| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 12/17/2008 | CN101326864A Padless substrate for surface mounted components |
| 12/17/2008 | CN101326660A Battery with leads |
| 12/17/2008 | CN101325860A Electronic device with passive heat radiation mechanism |
| 12/17/2008 | CN101325846A 多层配线基板及其制造方法 A multilayer wiring board and its manufacturing method |
| 12/17/2008 | CN101325841A Circuit board and display device |
| 12/17/2008 | CN101325840A Anti-oxidization printed circuit board and gold finger thereof as well as method for manufacturing the printed circuit board |
| 12/17/2008 | CN101325839A Method for assembling electronic part and locating structure thereof |
| 12/17/2008 | CN101325838A Flexible circuit board structure |
| 12/17/2008 | CN101325296A Electric Connector |
| 12/17/2008 | CN101325228A LED structure and combination method thereof |
| 12/17/2008 | CN101325192A Substrate easy to measure temperature and manufacturing method thereof |
| 12/17/2008 | CN101325187A Multi-layer substrate surface treating layer structure and manufacturing method thereof |
| 12/17/2008 | CN101325163A Memory card and manufacturing method thereof |
| 12/17/2008 | CN101325128A Composite for forming dielectric and product with the composite |
| 12/17/2008 | CN101324725A LCD device and backlight device |
| 12/17/2008 | CN101324724A Backlight unit and liquid crystal display device including the same |
| 12/17/2008 | CN101323760A Double-sided pressure-sensitive adhesive tape or sheet and wiring circuit board having the double-sided pressure-sensitive adhesive tape |
| 12/17/2008 | CN100444708C Method of soldering the constituent layers of a multilayer printed circuit and the machine used for same |
| 12/17/2008 | CN100444702C Printed circuit board having axially parallel via holes |
| 12/17/2008 | CN100444374C Printed circuit board and electronic apparatus including printed circuit board |
| 12/17/2008 | CN100444373C Void-free circuit board and semiconductor package having the same |
| 12/17/2008 | CN100444372C Semiconductor package and manufacturing method therefor |
| 12/17/2008 | CN100444356C Power module and method of manufacturing the same |
| 12/17/2008 | CN100444340C Manufacturing method of semiconductor device and semiconductor device |
| 12/16/2008 | US7467396 Disc drive and flexible cable assembly therein |
| 12/16/2008 | US7466912 Storage apparatus |
| 12/16/2008 | US7466880 Optical via to pass signals through a printed circuit board |
| 12/16/2008 | US7466562 Toolless method for alignment, retention, connection, termination and test on printed circuit boards |
| 12/16/2008 | US7466560 Multilayered printed circuit board |
| 12/16/2008 | US7466555 Card connector assembly having card misinsertion preventive structure |
| 12/16/2008 | US7466519 Wired circuit board for controlling characteristic impedances of a connection terminal |
| 12/16/2008 | US7465885 Circuit carrier and package structure thereof |
| 12/16/2008 | US7465884 Wired circuit board |
| 12/16/2008 | US7465882 Ceramic substrate grid structure for the creation of virtual coax arrangement |
| 12/16/2008 | US7465651 Integrated circuit packages with reduced stress on die and associated methods |
| 12/16/2008 | CA2591799C Mobile wireless communications device having dual antenna system for cellular and wifi |
| 12/11/2008 | WO2008149818A1 Laminated heat dissipating base body, and heat dissipating unit and electronic device using the laminated heat dissipating base body |
| 12/11/2008 | WO2008149572A1 Printed wiring board |
| 12/11/2008 | WO2008149511A1 Three-dimensional printed circuit board, and its manufacturing method |
| 12/11/2008 | WO2008149500A1 Flexible substrate and opening/closing electronic device |
| 12/11/2008 | WO2008149443A1 Flexible wiring board and plasma display device using the same |
| 12/11/2008 | WO2008148466A1 Two-dimensional illumination unit |
| 12/11/2008 | WO2008128016A3 Metal core circuit boards for light emitting diode applications and methods of manufacture thereof |
| 12/11/2008 | WO2007133405A3 Shielded flexible circuits and methods for manufacturing same |
| 12/11/2008 | US20080306220 Thermosetting Resin Composition, Multilayer Body Using Same, and Circuit Board |
| 12/11/2008 | US20080306180 Polyamide Acid Resin Containing Unsaturated Group, Photosensitive Resin Composition Using Same, and Cured Product Thereof |
| 12/11/2008 | US20080305249 Use of conductor compositions in electronic circuits |
| 12/11/2008 | US20080304213 Process for manufacturing a cover |
| 12/11/2008 | US20080304183 Flexure for head gimbal assembly with narrow gimbal width in a hard disk drive |
| 12/11/2008 | US20080303873 Printhead with reciprocating cantilevered thermal actuators |
| 12/11/2008 | US20080303865 Ink-jet printer, ink-jet head and method of manufacturing the ink-jet head |
| 12/11/2008 | US20080303149 Electronic Component |
| 12/11/2008 | US20080302564 Circuit assembly including a metal core substrate and process for preparing the same |
| 12/11/2008 | US20080302563 Wiring board and manufacturing method thereof |
| 12/11/2008 | US20080302562 Printed circuit board |
| 12/11/2008 | US20080302561 Conductive ink containing thermally exfoliated graphite oxide and method of making a conductive circuit using the same |
| 12/11/2008 | US20080302560 Printed wiring board and a method of manufacturing a printed wiring board |
| 12/11/2008 | US20080302559 Flexible and elastic dielectric integrated circuit |
| 12/11/2008 | US20080302558 impregnating a resin composition comprising a resin with an imide structure (polyamideimide copolymer, polyamideimidesoloxane) and a thermosetting resin ( epoxy or polyepoxide)into a fiber base material; prepreg having a property that it can be bent; metal foil-clad laminate and printed circuit board |
| 12/11/2008 | DE102008007216A1 Gedruckte Leiterplatte und Herstellungsverfahren derselben A printed wiring board and manufacturing method thereof |
| 12/11/2008 | DE102007045750A1 Circuit arrangement for e.g. behind-the-ear-hearing aid, has surface mount device component with contact directly connected with contacts of another component and another contact directly connected with contacts of third component |
| 12/11/2008 | CA2689951A1 Planar illumination device |
| 12/10/2008 | EP2001271A2 Method for making a multilayered circuitized substrate |
| 12/10/2008 | EP2001050A2 Method for manufacturing substrate having electric component |
| 12/10/2008 | EP2000833A1 Photoelectric wiring board, optical communication device and method for manufacturing optical communication device |
| 12/10/2008 | EP2000736A1 Plate-shaped illumination device |
| 12/10/2008 | EP2000445A2 Dielectric porcelain composition and electronic component |
| 12/10/2008 | EP1723657B1 Magnetic device |
| 12/10/2008 | EP1720261B1 High frequency switch module |
| 12/10/2008 | EP1707590B1 Polyimide film |
| 12/10/2008 | EP1116326B1 Conductive member |
| 12/10/2008 | CN201163008Y LED lamp with double-layer circuit board |
| 12/10/2008 | CN101321813A Prepreg, process for producing prepreg, substrate, and semiconductor device |
| 12/10/2008 | CN101321440A Circuit pattern design method using conductive coating paint and printed circuit board |
| 12/10/2008 | CN101321437A Electronic component built-in assembly and manufacturing method thereof |
| 12/10/2008 | CN101321436A Method of producing printed circuit board incorporating resistance element |
| 12/10/2008 | CN101321435A Offset footprint of a connector on a printed board |
| 12/10/2008 | CN101321434A Shielding and earthing structure of flexible circuit board |
| 12/10/2008 | CN101321433A Structure of component fixed on printed circuit board and fixing method thereof |
| 12/10/2008 | CN101321432A Printed circuit board |
| 12/10/2008 | CN101321431A Flexible printed circuit board and electronic apparatus |
| 12/10/2008 | CN101321430A Circuit board assembly and manufacturing method thereof |
| 12/10/2008 | CN101321429A High cooling circuit board and preparation thereof |
| 12/10/2008 | CN101321428A High cooling circuit board and preparation thereof |
| 12/10/2008 | CN101320142A Liquid crystal display |
| 12/10/2008 | CN101319770A Method for improving cooling effect of LED illumination device |
| 12/10/2008 | CN100442957C Parallel multi-layer printed circuit board having improved interconnection and method for manufacturing the same |
| 12/10/2008 | CN100442955C Wiring board sheet and its manufacturing method, multilayer board, and its manufacturng method |
| 12/10/2008 | CN100442954C Thin film pattern forming method, device and method of manufacture, electrooptical device |
| 12/10/2008 | CN100442951C Method for the manufacture of printed circuit boards with integral plated resistors |
| 12/10/2008 | CN100442950C Ceramic substrate and its manufacturing method |
| 12/10/2008 | CN100442949C Circuit component mounting device |
| 12/10/2008 | CN100442564C Mounting structure of piezoelectric transformer and method of mounting piezoelectric transformer |
| 12/10/2008 | CN100442563C Electronic component |
| 12/10/2008 | CN100442552C Light-emitting diode arrangement comprising a heat-dissipating plate |
| 12/10/2008 | CN100442503C Semiconductor integrated circuit device |
| 12/10/2008 | CN100442502C Semiconductor, electronic device and their producing method and electronic instrument |
| 12/10/2008 | CN100442501C Embedded capacitors for assembly |
| 12/10/2008 | CN100442481C Semiconductor device and its mfg. method |
| 12/10/2008 | CN100442404C Electronic component and manufacturing method of electronic component |