| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 10/22/2008 | CN100428368C Electro-conductive composition, electro-conductive coating and method for producing the coating |
| 10/22/2008 | CN100428367C Aluminum alloy wiring material having high resistance to heat and target material |
| 10/22/2008 | CN100428274C Method for production of a card with a double interface and microcircuit card obtained thus |
| 10/22/2008 | CN100427560C Flexible circuit base material adhesive, preparing method and produced base material |
| 10/21/2008 | US7440864 Controller system for pool and/or spa |
| 10/21/2008 | US7440291 Method of reducing noise induced from reference plane currents |
| 10/21/2008 | US7440290 Control systems |
| 10/21/2008 | US7440285 Electronic device housing |
| 10/21/2008 | US7440278 Water-cooling heat dissipator |
| 10/21/2008 | US7440262 Modular power distribution system and methods |
| 10/21/2008 | US7440256 Laminated ceramic substrate and manufacturing method therefor |
| 10/21/2008 | US7439919 Multilayer PCB antenna |
| 10/21/2008 | US7439683 Backlighting system for display screen |
| 10/21/2008 | US7439614 Circuit device with dummy elements |
| 10/21/2008 | US7439451 Tape carrier |
| 10/21/2008 | US7439450 Plating buss and a method of use thereof |
| 10/21/2008 | US7439449 Flexible circuit for establishing electrical connectivity with optical subassembly |
| 10/21/2008 | US7439285 to enable printing of high performance thermosetting compound by ink-jet onto printed circuit boards, without scarifying the requirements from the cured layer; comprises solid latent curing agent characterized by a maximal particle size of less than 2 microns and an epoxy-based resin |
| 10/21/2008 | US7438969 Filling material, multilayer wiring board, and process of producing multilayer wiring board |
| 10/21/2008 | US7438950 Forming a region in which a graft polymer, that directly bonds to a surface of a base material that includes a polyimide is generated in a pattern shape; imparting electroless plating catalyst or a precursor thereof and electroless plating so as to form a metallic film in the pattern shape |
| 10/21/2008 | US7438946 Magnetic grains; axial anisotropy, isotropy; plating in presence of magnetic field; ferrite film is formed by the use of the plating method in the presence of a magnetic field; an electromagnetic noise suppressor includes the ferrite film |
| 10/21/2008 | US7438593 Component for a printed circuit board and method for fitting a printed circuit board with this component |
| 10/21/2008 | US7438562 Universal-Serial-Bus (USB) flash-memory device with metal wrap formed over plastic housing |
| 10/21/2008 | US7438388 Printer having sprung printed circuit board for printhead assembly |
| 10/16/2008 | WO2008124588A1 Circuit substrate with plated through hole structure and method |
| 10/16/2008 | WO2008124259A1 Surface mount devices with minimum lead inductance and methods of manufacturing the same |
| 10/16/2008 | WO2008123766A2 High thermal-efficient metal core printed circuit board with selective electrical and thermal circuitry connectivity |
| 10/16/2008 | WO2008123474A1 Novel thermoplastic polyhydroxy polyether resin and resin composition containing the same |
| 10/16/2008 | WO2008123082A1 Inductor, wiring board and semiconductor device |
| 10/16/2008 | WO2008122309A1 Double-sided plate comprising a strip conductor safety fuse |
| 10/16/2008 | WO2008059322A3 Printed circuit board with embedded circuit component |
| 10/16/2008 | WO2007124146A3 Printed circuit boards with stacked micros vias |
| 10/16/2008 | WO2007109773A3 Electromagnetic interference containment in a transceiver module |
| 10/16/2008 | WO2006110622A3 Layered label structure with timer |
| 10/16/2008 | WO2005051055A3 Independently adjustable circuit board carrier |
| 10/16/2008 | US20080255306 Laminates; printed circuits; epoxy resin containing both bisphenol a and tetrabromobisphenol a |
| 10/16/2008 | US20080254968 Dielectric ceramic composition, complex electronic device and multilayer ceramic capacitor |
| 10/16/2008 | US20080254650 Light-emitting diode and method for producing it |
| 10/16/2008 | US20080254257 Poly (phenylene ether) resin composition, prepreg, and laminated sheet |
| 10/16/2008 | US20080253954 Firing mixture of magnesium source (Mg(OH)2), silicon source (SiO2), and copper particles; ceramics; dielectrics |
| 10/16/2008 | US20080253774 Device having a casing containing a potting material for transmitting signals between electronic components |
| 10/16/2008 | US20080253102 Electronic devices for surface mount |
| 10/16/2008 | US20080253101 Liquid crystal display device |
| 10/16/2008 | US20080253097 Interposer |
| 10/16/2008 | US20080253074 Flexible printed circuit board with alignment marks in particular positions |
| 10/16/2008 | US20080253054 Multi-Functional Energy Conditioner |
| 10/16/2008 | US20080252734 Card based image manipulation method for camera |
| 10/16/2008 | US20080251947 Cof flexible printed wiring board and semiconductor device |
| 10/16/2008 | US20080251946 Semiconductor apparatus, manufacturing method thereof, semiconductor module apparatus using semiconductor apparatus, and wire substrate for semiconductor apparatus |
| 10/16/2008 | US20080251496 Optoelectric composite substrate and method of manufacturing the same |
| 10/16/2008 | US20080251287 Substrate and method for manufacturing the same |
| 10/16/2008 | US20080251286 Method For Increasing a Routing Density For a Circuit Board and Such a Circuit Board |
| 10/16/2008 | US20080251285 Capacitor and wiring board including the capacitor |
| 10/16/2008 | US20080251284 Electronics Structures Using a Sacrificial Multi-Layer Hardmask Scheme |
| 10/16/2008 | US20080251283 Mounting substrate and electronic device |
| 10/16/2008 | US20080251282 Highly thermally conductive circuit substrate |
| 10/16/2008 | US20080251281 Electrical interconnect structure and method |
| 10/16/2008 | US20080251280 Soldering structure between circuit boards |
| 10/16/2008 | US20080251279 Wiring board and method of manufacturing the same |
| 10/16/2008 | US20080251278 Recycling Printed Circuit Boards |
| 10/16/2008 | US20080250637 Method for manufacturing multilayer flexible printed circuit board |
| 10/16/2008 | DE102008012828A1 Elektronisches System mit integriertem Schaltkreis und passivem Bauelement An electronic system comprising an integrated circuit and passive component |
| 10/16/2008 | DE102007007657A1 Electromagnetic interference shield for electrical component, has lacquer or lacquer-like coating applied on electrical component, where coating is completely or partially applied with respect to electrical component |
| 10/16/2008 | DE102005051611B4 Wärmehärtende Harzzusammensetzung, und Verfahren zur Herstellung eines Prepreg,einer metallbeschichteten, laminierten Platte und einer Platine mit gedruckter Schaltung unter Verwendung derselben A thermosetting resin composition, and process for producing a prepreg, a metal-coated laminated plate and a printed circuit board using the same |
| 10/16/2008 | DE102004013056B4 Verfahren zur Herstellung eines Halbleiterbauelements A process for producing a semiconductor device |
| 10/16/2008 | DE10141910B4 Glaskeramiksinterprodukt und Verfahren zu seiner Herstellung Glass sintered ceramic product and process for its preparation |
| 10/15/2008 | EP1981321A2 Circuitized substrate assembly with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing same |
| 10/15/2008 | EP1981320A1 Conductive paste, multilayer ceramic substrate and method for manufacturing multilayer ceramic substrate |
| 10/15/2008 | EP1981318A1 Function unit for an optoelectronic sensor and method for fixing a circuit board |
| 10/15/2008 | EP1981317A2 Multilayer printed wiring board and manufacturing method thereof |
| 10/15/2008 | EP1981316A2 Multilayer high-frequency circuit board |
| 10/15/2008 | EP1981315A2 Equipped flexible electronic support, supporting at least one light-emitting diode, and associated manufacturing method |
| 10/15/2008 | EP1981314A1 Printed circuit board, design method thereof and mainboard of terminal product |
| 10/15/2008 | EP1981130A2 Inductive and capactive coupling balancing electrical connector |
| 10/15/2008 | EP1980886A2 Optical communication device, and optical communication device manufacturing method |
| 10/15/2008 | EP1980143A1 Printed circuit board with additional functional elements, method of production and use |
| 10/15/2008 | EP1980142A1 Printed circuit board with functional elements and selectively filled passage openings of good thermal conductivity and method of production and use |
| 10/15/2008 | EP1377985B1 Conductor compositions and the use thereof |
| 10/15/2008 | EP0953219B1 Electric connection configuration |
| 10/15/2008 | CN201134979Y Single-side printed circuit board with single-side silver or golden finger |
| 10/15/2008 | CN201134978Y Circuit printed board for wireless terminal |
| 10/15/2008 | CN201134977Y Circuit board |
| 10/15/2008 | CN201134976Y 电路板装置 Circuit board apparatus |
| 10/15/2008 | CN201134975Y 印刷电路板及夹具 Printed circuit boards and fixtures |
| 10/15/2008 | CN201134974Y Tri-dimensional circuit board |
| 10/15/2008 | CN201134441Y LED apparatus |
| 10/15/2008 | CN101288348A Electronic device or circuit and method for fabricating the same |
| 10/15/2008 | CN101288133A Conductive powder and process for producing the same, conductive powder paste, and process for producing the conductive powder paste |
| 10/15/2008 | CN101287360A Manufacturing process of surface adhesive |
| 10/15/2008 | CN101287353A Electronic equipment with electro-magnetic shielding function |
| 10/15/2008 | CN101287339A Method for manufacturing circuit board with differential break structure |
| 10/15/2008 | CN101287335A Highly heat conductive circuit base board |
| 10/15/2008 | CN101287334A Manufacturing method of highly heat conductive circuit base board |
| 10/15/2008 | CN101287333A Common circuit for chips and wiring method for the common circuit |
| 10/15/2008 | CN101287332A Circuit board and method of processing the same |
| 10/15/2008 | CN101287331A Conductive structure of electrically connected mat of circuit board |
| 10/15/2008 | CN101287330A Methods of forming printed circuit boards having embedded optical waveguides |
| 10/15/2008 | CN101287329A Flexible circuit board and display device using said flexible circuit board |
| 10/15/2008 | CN101287328A Flexible circuit board, processing method of said flexible circuit board and electronic device |
| 10/15/2008 | CN101286490A Substrate surface processing structure and method for production thereof |