Patents for H05K 1 - Printed circuits (98,583)
11/2008
11/18/2008US7453046 Recording disk drive capable of suppressing vibration of flexible printed circuit board
11/18/2008US7453045 Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabrication method thereof
11/18/2008US7452828 plural nanotubes mutually cross-link, formed in an arbitrary pattern on a surface of a base body; extremely fine and excellent in electrical characteristics
11/18/2008US7452798 Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip
11/18/2008US7452246 Methods and apparatus for reducing crosstalk in electrical connectors
11/18/2008US7452217 Connecting member for surface mounting circuit
11/18/2008US7452057 Flexible printhead circuit
11/18/2008CA2467690C Hot melt conductor paste composition
11/18/2008CA2345463C Metal-carbon composite powders, methods for producing powders and devices fabricated from same
11/13/2008WO2008138015A2 Light-emitting diode assembly without solder
11/13/2008WO2008138011A1 Electronic assemblies without solder and methods for their manufacture
11/13/2008WO2008137398A2 Arcuate coil winding for edm
11/13/2008WO2008136373A1 Process for producing resin varnish containing semi-ipn composite thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminate
11/13/2008WO2008136096A1 Halogen-free epoxy resin composition, coverlay film, bonding sheet, prepreg and printed wiring board laminate
11/13/2008WO2008135632A1 Conductive ink and conductor
11/13/2008WO2008135400A1 Method for making a supply module based on magnetic material
11/13/2008WO2008134954A1 Circuit board interconnection system, connector component, circuit board and circuit board processing method
11/13/2008WO2008134809A1 System of connecting printed circuit boards 'coollock'
11/13/2008WO2008112318A3 Fine pitch microcontacts and method for forming thereof
11/13/2008US20080281067 Modified Polytetrafluoroethylene Powder and Method for Producing Tetrafluoroethylene Polymer
11/13/2008US20080280159 Copper Foil and Method of Manufacturing the Same
11/13/2008US20080279123 Time division duplex wireless network and associated method using connection modulation groups
11/13/2008US20080278924 Die module system
11/13/2008US20080278923 Multi chip electronic system
11/13/2008US20080278922 Hardware Protection System for Sensitive Electronic-Data Modules Protecting Against External Manipulations
11/13/2008US20080278921 Semiconductor package and method of forming the same, and printed circuit board
11/13/2008US20080278858 Wired circuit board
11/13/2008US20080277629 Fine Metal Particle Colloidal Solution, Conductive Paste Material, Conductive Ink Material, and Process for Producing the Same
11/13/2008US20080277161 Bussing connector
11/13/2008US20080277155 Wiring substrate and method of manufacturing the same
11/13/2008US20080277152 Printed Circuit Board and Its Designing Method, and Designing Method of Ic Package Terminal and Its Connecting Method
11/13/2008US20080277151 Electronic Assemblies without Solder and Methods for their Manufacture
11/13/2008US20080277150 Wiring board with built-in component and method for manufacturing the same
11/13/2008US20080277149 Electronic device manufacturing method and supporter
11/13/2008US20080277148 Multi-layer printed circuit board and method of manufacturing multilayer printed circuit board
11/13/2008US20080277147 Wired circuit board and producing method thereof
11/13/2008US20080277146 Radiant heat printed circuit board and method of fabricating the same
11/13/2008US20080277145 Flexible printed circuit
11/13/2008US20080277144 Method for indicating quality of a circuit board
11/13/2008US20080277143 metal foil is fixed onto an insulating resin composition is used as an electric power supply layer; slight roughening treatment; reliability and circuit formability are high, and conductor loss is extremely low; amino functional silane curing agent; peel strength; corrosion resistance
11/13/2008US20080277142 Wired circuit board
11/13/2008US20080277141 Circuit board and method of fabricating the same
11/13/2008US20080276819 Multilayered microcavities and actuators incorporating same
11/13/2008DE112006003544T5 Leiterplattenaufbau mit einem Quasi-Wellenleiter PCB mounting with a quasi-waveguide
11/13/2008DE112006003543T5 Eingebettete Wellenleiter-Leiterplatten-Struktur Embedded waveguide circuit board structure
11/13/2008DE102007021740A1 Leiterplatte mit integriertem Pressfit-Pin PCB with integrated press-fit pin
11/13/2008DE102006021097B4 Steuervorrichtung Control device
11/13/2008CA2684916A1 Conductive ink and conductor
11/12/2008EP1991040A2 Wired Circuit Board
11/12/2008EP1991039A2 Device and connecting method
11/12/2008EP1990833A2 Multilayer printed circuit board and multilayer printed circuit board manufacturing method
11/12/2008EP1990832A2 Multilayer printed circuit board and multilayer printed circuit board manufacturing method
11/12/2008EP1990831A2 Multilayer printed circuit board and multilayer printed circuit board manufacturing method
11/12/2008EP1990331A2 Ceramic substrate material, method for production and utilisation of the same and antenna or antenna array
11/12/2008EP1989931A2 Methods of forming a flexible circuit board
11/12/2008EP1989930A2 Active electrode and method for manufacturing it using flex circuit technology
11/12/2008CN201150164Y Evacuation structure for heat between two sides of circuit board
11/12/2008CN201150150Y Flexible circuit board with connected structure
11/12/2008CN201150149Y Tin-thieving soldering disk
11/12/2008CN201150148Y Thin film circuit board with security function
11/12/2008CN201149866Y Ceramic/metallic complex structure
11/12/2008CN101304637A Wiring forming method of printed circuit board
11/12/2008CN101304636A Method for preparing flexibility printed circuit board using PET as base material
11/12/2008CN101304635A Wiring circuit board
11/12/2008CN101304634A Flexible laminated board and manufacturing method thereof
11/12/2008CN101304633A Radiant heat printed circuit board and method of fabricating the same
11/12/2008CN101304632A Pliability circuit board and uses thereof
11/12/2008CN101304631A Soft and hard composite circuit board and manufacturing method thereof
11/12/2008CN101304059A LED component and LED display device
11/12/2008CN101304017A Sintered high performance semiconductor substrate and corresponding production method
11/12/2008CN101303981A Wiring panel with build-in components and manufacturing method thereof
11/12/2008CN101303947A System and method for interconnecting a plurality of printed circuits
11/12/2008CN101303911A Conductive paste composition
11/12/2008CN101303480A Light source module unit
11/12/2008CN101303479A Back light module and LCD device
11/12/2008CN101303474A Backlight module, LCD device and method for manufacturing LCD device
11/12/2008CN100433956C Patterned insulation layer and display paned using the same
11/12/2008CN100433955C Wiring plate and circuit module
11/12/2008CN100433951C Inductor element containing circuit board and power amplifier module
11/12/2008CN100433950C Film substrate, fabrication method thereof, and image display substrate
11/12/2008CN100433949C Vented vias for via in pad technology assembly process yield improvements
11/12/2008CN100433948C Flexible substrate and electronic device
11/12/2008CN100433947C Structure of circuit board in use for product of household electrical appliance
11/12/2008CN100433462C Card mounting device
11/12/2008CN100433344C Optical device
11/12/2008CN100433323C Electronic member
11/12/2008CN100433321C Circuit board and circuit apparatus using the same
11/12/2008CN100433306C Device mounting board and semiconductor apparatus using the same
11/12/2008CN100433305C Circuit-component carrying substrate
11/12/2008CN100433026C Power control for instrumented medication package
11/12/2008CN100432752C Display
11/12/2008CN100432729C Connecting a component with an embedded optical fiber
11/12/2008CN100432726C Opto-electronic module comprising flexible electric connection cable and method of making the same
11/12/2008CN100432143C Thermoset resin compsns. and its mfg. method
11/12/2008CN100432130C Epoxy resin compositions containing phosphorus and its uses
11/12/2008CN100432121C Asymmetric polymer film, method for the production and the utilization thereof
11/12/2008CN100432081C Novel hydroxyaryl phosphine oxides,diglycidyl ethers and epoxy compositions, composites and laminates derived therefrom
11/11/2008US7451410 Stackable motherboard and related sensor systems
11/11/2008US7450403 Switching power supply utilizing switch-selectable resistors to determine output voltage
11/11/2008US7450398 Printed circuit board