Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
10/2008
10/15/2008CN101286457A Wiring board and method of manufacturing the same
10/15/2008CN101286456A Wiring board manufacturing method, semiconductor device manufacturing method and wiring board
10/15/2008CN101286208A Double beam switch contact
10/15/2008CN101285921A Image-forming module group
10/15/2008CN101285919A Camera module
10/15/2008CN100426942C Method for making circuit substrate
10/15/2008CN100426592C Component for a printed circuit board and method for fitting a printed circuit board with this component
10/15/2008CN100426499C An electronic assembly and circuit board for same
10/15/2008CN100426498C Substrate of display device for packaging driving integrated circuit
10/15/2008CN100426492C Direct build-up layer on encapsulated die package
10/15/2008CN100426491C Package substrate
10/15/2008CN100426381C An improved electrical connection between a suspension flexure cable and a head stack flexure circuit
10/15/2008CN100426093C Liquid crystal display device
10/15/2008CN100426092C Back light module and light source structure thereof
10/15/2008CN100426054C Image display device
10/15/2008CN100426032C Optoelectronic flip-chip package with optical waveguide accomodated in upper layers of substrate board
10/15/2008CN100425782C Faade covering
10/15/2008CN100425668C Flame retardant adhesive without halogen in use for flexible printed circuit
10/15/2008CN100425377C Method for mfg. metal powder
10/14/2008US7437030 Substrate for mounting IC chip, substrate for motherboard, device for optical communication, manufacturing method of substrate for mounting IC chip, and manufacturing method of substrate for motherboard
10/14/2008US7436683 Wafer level packaging structure with inductors and manufacture method thereof
10/14/2008US7436681 Wiring board with built-in capacitor
10/14/2008US7436680 Multi-chip build-up package of optoelectronic chip
10/14/2008US7436675 Constant current class 3 lighting system
10/14/2008US7436467 Display device with grounding protrusion
10/14/2008US7436267 Microstrip line dielectric overlay
10/14/2008US7436057 Elastomer interposer with voids in a compressive loading system
10/14/2008US7435914 Tape substrate, tape package and flat panel display using same
10/14/2008US7435913 Slanted vias for electrical circuits on circuit boards and other substrates
10/14/2008US7435912 Tailoring via impedance on a circuit board
10/14/2008US7435911 Printed circuit board including embedded capacitor and method of fabricating same
10/14/2008US7435910 Multilayer printed circuit board
10/14/2008US7435535 Method for forming patterned insulating elements and methods for making electron source and image display device
10/14/2008US7435506 Battery pack
10/14/2008US7435143 Fixture for optoelectronic components such as PLCC2-type and PLCC4-type light emitting diodes
10/14/2008US7435108 Variable width resilient conductive contact structures
10/14/2008US7435106 Cable connector assembly with internal printed circuit board
10/14/2008US7435100 Socket having stand-offs
10/14/2008US7434736 Securing device for a security module connector
10/09/2008WO2008121394A1 Method of producing a multi-turn coil from folded flexible circuitry
10/09/2008WO2008120513A1 Electrode terminal connecting structure of multilayer substrate
10/09/2008WO2008120342A1 Electronic device, and printed circuit unit
10/09/2008WO2008120280A1 Distortion reduction fixing structure
10/09/2008WO2008119803A1 Method for producing a base laminate
10/09/2008WO2008119586A1 Method for the production of an electronic assembly, and electronic assembly
10/09/2008WO2008091494A3 Treatment of micropores in mica materials
10/09/2008WO2007140495A3 Method for manufacturing a circuit carrier
10/09/2008WO2006086505A3 Privacy protected cooperation network
10/09/2008WO2005015477A3 Circuit forming system and method
10/09/2008US20080250263 Integrated Circuit Input/Output Interface with Empirically Determined Delay Matching
10/09/2008US20080248661 Circuit board assembly with light emitting element
10/09/2008US20080248326 Includes metal plate, ceramic base plate joined to the metal plate, and a release agent; used in semiconductor device for controlling high current and high voltage of for example, an electric automobile or an electric rolling stock
10/09/2008US20080248266 Method of manufacturing laminated material for security tag
10/09/2008US20080248231 Double-sided pressure-sensitive adhesive tape or sheet for use in wiring circuit board and wiring circuit board having the double-sided pressure-sensitive adhesive tape
10/09/2008US20080247580 Hearing Aid Using Printed Circuit Board
10/09/2008US20080247145 Integrated circuit carrier arrangement with electrical connection islands
10/09/2008US20080247144 Integrated circuit carrier assembly
10/09/2008US20080247142 Electronic Module and Method for Producing Such a Module
10/09/2008US20080246140 Semiconductor device
10/09/2008US20080245559 Variable interconnect geometry for electronic packages and fabrication methods
10/09/2008US20080245558 Via structure of printed circuit board
10/09/2008US20080245555 Circuit substrate with plated through hole structure and method
10/09/2008US20080245554 Fabrication method and structure of pcb assembly, and tool for assembly thereof
10/09/2008US20080245553 Interconnection, electronic device and method for manufacturing an electronic device
10/09/2008US20080245552 Printed wiring board with enhanced structural integrity
10/09/2008US20080245551 Circuit board structure for embedding semiconductor chip therein and method for fabricating the same
10/09/2008US20080245467 Low loss glass-ceramic materials, method of making same and electronic packages including same
10/09/2008DE10354694C5 Induktiver Sensor Inductive sensor
10/09/2008DE102007016475A1 Anschlusseinheit für einen Drucksensor Connection unit for a pressure sensor
10/09/2008DE102007015819A1 Verfahren zur Herstellung einer elektronischen Baugruppe sowie elektronische Baugruppe A process for preparing an electronic assembly and electronic assembly
10/09/2008DE102007011811A1 Kupfer-Inlay für Leiterplatten Copper inlay for printed circuit boards
10/08/2008EP1978792A1 Substrate structure and electronic device
10/08/2008EP1978473A2 Manufacturing method for a wireless communication device and manufacturing apparatus
10/08/2008EP1977633A2 Substrates for electronic circuitry type applications
10/08/2008EP1589582B1 Wiring substrate and radiation detector using same
10/08/2008EP1448948A4 Guided munitions electronics package and method
10/08/2008CN201131083Y Circuit board moistureproof anti-dust device having components
10/08/2008CN201131082Y Process board for preventing thermal expansion
10/08/2008CN201129643Y Light source module group and back light module group with the same
10/08/2008CN101283630A Method for reducing the inductance in series with a decoupling capacitor for a BGA chip and corresponding assembly
10/08/2008CN101282861A Control assembly, in particular for motor vehicle steering column top portion
10/08/2008CN101282622A Circuit board and method for manufacturing the same
10/08/2008CN101282614A Printed circuit board with improved via hole
10/08/2008CN101282613A 悬浮用基板 Suspended substrate
10/08/2008CN101281896A Flexible circuit board
10/08/2008CN101281895A Electric connecting structure of circuit board embedding with semiconductor chip
10/08/2008CN101281894A Semiconductor component bearing structure and splicing structure
10/08/2008CN101281889A Loading plate structure for embedded burying semiconductor chip
10/08/2008CN101281872A Wiring substrate and wiring substrate manufacturing method
10/08/2008CN101281344A Camera device and autodyne counting backwards method thereof
10/08/2008CN101280107A Polyimide resin, flexible copper clad laminate made therefrom and preparation of the flexible copper clad laminate
10/08/2008CN101280093A Halogen-free flame-retardant epoxy resin composition, flexible copper clad laminate made therefrom and preparation of the flexible copper clad laminate
10/08/2008CN101279818A Inorganic composition article
10/08/2008CN100425108C Method of mounting condenser microphone on main PCB and condenser microphone adapted for the same
10/08/2008CN100425107C High-speed printed circuit board with earth layer in microwave photon crystalline structure
10/08/2008CN100424866C Tape circuit substrate and semiconductor chip package using the same
10/08/2008CN100424844C Design method for plating of printed circuit board strip and manufacturing method of semiconductor chip package using the same
10/08/2008CN100424226C Method for electroless metalisation of polymer substrate
10/08/2008CN100424110C Resin composition for printed wiring board, prepreg, and laminate obtained with the same
10/07/2008US7433655 Battery-operated wireless-communication apparatus and method
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