Patents for H05K 1 - Printed circuits (98,583)
03/2009
03/12/2009US20090065238 Printed circuit board
03/12/2009DE202004021564U1 Verbindungselement für Leiterplatten Connecting element for printed circuit boards
03/12/2009DE102007042449A1 Integriertes Sensormodul Integrated sensor module
03/12/2009DE102007035903A1 Contacting foil for the production of electric conductive connection between two points of a carrier, comprises an electrically non-conductive base strip that comprises electric-conductive particles
03/11/2009EP2034809A2 Electronic device including printed circuit board and electronic element mounted on the printed circuit board
03/11/2009EP2034808A2 Embedded resistor and capacitor circuit and method of fabricating same
03/11/2009EP2034807A2 Circuit board stack comprised of circuit boards soldered to each other
03/11/2009EP2034806A1 Circuit board device, method for connecting wiring boards, and circuit substrate module device
03/11/2009EP2034055A1 Metal composite film and process for producing the same
03/11/2009EP2032891A2 Method and apparatus for packaging circuitry within a lightbulb
03/11/2009EP2032632A2 Polyimide solvent cast films having a low coefficient of thermal expansion and method of manufacture thereof
03/11/2009EP2032201A1 Tubular catheter for invasive use and manufacturing method therefor
03/11/2009EP1819523B1 Printing screens, machine and method for screen printing
03/11/2009EP1707315B1 Production method for pattern-worked porous molding or nonwoven fabric, and electric circuit components
03/11/2009EP1697876B1 An optical system, an analysis system and a modular unit for an electronic pen
03/11/2009EP1657659B1 Printed circuit board return route check method and printed circuit board pattern design cad device
03/11/2009EP1629549A4 Method of producing membrane electrode assemblies for use in proton exchange membrane and direct methanol fuel cells
03/11/2009EP1567979B1 Chipcard and method for production of a chipcard
03/11/2009EP1517959B1 Polyester-type formaldehyde free insulation binder
03/11/2009EP1461383B1 Thermosetting resin composition for high performance laminates
03/11/2009EP1358124B1 Metal-carbon composite powders
03/11/2009CN201207785Y Heat radiator construction having circuit module
03/11/2009CN201207760Y Switch power supply PCB
03/11/2009CN201207759Y Flexible signal transmission board and connection construction therewith
03/11/2009CN201207758Y Printed circuit board
03/11/2009CN201207757Y Printed circuit board
03/11/2009CN201207756Y Raised type printed circuit board
03/11/2009CN201207755Y Static electricity conducting construction for circuit board
03/11/2009CN201207730Y Ultra-thin miniature microphone
03/11/2009CN201207110Y LCD module
03/11/2009CN201206797Y Luminous template cut at random
03/11/2009CN201206788Y Structure of light-emitting diode lamp group
03/11/2009CN101385402A Circuit board and process for producing the same
03/11/2009CN101385190A Multichannel wave-guide construction
03/11/2009CN101384425A Porous film and multilayer assembly using the same
03/11/2009CN101384132A Multi-component board
03/11/2009CN101384131A Circuit board and method for manufacturing the same
03/11/2009CN101384130A Printed circuit board
03/11/2009CN101384129A Printed circuit board
03/11/2009CN101383344A Horizontal assembled type thick film circuit apparatus and electronic equipment
03/11/2009CN100469225C Heat radiator lock and heat radiator combination using said lock
03/11/2009CN100469223C Conductive sheet having conductive layer with improved adhesion and product including the same
03/11/2009CN100469220C A method for making elastic circuit with the non-weaving cloth as base
03/11/2009CN100469217C Flexible radiating circuit substrate
03/11/2009CN100469216C Manufacturing method of multilayer flexible wiring plate
03/11/2009CN100469215C Multiplayer circuit base and its producing method
03/11/2009CN100469065C Symbol-based signaling device for an elctromagnetically-coupled bus system
03/11/2009CN100468706C Circuit board and method for manufacturing the same, semiconductor package, component built-in module
03/11/2009CN100468675C Method for manufacturing stacked body used for COF substrate,
03/11/2009CN100468450C Method for mounting an electronic component on a substrate
03/11/2009CN100468417C Printed circuit wiring board designing support device and printed circuit board designing method
03/11/2009CN100468070C Techniques for controlling movement of a circuit board module along card cage slot
03/11/2009CN100467383C Method for producing spherical oxide powder and apparatus for producing spherical powder
03/10/2009US7502231 Thin printed circuit board for manufacturing chip scale package
03/10/2009US7502021 Stacked structure display device
03/10/2009US7501586 Apparatus and method for improving printed circuit board signal layer transitions
03/10/2009US7501585 Semiconductor device support element with fluid-tight boundary
03/10/2009US7501584 Circuit board device and method for board-to-board connection
03/10/2009US7501583 Low noise multilayer printed circuit board
03/10/2009US7501582 Electrical device and method for making same
03/10/2009US7501581 Wired circuit board and producing method thereof
03/10/2009US7501310 Structure of image sensor module and method for manufacturing of wafer level package
03/10/2009US7501048 Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as a dielectric substrate
03/10/2009US7500861 Electrical connector
03/10/2009US7500780 Flexible wired circuit board for temperature measurement
03/10/2009US7500308 Method of detaching electronic component from printed circuit board
03/10/2009US7500306 Coupling of conductive vias to complex power-signal substructures
03/05/2009WO2009029804A2 Method for low temperature bonding of electronic components
03/05/2009WO2009029335A1 Detachable interconnect for configurable width memory system
03/05/2009WO2009028493A1 Insulating resin composition for multilayer printed wiring board, insulating resin sheet with base material, multilayer printed wiring board, and semiconductor device
03/05/2009WO2009028463A1 Spacer, and its manufacturing method
03/05/2009WO2009028289A1 Ceramic multilayer substrate
03/05/2009WO2009028208A1 Negative photosensitive material and circuit board
03/05/2009WO2009028170A1 Thermosetting resin composition and cured product thereof
03/05/2009WO2009028108A1 Multi-layer substrate
03/05/2009WO2009026975A2 Carrier foil
03/05/2009WO2008145804A3 Interference shielded electronics module and method for providing the same
03/05/2009US20090061662 Connector
03/05/2009US20090061660 Connection structure between wired circuit boards
03/05/2009US20090061256 Ferrite thin film, method of manufacturing the same and electromagnetic noise suppressor using the same
03/05/2009US20090059541 Electronic assembly having housing with embedded conductor connecting electrical component
03/05/2009US20090059540 Shielded high-frequency circuit module
03/05/2009US20090059530 Bolster plate assembly for printed circuit board
03/05/2009US20090058569 Coaxial waveguide microstructures having an active and methods of formation thereof
03/05/2009US20090058568 High speed electronics interconnect and method of manufacture
03/05/2009US20090058567 High speed electronics interconnect and method of manufacture
03/05/2009US20090057919 Multiple chips bonded to packaging structure with low noise and multiple selectable functions
03/05/2009US20090057910 Method of embedding passive component within via
03/05/2009US20090057000 Connecting element
03/05/2009US20090056999 Printed wiring board
03/05/2009US20090056998 Methods for manufacturing a semi-buried via and articles comprising the same
03/05/2009US20090056996 Electronic component module
03/05/2009US20090056995 Adhesive sheet, metal-laminated sheet and printed wiring board
03/05/2009US20090056994 Methods of Treating a Surface to Promote Metal Plating and Devices Formed
03/05/2009US20090056993 Method for forming cured film
03/05/2009US20090056992 Wiring substrate with lead pin and lead pin
03/05/2009US20090056991 Methods of Treating a Surface to Promote Binding of Molecule(s) of Interest, Coatings and Devices Formed Therefrom
03/05/2009US20090056990 Electro-optic device and electronic apparatus
03/05/2009US20090056989 Printed circuit board and method for preparation thereof
03/05/2009US20090056988 Multiple chips bonded to packaging structure with low noise and multiple selectable functions