| Patents for H05K 1 - Printed circuits (98,583) |
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| 11/11/2008 | US7450390 Programmable power supply |
| 11/11/2008 | US7450025 Level/position sensor and related electronic circuitry for interactive toy |
| 11/11/2008 | US7449982 Systems and methods for blocking microwave propagation in parallel plate structures |
| 11/11/2008 | US7449978 Printed substrate, and electronic component having shield structure |
| 11/11/2008 | US7449791 Printed circuit boards and method of producing the same |
| 11/11/2008 | US7449781 Printed wiring board |
| 11/11/2008 | US7449641 High-speed signal transmission structure having parallel disposed and serially connected vias |
| 11/11/2008 | US7449419 Glass compositions, glass fibers, and methods of inhibiting boron volatization from glass compositions |
| 11/11/2008 | US7449405 Method for producing bumps on an electrical component |
| 11/11/2008 | US7449364 Device and method for including passive components in a chip scale package |
| 11/11/2008 | US7448909 Preferential via exit structures with triad configuration for printed circuit boards |
| 11/11/2008 | US7448132 Method of fabricating a high-layer-count backplane |
| 11/11/2008 | US7448126 Coupler resource module |
| 11/06/2008 | WO2008133612A1 Electrically conductive composition for via-holes |
| 11/06/2008 | WO2008133261A1 Bump structure and method for manufacturing the same |
| 11/06/2008 | WO2008133246A1 Epoxy resin composition, resin film, prepreg, and multilayer printed circuit board |
| 11/06/2008 | WO2008133243A1 Bst dielectric layer, capacitor layer-forming material comprising the bst dielectric layer, capacitor layer-forming member with electrode circuit, and printed wiring board having built-in capacitor circuit |
| 11/06/2008 | WO2008133186A1 Circuit connecting adhesive film, connecting structure and method for manufacturing the connecting structure |
| 11/06/2008 | WO2008133182A1 Metal-resin laminate |
| 11/06/2008 | WO2008132914A1 Polyimide composition and flexible wiring board |
| 11/06/2008 | WO2008132832A1 Conductive paste composition for via hole filling, printed board using the same, and method for manufacturing the printed board |
| 11/06/2008 | WO2008132169A1 Preparing composition for composite laminates |
| 11/06/2008 | WO2008132055A1 Chip resistor substrat |
| 11/06/2008 | WO2008131998A2 Flexible conductor carrier and conductor carrier device |
| 11/06/2008 | WO2008131711A1 Circuit board comprising a bendable plug connection and method for the production of such a plug connection |
| 11/06/2008 | WO2008102326A3 In-grid decoupling for ball grid array (bga) devices |
| 11/06/2008 | WO2008098060A3 Enhanced localized distributive capacitance for circuit boards |
| 11/06/2008 | WO2008057680A3 Display system |
| 11/06/2008 | WO2007034377A3 Composite layer having improved adhesion, and fluid focus lens incorporating same |
| 11/06/2008 | US20080273830 System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards |
| 11/06/2008 | US20080273313 Carrier with embedded component and method for fabricating the same |
| 11/06/2008 | US20080273311 Enhanced Localized Distributive Capacitance for Circuit Boards |
| 11/06/2008 | US20080273157 Display device having misalignment detection pattern for detecting misalignment between conductive layer and insulating layer |
| 11/06/2008 | US20080272685 Dispay unit |
| 11/06/2008 | US20080271914 Printed wiring board and information processing apparatus |
| 11/06/2008 | US20080271913 Three-Dimensional Wiring Body for Mounting Electronic Component and Electronic Component Mounting Structure |
| 11/06/2008 | US20080271912 Printed circuit board and manufacturing method thereof |
| 11/06/2008 | US20080271911 Submerged Electrode and Material Thereof |
| 11/06/2008 | US20080271806 Glass cloth and film substrate using the same |
| 11/06/2008 | DE19750605B4 Verfahren zum temporären Aufbringen von zusätzlichen Informationen auf Gegenstände bei deren Herstellung A method for temporary application of additional information on items during their preparation |
| 11/06/2008 | DE102007020475A1 Verfahren zur Herstellung einer Leiterplatte mit einer Kavität für die Integration von Bauteilen und Leiterplatte und Anwendung A process for producing a circuit board having a cavity for the integration of components and printed circuit board and application |
| 11/06/2008 | DE102007020466A1 Leiterplatte mit abknickbarer Steckverbindung und das Verfahren zur Herstellung derartiger Steckverbindung Hinged circuit board with connector and method of making such connector |
| 11/06/2008 | DE102007014789B3 Anordnung mindestens eines Leistungshalbleitermoduls und einer Leiterplatte und Leistungshalbleitermodul Arranging at least one power semiconductor module and a printed circuit board and the power semiconductor module |
| 11/05/2008 | EP1988759A1 Connection portion of circuit board and connection structure of circuit board |
| 11/05/2008 | EP1988758A1 Printed wiring board and process for producing the same |
| 11/05/2008 | EP1987960A1 Conductive ink and conductor |
| 11/05/2008 | EP1719215B1 Methods and apparatus for reducing crosstalk in electrical connectors |
| 11/05/2008 | EP1579204B1 Manufacture of electrochemical sensors by moveable flat screen printing |
| 11/05/2008 | EP1550176B1 Electronic circuitry provided with an integrated antenna |
| 11/05/2008 | EP1357597B1 Voltage converter module |
| 11/05/2008 | EP1073781B2 Method of electrophoretic deposition of ceramic bodies for use in manufacturing dental appliances |
| 11/05/2008 | CN201146631Y Printed circuit board, production board and electronic apparatus with the printed circuit board |
| 11/05/2008 | CN201146630Y Electron carrier plate and pad-soldering structure |
| 11/05/2008 | CN201145233Y Energy-saving LED daylight lamp with large quadrant angle and strong luminous intensity |
| 11/05/2008 | CN201145225Y Small power LED illuminating bulb |
| 11/05/2008 | CN101300718A Holding member, packaging structure, and electronic component |
| 11/05/2008 | CN101300375A Method for forming metal film and method for forming metal pattern |
| 11/05/2008 | CN101300134A Laminate for printed wiring board, printed wiring board using same, method for manufacturing printed wiring board, electrical component, electronic component, and electrical device |
| 11/05/2008 | CN101299907A Circuit board assembly with light emitting element |
| 11/05/2008 | CN101299906A Electronic component module and electronic device using the same |
| 11/05/2008 | CN101299905A Circuit board and manufacturing method thereof |
| 11/05/2008 | CN101299904A Electromagnetic bandgap structure and printed circuit board |
| 11/05/2008 | CN101299903A Electromagnetic bandgap structure and printed circuit board |
| 11/05/2008 | CN101299902A Circuit structure of circuit board and circuit technique thereof |
| 11/05/2008 | CN101299115A Backlight for a display device with improved filtering and method for constructing the same |
| 11/05/2008 | CN100431397C Multilayer ceramic electronic part, circuit board and method for producing ceramic green sheet used for manufacturing those part and circuit board |
| 11/05/2008 | CN100431395C Method of making substrate for flexible circuit board |
| 11/05/2008 | CN100431394C Substrate with composite medium and multilayer substrate made by the same |
| 11/05/2008 | CN100431144C Package substrate |
| 11/05/2008 | CN100431120C Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment |
| 11/05/2008 | CN100431074C Capacitor and capacitor built-in circuit substrate and its producing method |
| 11/05/2008 | CN100431069C Thin film capacitor, and electronic circuit component |
| 11/05/2008 | CN100430828C Composition having permitivity being radiation-sensitively changeable and method for forming permitivity pattern |
| 11/05/2008 | CN100430427C Electronic material composition, electronic product and method of using electronic material composition |
| 11/04/2008 | US7448016 Pad layouts of a printed circuit board |
| 11/04/2008 | US7447440 Multiple channel optical transceiver modules |
| 11/04/2008 | US7447327 Flexible PCB voice coil connector |
| 11/04/2008 | US7447044 Fixing mechanism for printed circuit board |
| 11/04/2008 | US7447040 Flexible printed circuit board for electronic equipment |
| 11/04/2008 | US7447039 Motherboard configured to minimize or prevent damage to a chip thereon |
| 11/04/2008 | US7447038 Module |
| 11/04/2008 | US7447037 Single chip USB packages by various assembly methods |
| 11/04/2008 | US7446421 Bonding structure with buffer layer and method of forming the same |
| 11/04/2008 | US7446388 Integrated thin film capacitor/inductor/interconnect system and method |
| 11/04/2008 | US7446383 Electronic device mountable onto a substrate using surface mount techniques, and method |
| 11/04/2008 | US7446263 Multilayer printed circuit board |
| 11/04/2008 | US7446262 Laminated electronic component and method for producing the same |
| 11/04/2008 | US7446261 Flexible circuit boards with tooling cutouts for optoelectronic modules |
| 11/04/2008 | US7446154 Photocurable; suitable for electronics requiring a low dielectric constant, a low dielectric loss tangent and high toughness; compatible with thermosetting resin; soluble in methyl ethyl ketone solvent; hydroxy end groups reacted with epichlorohydrin and then acrylic acid |
| 11/04/2008 | US7446030 Methods for fabricating current-carrying structures using voltage switchable dielectric materials |
| 11/04/2008 | US7445731 Comprising metallic particles deposited by reducing metallic ions in water and having primary-particle diameter of at most 200 nm, dispersant having molecular weight of 200 to 30,000, and dispersion medium made of mixed solvent of water and water-soluble organic solvent; easy in handling; circuits, films |
| 11/04/2008 | US7445462 Method of connecting signal lines, a printed circuit board assembly and electronic apparatus having the same |
| 11/04/2008 | US7445460 Electrical connector with contact fall-out preventing arrangement |
| 11/04/2008 | CA2264229C A reinforcement mat |
| 10/30/2008 | WO2008130299A1 A printed board assembly and a method |
| 10/30/2008 | WO2008129831A1 Wiring board |
| 10/30/2008 | WO2008129815A1 Prepreg with carrier, method for manufacturing the prepreg, multilayered printed wiring board, and semiconductor device |
| 10/30/2008 | WO2008129621A1 Connecting structure between circuit substrate terminals |
| 10/30/2008 | WO2008129155A2 Electronic card and aircraft including same |
| 10/30/2008 | WO2008128945A1 Component having a ceramic base with a metalized surface |