO2008143138A1 Wiring substrate, semiconductor package, and electronic device
11/27/2008WO2008143099A1 Laminated wiring board and method for manufacturing the same
11/27/2008WO2008143076A1 Metal base circuit board
11/27/2008WO2008141898A2 Method for producing an electronic assembly
11/27/2008WO2008141674A1 Illumination device and projection device with such an illumination device
11/27/2008WO2008122347A3 Sheet-shaped support comprising a printed conductor, and method for the production of said support
11/27/2008WO2008113767A3 Method of manufacturing a printed circuit board
11/27/2008WO2008103195A3 Flexible circuit electrode array
11/27/2008WO2008098272A8 Method for producing a flexi-rigid printed circuit board and flexi-rigid printed circuit board
11/27/2008WO2008059342A8 Method of treating a material, the so obtained treated material and devices containing said material
11/27/2008US20080293268 Distribution connecting module
11/27/2008US20080293261 Arrangement of at least one power semiconductor module and a printed circuit board
11/27/2008US20080293239 Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment
11/27/2008US20080293168 Method and system of tape automated bonding
11/27/2008US20080291650 Arrangement Having an Electric Motor and a Main Printed Circuit Board, and an Assembly Method
11/27/2008US20080291649 Capacitor built-in substrate and method of manufacturing the same and electronic component device
11/27/2008US20080291645 Interface retention and support apparatus and method of use
11/27/2008US20080291380 Flexible print circuit and liquid crystal display device
11/27/2008US20080290342 Methods and apparatus for a flexible circuit interposer
11/27/2008US20080289868 Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof
11/27/2008US20080289867 Multi-strand substrate for ball-grid array assemblies and method
11/27/2008US20080289866 Wiring Board and Wiring Board Manufacturing Method
11/27/2008US20080289865 Method for Manufacturing Dielectric Layer Constituting Material, Dielectric Layer Constituting Material Obtained Thereby; Method for Manufacturing Capacitor Circuit Forming Piece Using Dielectric Layer Constituting Material, Capacitor Circuit Forming Piece Obtained Thereby; and Multi-Layer Printed Wiring Board Obtained by Using Dielectric Layer Constituting Material and/or Capacitor Circuit Forming Piece
11/27/2008US20080289864 Printed wiring board and method for producing the same
11/27/2008US20080289863 Surface finish structure of multi-layer substrate and manufacturing method thereof
11/27/2008US20080289862 Electronic component package
11/27/2008US20080289861 Multi-Layer Flexible Printed Circuit Board and Method For Manufacturing the Same
11/27/2008US20080289860 Flexible printed wiring board, multilayered flexible printed wiring board, and mobile telephone terminal employing multilayered flexible printed wiring board
11/27/2008US20080289859 Flex-Rigid Wiring Board and Manufacturing Method Thereof
11/27/2008US20080289858 Printed circuits and method for making same
11/27/2008DE102007024189A1 Verfahren zur Herstellung einer elektronischen Baugruppe A process for preparing an electronic assembly
11/27/2008DE102007023860A1 Circuit module for assembling an electronic circuit, particularly radio frequency identification-tags formed as multi-layer bodies, has base electrode layer formed from electrically conductive material with two base electrodes
11/27/2008DE102007002323B4 Waschbares Elektronik-Flachsystem mit freien Anschlusskontakten zur Integration in ein textiles Material oder Flexmaterial Washable electronics flat system with free terminal contacts for integration into a textile material, or Flex material
11/27/2008DE102005008885B4 Lichtgitter Light Curtains
11/27/2008DE102005005304B4 Steckkartenförmige Brennstoffzellenbatterie und deren Baugruppe Cards shaped fuel cell battery and battery assembly
11/27/2008CA2688717A1 System and method for automation of hardware signal characterization and signal integrity verification
11/27/2008CA2687532A1 Metal base circuit board
11/26/2008EP1995999A2 Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate
11/26/2008EP1995998A1 Offset footprint of a connector on a printed board
11/26/2008EP1995776A1 Semiconductor package mounting apparatus
11/26/2008EP1995775A2 Semiconductor device with stress reducing element
11/26/2008EP1995615A1 Photo/electrical mixed mounting substrate and method for producing the same
11/26/2008EP1995354A1 Surface treated elctrolytic copper foil and process for producing the same
11/26/2008EP1995271A1 Epoxy resin curable composition for prepreg
11/26/2008EP1995053A1 Porous film and layered product including porous film
11/26/2008EP1994809A2 Configurable chassis guidance system
11/26/2008EP1364566B1 Electronic component, component mounting equipment, and component mounting method
11/26/2008EP1245379B1 Laminate and process for producing the same
11/26/2008EP1222725B8 Universal multi-functional common conductive shield structure for electrical circuitry and energy conditioning
11/26/2008CN201156839Y Ultra-compact ballast for energy-saving lamp
11/26/2008CN101313635A Apparatus and method for impedance matching in a backplane signal channel
11/26/2008CN101313033A Curable resin composition and its uses
11/26/2008CN101312638A Heat radiating module and electronic combination applying the same
11/26/2008CN101312620A Manufacturing process for metal circuit of multi-layer substrate and construction thereof
11/26/2008CN101312619A Manufacturing method for multi-layer high-density interconnected printed circuit board
11/26/2008CN101312617A Insulating medium layer manufacturing method of high-density printed circuit board
11/26/2008CN101312616A Circuit board etching method
11/26/2008CN101312615A Printed circuit board and manufacturing method thereof
11/26/2008CN101312614A Embedded resistor devices
11/26/2008CN101312610A Circuit board preventing electro-static discharge
11/26/2008CN101312175A Semiconductor memory device, memory support and memory module
11/26/2008CN101312173A Semiconductor chip package substrate and its solder mat structure
11/26/2008CN101312086A Electric resistance layout manufacture method and its structure
11/26/2008CN100438727C Wiring structure of printed circuit board transmission line
11/26/2008CN100438724C Method for producing wiring base plate
11/26/2008CN100438723C Manufacture of PCB with resistors embedded
11/26/2008CN100438721C Electronic component module and electronic device using the same
11/26/2008CN100438720C Integrated electronic module structure for vehicles
11/26/2008CN100438719C Hybrid integrated circuit device and method of manufacturing the same
11/26/2008CN100438323C Resistor for controlling fan motor rotational speed in air conditioning device
11/26/2008CN100438218C Fixing member and fixing structure
11/26/2008CN100438102C Metal base circuit substrate for an optical device and method manufacturing the aforementioned substrate
11/26/2008CN100438089C Light semiconductor device and optical signal input and output device
11/26/2008CN100438007C Interconnecting substrate and semiconductor device
11/26/2008CN100438002C Wire-layingout plate and its making method, semiconductor device and its making method
11/26/2008CN100437988C Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus
11/26/2008CN100437986C 复合电子部件 Composite electronic component
11/26/2008CN100437956C Method for manufacturing semiconductor device
11/26/2008CN100437667C Flexible circuit board and display
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