| Patents for H05K 1 - Printed circuits (98,583) |
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| 02/04/2009 | CN101359640A Circuit board overlapping construction having embedded semi-conductor element |
| 02/04/2009 | CN101359639A Circuit board construction embedded with semi-conductor chip and preparation thereof |
| 02/04/2009 | CN101359477A Suspension board with circuit |
| 02/04/2009 | CN101359319A Interface device, equipment and system |
| 02/04/2009 | CN101359081A Camera module |
| 02/04/2009 | CN101359080A Camera module |
| 02/04/2009 | CN101358050A Conductive pattern formation ink, conductive pattern and wiring substrate |
| 02/04/2009 | CN101358035A Production process tape for film-shaped wiring board |
| 02/04/2009 | CN100459828C Printing circuit board |
| 02/04/2009 | CN100459824C High-layer circuit board and its manufacturing method |
| 02/04/2009 | CN100459394C Control unit and compressor used thereby |
| 02/04/2009 | CN100459294C Connection device for flexible circuit |
| 02/04/2009 | CN100459191C Production method of circuit board for light emitting body, precursor of circuit board for light emitting body and circuit board for light emitting body |
| 02/04/2009 | CN100459110C Electronic part mounting substrate and semiconductor device |
| 02/04/2009 | CN100459085C Method for manufacturing substrate of embedded element |
| 02/04/2009 | CN100459084C Method for manufacturing substrate of embedded element |
| 02/04/2009 | CN100459083C Method for manufacturing substrate of embedded element |
| 02/04/2009 | CN100458484C Opto-electronical board and manufacture method thereof |
| 02/04/2009 | CN100457806C Porous membrane of poly(metaphenylene isophthalamide) and process for producing the same |
| 02/03/2009 | US7486921 Method of producing electronic circuit, and electronic circuit substrate |
| 02/03/2009 | US7486522 Automated circuit board assembly positioning system |
| 02/03/2009 | US7486348 Liquid crystal display device |
| 02/03/2009 | US7486346 Portable data carrier with a display device having a reflection layer as a separate component and applied separately from the display device |
| 02/03/2009 | US7485951 Modularized die stacking system and method |
| 02/03/2009 | US7485848 Optical device and production method thereof |
| 02/03/2009 | US7485812 Single or multi-layer printed circuit board with improved via design |
| 02/03/2009 | US7485489 Electronics circuit manufacture |
| 02/03/2009 | US7485362 Nanoporous laminates |
| 02/03/2009 | CA2472750C High density area array solder microjoining interconnect structure and fabrication method |
| 02/03/2009 | CA2440357C Improvements in and relating to smoke detectors |
| 01/30/2009 | CA2638244A1 Electrosurgical systems and printed circuit boards for use therewith |
| 01/29/2009 | WO2009014126A1 Multilayer wiring board |
| 01/29/2009 | WO2009014092A1 Ceramic substrate, process for producing the same, and dielectric-porcelain composition |
| 01/29/2009 | WO2009013988A1 Print circuit board and electronic device using the same |
| 01/29/2009 | WO2009013694A2 Electronic apparatus comprising a bent pcb |
| 01/29/2009 | WO2009012914A1 Illumination device |
| 01/29/2009 | WO2008145881A3 Device for the protection of an electronic component |
| 01/29/2009 | US20090029574 Board Connector |
| 01/29/2009 | US20090028496 Electro-optical printed circuit board, a blank and a method of making an electro-optical printed circuit board |
| 01/29/2009 | US20090027913 Lighting Arrangement for an Automotive Vehicle |
| 01/29/2009 | US20090027864 Printed circuit board and manufacturing method thereof |
| 01/29/2009 | US20090027839 Display device |
| 01/29/2009 | US20090027144 Printed wiring board |
| 01/29/2009 | US20090027137 Tapered dielectric and conductor structures and applications thereof |
| 01/29/2009 | US20090026620 Method for cutting multilayer substrate, method for manufacturing semiconductor device, semiconductor device, light emitting device, and backlight device |
| 01/29/2009 | US20090025972 Solder Mounting Structure, Manufacturing Method and Apparatus of the Solder Mounting Structure, Electronic Apparatus, and Wiring Board |
| 01/29/2009 | US20090025971 Electronic component-embedded board and method of manufacturing the same |
| 01/29/2009 | US20090025970 Multilayer Wiring Board, and Electronic Module and Electronic Device Including the Multilayer Wiring Board |
| 01/29/2009 | US20090025969 Dual cavity, high-heat dissipating printed wiring board assembly |
| 01/29/2009 | US20090025968 Wired circuit board and producing method thereof |
| 01/29/2009 | US20090025967 Methods for attachment and devices produced using the methods |
| 01/29/2009 | US20090025966 Fiber-resin composite, laminate, printed wiring board, and method for manufacturing printed wiring board |
| 01/29/2009 | US20090025965 Assembly substrate and method of manufacturing the same |
| 01/29/2009 | US20090025964 Circuit substrate and method for fabricating inductive circuit |
| 01/29/2009 | US20090025963 Wired circuit board and production method thereof |
| 01/29/2009 | US20090025962 Electronic Module Expansion Bridge |
| 01/29/2009 | US20090025961 Electronic component-embedded board and method of manufacturing the same |
| 01/29/2009 | US20090025960 Cable-type composite printed wiring board, cable component, and electronic device |
| 01/29/2009 | US20090025216 Multi-layer printed wiring board including an alighment mark as an index for a position of via holes |
| 01/29/2009 | US20090025204 Microstrip line dielectric overlay |
| 01/29/2009 | DE112007000112T5 Passive Impedanzentzerrung von seriellen Hochgeschwindigkeitsverbindungen Passive impedance equalization of high-speed serial links |
| 01/29/2009 | DE10258090B4 Verfahren zur Herstellung von starr-flexiblen Leiterplatten und Leiterplatten mit mindestens einem starren Bereich und mindestens einem flexiblen Bereich Process for the preparation of rigid-flex circuits and printed circuit boards with at least one rigid portion and at least one flexible area |
| 01/29/2009 | DE102008022087A1 Terminationskompensation für differentielle Signale auf Glas Terminationskompensation for differential signals on glass |
| 01/29/2009 | DE102007035181A1 Verfahren zur Herstellung eines Moduls und Modul A process for preparing a module and module |
| 01/29/2009 | DE102007035060A1 Connection for semiconductor component with carrier element, has holes arranged one above other in semiconductor component and carrier element, where hole of semiconductor component is conically formed |
| 01/28/2009 | EP2019571A2 Electronic component-embedded board and method of manufacturing the same |
| 01/28/2009 | EP2019494A1 High-frequency switch module |
| 01/28/2009 | EP2019327A1 Optoelectric hybrid film and electronic apparatus receiving the same |
| 01/28/2009 | EP2018796A1 Thermal surface mounting of multiple leds onto a heatsink |
| 01/28/2009 | EP2018666A2 Method for fixing an electronic component on a printed circuit board and system comprising a printed circuit board and at least one electronic component |
| 01/28/2009 | EP1335831A4 A method of manufacturing a fabric article to include electronic circuitry and an electrically active textile article |
| 01/28/2009 | EP1166385B1 Inverted microstrip transmisson line integrated in a multilayer structure |
| 01/28/2009 | CN201188722Y Printed circuit board and connection structure thereof |
| 01/28/2009 | CN201188721Y Protective structure for circuit board of electronic device |
| 01/28/2009 | CN201188720Y Half-finished product printed circuit board combining rigidity and flexibility as well as rigid layer used by the circuit board |
| 01/28/2009 | CN201188719Y Printed circuit board and mounting structure thereof |
| 01/28/2009 | CN201188718Y Equispaced printed circuit board |
| 01/28/2009 | CN201188717Y Flexible circuit board |
| 01/28/2009 | CN201188716Y Electronic band gap power supply plane apparatus |
| 01/28/2009 | CN201187740Y LED lamp |
| 01/28/2009 | CN201187696Y Flexible circuit board of LED illumination array |
| 01/28/2009 | CN201187694Y Strip-shaped LED lighting lamp |
| 01/28/2009 | CN101356865A Method and apparatus for using flex circuit technology to create an electrode |
| 01/28/2009 | CN101356864A Copper clad laminate for pasting chip on flexible plate |
| 01/28/2009 | CN101356863A Method of making a fiber reinforced printed circuit board panel and a fiber reinforced panel made according to the method |
| 01/28/2009 | CN101356862A Electronic circuit arrangement and method for producing an electronic circuit arrangement |
| 01/28/2009 | CN101356640A Electronic component mounting board and method for manufacturing such board |
| 01/28/2009 | CN101356219A Flame retardant compositions with a phosphorated compound |
| 01/28/2009 | CN101356055A Stainless steel substrate with conductive metal layer, hard disk suspension material and hard disk suspension manufactured by using the material |
| 01/28/2009 | CN101355860A Electronic device and flexible circuit board |
| 01/28/2009 | CN101355858A Electronic component-embedded board and method of manufacturing the same |
| 01/28/2009 | CN101355857A Electronic component-embedded board and method of manufacturing the same |
| 01/28/2009 | CN101355855A Method for directly silk-printing and shaping embedding resistance on a printed circuit board using stainless steel net |
| 01/28/2009 | CN101355853A Producing method of wired circuit board |
| 01/28/2009 | CN101355851A Cable-type composite printed wiring board, cable component, and electronic device |
| 01/28/2009 | CN101355850A Assembly substrate and method of manufacturing the same |
| 01/28/2009 | CN101355849A Wired circuit board and producing method thereof |
| 01/28/2009 | CN101355848A Printed circuit board, solder connection structure and method between printed circuit board and flexible printed circuit board |
| 01/28/2009 | CN101355847A Printed circuit board and manufacturing method thereof |
| 01/28/2009 | CN101355846A Heat transmission and heat-dissipating structure for substrate |