Patents for H05K 1 - Printed circuits (98,583) |
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01/08/2009 | US20090011621 Reversibe universal serial bus connection interface for USB connectors and universal serial bus ports |
01/08/2009 | US20090011591 Film substrate, fabrication method thereof, and image display substrate |
01/08/2009 | US20090011548 Hybrid integrated circuit device and manufacturing method thereof |
01/08/2009 | US20090011271 Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier |
01/08/2009 | US20090011220 Carrier and method for manufacturing printed circuit board |
01/08/2009 | US20090009980 Capacitor with direct dc connection to substrate |
01/08/2009 | US20090009979 Substrate Joining Member and Three-Dimensional Structure Using the Same |
01/08/2009 | US20090009977 Three-Dimensional Wiring Body for Mounting Electronic Component and Electronic Component Mounting Structure |
01/08/2009 | US20090009976 Memory card |
01/08/2009 | US20090009956 Case of electronic device and interface card retaining assembly thereof |
01/08/2009 | US20090008776 Electronic Component Mounted Body, Electronic Component with Solder Bump, Solder Resin Mixed Material, Electronic Component Mounting Method and Electronic Component Manufacturing Method |
01/08/2009 | US20090008145 Embedded circuit structure and fabricating process of the same |
01/08/2009 | US20090008144 Slanted vias for electrical circuits on circuit boards and other substrates |
01/08/2009 | US20090008142 Porous Film and Multilayer Assembly Using the Same |
01/08/2009 | US20090008141 Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof |
01/08/2009 | US20090008140 Electronic Assemblies Without Solder and Methods for their Manufacture |
01/08/2009 | US20090008139 Multilayer pwb and a method for producing the multilayer pwb |
01/08/2009 | US20090008138 Thermosetting resin composition and uses thereof |
01/08/2009 | US20090008137 Wired circuit board and producing method thererof |
01/08/2009 | US20090008136 Multilayered printed circuit board and fabricating method thereof |
01/08/2009 | US20090008135 Circuit substrate |
01/08/2009 | US20090008134 Module |
01/08/2009 | US20090008133 Patterned Circuits and Method for Making Same |
01/08/2009 | US20090008132 Flexible wiring board for tape carrier package |
01/08/2009 | US20090008131 Flexible printed-circuit board |
01/08/2009 | US20090008130 Cooling of substrate using interposer channels |
01/08/2009 | US20090008129 Cooling of substrate using interposer channels |
01/08/2009 | US20090008128 Electronic apparatus |
01/08/2009 | US20090008127 Epoxy Resin Composition for Prepreg, Prepreg and Multilayered Printed Wiring Board |
01/08/2009 | US20090008050 Methods for producing wet-spun non-woven fabrics |
01/08/2009 | US20090007426 Image forming apparatus and method of manufacturing electronic circuit using the same |
01/08/2009 | DE19903342B4 Multi-Chipmodul-Gehäuse für Mikrowellenanwendungen mit Hochfrequenz-Anschlußstift-Gitteranordnung Multi-chip module housing for microwave applications with high frequency pin grid array |
01/08/2009 | DE102007031062A1 Druckprodukt mit elektrisch funktionaler Schicht Print product with electrically functional layer |
01/08/2009 | DE102007031061A1 Druckprodukt mit elektrisch funktionaler Schicht Print product with electrically functional layer |
01/08/2009 | DE102007029422A1 Method for thermal contacting of power elements mounted on front side of circuit board, involves installing power element on mounting location on circuit board by forming hole in circuit board |
01/07/2009 | EP2012572A1 Brushless motor for washing machine and washing machine having the brushless motor mounted therein |
01/07/2009 | EP2012567A1 Liquid crystal display and manufacturing method thereof |
01/07/2009 | EP2012566A2 Wired circuit board and producing method thereof |
01/07/2009 | EP2012565A2 Flexible printed circuit board and liquid crystal display device using the same |
01/07/2009 | EP2012388A1 Article provided with feed circuit board |
01/07/2009 | EP2012259A2 RFID tag mounting circuit board |
01/07/2009 | EP2012258A1 Article provided with electromagnetically coupled module |
01/07/2009 | EP2011377A1 Airflow guides using silicon walls/creating channels for heat control |
01/07/2009 | EP2011376A1 Circuit module and power line communication apparatus |
01/07/2009 | EP2011188A1 Glass pane having soldered electrical terminal connections |
01/07/2009 | EP1641591B1 Method for separating flat ceramic workpieces with a calculated radiation spot length |
01/07/2009 | EP1254592B1 Printed circuit board |
01/07/2009 | CN201178553Y Shielding construction preventing electronic components from electromagetic interference and electronic apparatus |
01/07/2009 | CN201178549Y Fixing construction of electronic element and apparatus applying the same |
01/07/2009 | CN201178526Y Optical transmission apparatus |
01/07/2009 | CN201178523Y Single surface pasting circuit board |
01/07/2009 | CN201178522Y Printed circuit board |
01/07/2009 | CN201178521Y Circuit board comprising paste elements |
01/07/2009 | CN201178520Y Security unit of printed circuit board |
01/07/2009 | CN201178157Y Electric connector assembly |
01/07/2009 | CN201178096Y Radiating construction of inserting pin type LED |
01/07/2009 | CN201178095Y Surface adhesive type radiating construction of LED |
01/07/2009 | CN101341809A An electronic device, a housing part, and a method of manufacturing a housing part |
01/07/2009 | CN101341806A An apparatus and method for improving printed circuit board signal layer transitions |
01/07/2009 | CN101341805A Structure and method of fixing electronic parts to circuit board |
01/07/2009 | CN101341804A Connection structure of circuit board, connection part of circuit board and electronic apparatus |
01/07/2009 | CN101341803A Porous circuitry material for LED submounts |
01/07/2009 | CN101341633A Capacitor interconnection |
01/07/2009 | CN101341628A Chip device |
01/07/2009 | CN101341181A A curable epoxy resin composition and laminates made therefrom |
01/07/2009 | CN101340781A High frequency printed circuit board via |
01/07/2009 | CN101340780A Flexible circuit substrate having coiling portion and manufacturing method thereof |
01/07/2009 | CN101340777A Flexible printed circuit board and liquid crystal display device using the same |
01/07/2009 | CN101340776A Welding tray for welding gold brick/gold finger/touch tablet |
01/07/2009 | CN101340775A Flexible circuit board and manufacturing method thereof |
01/07/2009 | CN101340774A Flexible glue-free copper coated plate and preparation thereof |
01/07/2009 | CN101340773A Wired circuit board and producing method thererof |
01/07/2009 | CN101340772A Flexible substrate of circuit board |
01/07/2009 | CN101339936A Board having buried patterns and manufacturing method thereof |
01/07/2009 | CN101339935A Connection structure between printed circuit board and electronic component |
01/07/2009 | CN101339908A Electroplating method of electric contact mat and semi-conductor substrate having the electric contact mat |
01/07/2009 | CN101339304A Liquid crystal display and manufacturing method thereof |
01/07/2009 | CN101338877A Luminous diode array and backlight module group |
01/07/2009 | CN100450338C Apparatus and method for insepecting cream solder printed on a substrate |
01/07/2009 | CN100450331C Circuit forming board and method of manufacturing circuit forming board |
01/07/2009 | CN100450330C Method of manufacturing electronic component mounting body, electronic component mounting body, and electro-optical device |
01/07/2009 | CN100450327C Board connecting component and three-dimensional connecting structure using thereof |
01/07/2009 | CN100449932C Power module and electric transportation apparatus incorporating the same |
01/07/2009 | CN100449830C Fuel cell electric equipment electronic board manufacturing method of electric board connector for fuel cell wiring member and mounting method of fuel cell |
01/07/2009 | CN100449801C Semiconductor luminescent element composition |
01/07/2009 | CN100449752C Method for manufacturing circuit device |
01/07/2009 | CN100449751C Surface mount solder method and apparatus for decoupling capacitance and process of making |
01/07/2009 | CN100449747C Chip scale stacking system and method |
01/07/2009 | CN100449739C Electrical circuit apparatus and methods for assembling same |
01/07/2009 | CN100449738C Semiconductor chip and circuit board, manufacturing method of same, and electronic equipment |
01/07/2009 | CN100449661C Thin film capacitor using conductive polymers |
01/06/2009 | US7474540 Silicon carrier including an integrated heater for die rework and wafer probe |
01/06/2009 | US7474185 Packaging techniques for a high-density power converter |
01/06/2009 | US7474008 Semiconductor device with reduced electromigration |
01/06/2009 | US7473854 Printed circuit board |
01/06/2009 | US7473853 Circuit device |
01/06/2009 | US7473852 Printed-circuit board and circuit unit incorporating the circuit board |
01/06/2009 | US7473851 Cross-connecting by permutations using configurable printed circuits |
01/06/2009 | US7473652 Organic polymers, electronic devices, and methods |
01/06/2009 | US7473459 Method of manufacturing a film printed circuit board |