| Patents for H05K 1 - Printed circuits (98,583) |
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| 01/06/2009 | US7473106 IC socket connector configured by discrete wafers assembled to a frame |
| 01/06/2009 | CA2367327C Woven fabric reinforcement to optimize dimensional stability of laminated composite structures, including products for electrical and electronic applications |
| 01/02/2009 | DE10309502B4 Verfahren zur Herstellung einer Lothügelstruktur und Lothügelstruktur A process for preparing a Lothügelstruktur and Lothügelstruktur |
| 01/02/2009 | DE102008002425A1 Elektromagnetische Bandabstandstruktur und Leiterplatte Electromagnetic bandgap structure and printed circuit board |
| 01/02/2009 | DE102007041070A1 Schaltkreisstruktur mit unabhängigen in der Leiterplatte implementierten Masseplattenlayouts Circuit structure with independent implemented in the PCB ground plane layouts |
| 01/02/2009 | DE102007029913A1 Elektrisches Steuergerät Electrical control device |
| 01/02/2009 | DE102007028793A1 Electronic control unit, for a motor vehicle electronic steering system, has a humidity sensor to detect the humidity content in the unit housing |
| 01/02/2009 | DE102007028463A1 Lichtemittierendes System mit Steckverbindung The light emitting system with connector |
| 01/02/2009 | DE102005006638B4 Haftfeste Leiterbahn auf Isolationsschicht Tenacious conductor on insulating layer |
| 01/02/2009 | DE102004047753B4 Verbesserte Chip-Kontaktierungsanordnung für Chip-Träger für Flip-Chip-Anwendungen Improved chip-contacting arrangement for chip carriers for flip-chip applications |
| 01/02/2009 | DE10052517B4 Transpondermodul, Identifikationsträger und Verfahren zum Herstellen eines Transpondermoduls Transponder module, the identification carriers and methods of producing a transponder module |
| 01/01/2009 | US20090004846 Wiring board, manufacturing method thereof, semiconductor device and manufacturing method thereof |
| 01/01/2009 | US20090002959 Control Apparatus, in Particular a Mechatronic Transmission Control Device or Engine Control Device |
| 01/01/2009 | US20090002958 Method of Forming a Substrate Core Structure Using Microvia Laser Drilling and Conductive Layer Pre-Patterning And Substrate Core Structure Formed According to the Method |
| 01/01/2009 | US20090002953 Production of via hole in flexible circuit printable board |
| 01/01/2009 | US20090002443 Printer assembly with a dimensionally stable support frame |
| 01/01/2009 | US20090001550 Method of Forming a Multilayer Substrate Core Structure Using Sequential Microvia Laser Drilling And Substrate Core Structure Formed According to the Method |
| 01/01/2009 | US20090000813 Packaging substrate structure and manufacturing method thereof |
| 01/01/2009 | US20090000812 Multilayer printed wiring board |
| 01/01/2009 | US20090000811 Chip resistor and method for fabricating the same |
| 01/01/2009 | US20090000810 Printed circuit board |
| 01/01/2009 | US20090000809 Flexible substrate |
| 01/01/2009 | US20090000808 Flexible Printed Circuit Board And Method Of Fabricating The Same |
| 01/01/2009 | US20090000807 Connecting Structure and Adhesion Method of Pcb Using Anisotropic Conductive Film, and Method for Evaluating Connecting Condition Using the Same |
| 12/31/2008 | WO2009002630A1 High temperature ceramic socket configured to test packaged semiconductor devices |
| 12/31/2008 | WO2009002513A2 Fpc-based relay connector |
| 12/31/2008 | WO2009002478A2 Integrated antenna and chip package and method of manufacturing thereof |
| 12/31/2008 | WO2009001850A1 Resin composition and copper foil with resin obtained by using the resin composition |
| 12/31/2008 | WO2009001768A1 Multi-layered substrate and its manufacturing method |
| 12/31/2008 | WO2009001748A1 Flexible printed board for hard disc device |
| 12/31/2008 | WO2009001672A1 Display panel connecting structure |
| 12/31/2008 | WO2009001671A1 Printed wiring board |
| 12/31/2008 | WO2009000998A1 Filtering structure on printed circuit |
| 12/31/2008 | WO2009000282A1 High voltage led lighting system |
| 12/31/2008 | WO2008135142A3 Method for producing a circuit board having a cavity for the integration of components and circuit board and application |
| 12/31/2008 | WO2008117213A3 An assembly of at least two printed circuit boards and a method of assembling at least two printed circuit boards |
| 12/31/2008 | WO2007126534A8 Electrical connector with segmented housing |
| 12/31/2008 | EP2009970A2 Method for manufacturing an electrically conductive structure |
| 12/31/2008 | EP2009968A1 Wiring board |
| 12/31/2008 | EP2009967A2 Wiring board and bus bar segments to be used therefor |
| 12/31/2008 | EP2009966A1 Multi-layer electrically isolated thermal conduction structure for a circuit board assembly |
| 12/31/2008 | EP2009965A1 Supporting substrate for electronic components |
| 12/31/2008 | EP2009718A2 Battery pack for cordless devices |
| 12/31/2008 | EP2008503A2 Electrical connector with segmented housing |
| 12/31/2008 | EP2008346A2 Telecommunications jack with crosstalk compensation and arrangements for reducing return loss |
| 12/31/2008 | EP2008021A1 Illuminator |
| 12/31/2008 | EP1620209A4 Kinetic spray application of coatings onto covered materials |
| 12/31/2008 | CN201174842Y 电子装置 Electronic devices |
| 12/31/2008 | CN201174824Y Board body fixing construction and circuit board fixing construction |
| 12/31/2008 | CN201174823Y Film circuit board device |
| 12/31/2008 | CN201174822Y Damp-proof structure of circuit board |
| 12/31/2008 | CN201174821Y Golden finger and slot cleaner |
| 12/31/2008 | CN201174006Y Etching line construction of backlight module flexible circuit board |
| 12/31/2008 | CN101336474A A component casing comprising a micro circuit |
| 12/31/2008 | CN101336050A The thick copper printed circuit board with enhanced adhesive strength and the manufacturing method of it |
| 12/31/2008 | CN101336049A Circuit board and welding method |
| 12/31/2008 | CN101336048A Method and apparatus for reinforced locating of flexible circuit board |
| 12/31/2008 | CN101336045A Printed circuit board, electronic member mounting method and electronic device |
| 12/31/2008 | CN101336044A Printed circuit board, electronic member mounting method and electronic device |
| 12/31/2008 | CN101336043A Printed circuit board of duplex separable DC voltage stabilizing power source |
| 12/31/2008 | CN101336042A Solder pad, circuit board and electronic apparatus having the solder pad |
| 12/31/2008 | CN101336041A Printed circuit board |
| 12/31/2008 | CN101336040A General solder pad construction |
| 12/31/2008 | CN101336039A Electrostatic discharge protection design method and related circuit |
| 12/31/2008 | CN101335779A Welding construction of mobile phone camera and implementing method |
| 12/31/2008 | CN101335412A Connection apparatus of universal serial bus, connecting module group and manufacturing method thereof |
| 12/31/2008 | CN100447990C Circuit-component-containing module |
| 12/31/2008 | CN100447196C Process for producing modified epoxy resin |
| 12/31/2008 | CN100447194C Molded object, process for producing the same, product for high-frequency signal transmission, and high-frequency transmission cable |
| 12/30/2008 | US7471519 Wired circuit board |
| 12/30/2008 | US7471174 Connection structure for coaxial connector and multilayer substrate |
| 12/30/2008 | US7470995 Integrated circuit (IC) carrier assembly with suspension means |
| 12/30/2008 | US7470990 Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same |
| 12/30/2008 | US7470977 Modular board device, high frequency module, and method of manufacturing same |
| 12/30/2008 | US7470865 Multilayer printed wiring board and a process of producing same |
| 12/30/2008 | US7470864 Multi-conducting through hole structure |
| 12/30/2008 | US7470863 Microelectronic device with mixed dielectric |
| 12/30/2008 | US7470471 Resin composition, prepreg and laminate using the composition |
| 12/30/2008 | US7470380 finely divided particles of an electrically-conductive material dispersed in a liquid vehicle; for manufacture of an electrically-conductive pattern on a substrate; reduces cross-sectional area and width while retaining conductivity and resistivity; demisting elements in heated windows |
| 12/30/2008 | US7470003 Ink jet printhead with active and passive nozzle chamber structures arrayed on a substrate |
| 12/30/2008 | US7469941 Method of producing a wiring board |
| 12/27/2008 | CA2636448A1 Wiring board and bus bar segments to be used therefor |
| 12/25/2008 | US20080318450 Preferential via exit structures with triad configuration for printed circuit boards |
| 12/25/2008 | US20080318002 Functional Elastic Textile Structures |
| 12/25/2008 | US20080316728 Metal core foldover package structures |
| 12/25/2008 | US20080316727 3D Electronic Module |
| 12/25/2008 | US20080316723 Methods for integration of thin-film capacitors into the build-up layers of a printed wiring board |
| 12/25/2008 | US20080316716 Frame for a packaging method using flexible printed circuit boards and method thereof |
| 12/25/2008 | US20080316715 Coated Copper, Method for Inhibiting Generation of Whisker, Printed Wiring Board and Semiconductor Device |
| 12/25/2008 | US20080316273 Electronic apparatus and flexible wiring member |
| 12/25/2008 | US20080316255 Flexible wiring member, liquid droplet jetting head, and method for connecting flexible wiring member and device |
| 12/25/2008 | US20080315901 Multilayer wiring board and method for manufacturing the same and probe apparatus |
| 12/25/2008 | US20080314994 Appliance for financial transaction tokens |
| 12/25/2008 | US20080314632 Multilayered printed wiring board |
| 12/25/2008 | US20080314629 Multi-layer substrate and manufacturing method thereof |
| 12/25/2008 | US20080314628 Method of forming metal pattern, patterned metal structure, and thin film transistor-liquid crystal displays using the same |
| 12/25/2008 | US20080314627 Electronic component and method for manufacturing the same |
| 12/25/2008 | US20080314626 ELECTRODED SHEET (eSheet) PRODUCTS |
| 12/25/2008 | US20080314625 Printed Circuit Board and Method of Manufacturing the Same |
| 12/25/2008 | US20080314624 Component Adapted for Being Mounted on a Substrate and a Method of Mounting a Surface Mounted Device |