| Patents for H05K 1 - Printed circuits (98,583) |
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| 01/28/2009 | CN101355845A Substrate with conductive projection and technique thereof |
| 01/28/2009 | CN101354497A Backlight unit and liquid crystal display device having the same |
| 01/28/2009 | CN101354112A Improved led lamp structure and forming method thereof |
| 01/28/2009 | CN101353424A Thermoplastic polyimide resin containing active lateral group, flexible copper clad laminate manufactured with the same and manufacturing method thereof |
| 01/28/2009 | CN100456915C Compact radio equipment and method of mounting the same |
| 01/28/2009 | CN100456909C Printed circuit board |
| 01/28/2009 | CN100456472C Power converter package with enhanced thermal management |
| 01/28/2009 | CN100456471C Electronic apparatus |
| 01/28/2009 | CN100456444C Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same |
| 01/27/2009 | US7483730 Low-noise optical probes for reducing ambient noise |
| 01/27/2009 | US7483277 Method and apparatus for inspecting component mounting accuracy |
| 01/27/2009 | US7483275 Electronic unit, circuit design for the same, and production method |
| 01/27/2009 | US7483274 Galvanic isolation of a signal using capacitive coupling embedded within a circuit board |
| 01/27/2009 | US7483237 Composite base plate for a data storage device having an integral printed circuit board |
| 01/27/2009 | US7482824 Polycrystalline contacting component and test tool having the contacting component |
| 01/27/2009 | US7482800 Wired circuit board and connecting structure thereof |
| 01/27/2009 | US7482685 Ceramic circuit board, method for making the same, and power module |
| 01/27/2009 | US7482678 Surface-mounted microwave package and corresponding mounting with a multilayer circuit |
| 01/27/2009 | US7482638 Package for a semiconductor light emitting device |
| 01/27/2009 | US7482541 Panel for electro-optical apparatus, method of manufacture thereof, electro-optical apparatus and electronic apparatus |
| 01/27/2009 | US7482292 Composition for ceramic substrate, ceramic substrate, method for producing ceramic substrate |
| 01/27/2009 | US7482198 Method for producing through-contacts and a semiconductor component with through-contacts |
| 01/27/2009 | US7482184 Manufacture of a layer of optical interconnection on an electronic circuit |
| 01/27/2009 | US7482052 Method for processing by laser, apparatus for processing by laser, and three-dimensional structure |
| 01/27/2009 | US7481681 Electrical connector with improved crosstalk compensation |
| 01/27/2009 | US7481518 Ink jet printhead integrated circuit with surface-processed thermal actuators |
| 01/27/2009 | US7480988 Method and apparatus for providing hermetic electrical feedthrough |
| 01/22/2009 | WO2009010705A1 An electrical unit |
| 01/22/2009 | WO2009010704A1 An electrical unit |
| 01/22/2009 | WO2009010703A1 An electrical unit |
| 01/22/2009 | WO2008145804A9 Interference shielded electronics module and method for providing the same |
| 01/22/2009 | WO2008122262A3 Component support for closing systems |
| 01/22/2009 | WO2008113343A3 Electronic module comprising a conductor fuse |
| 01/22/2009 | WO2007053608A3 Films and capsules made from modified carboxymethycellulose materials and methods of making same |
| 01/22/2009 | US20090023309 Configurable printed circuit board |
| 01/22/2009 | US20090021921 Memory card and its manufacturing method |
| 01/22/2009 | US20090021905 Multiple drive plug-in cable |
| 01/22/2009 | US20090021686 Method for gravure printing transparent electrodes, an dink composition therefor |
| 01/22/2009 | US20090020870 Electronic device provided with wiring board, method for manufacturing such electronic device and wiring board for such electronic device |
| 01/22/2009 | US20090020502 Biosensor and method of making |
| 01/22/2009 | US20090020342 Touch Panel And Interactive Input System Incorporating The Same |
| 01/22/2009 | US20090020328 Hybrid antenna structure |
| 01/22/2009 | US20090020325 Weldable contact and method for the production thereof |
| 01/22/2009 | US20090020324 Wired circuit board |
| 01/22/2009 | US20090020323 Circuit board structure and method for fabricating the same |
| 01/22/2009 | US20090020322 Packaging substrate with conductive structure |
| 01/22/2009 | US20090020321 Metal-ceramic substrate |
| 01/22/2009 | US20090020320 Gold finger of circuit board and fabricating method thereof |
| 01/22/2009 | US20090020319 Multilayer printed circuit board |
| 01/22/2009 | US20090020318 Circuit board, and semiconductor device |
| 01/22/2009 | US20090020317 Wiring board and method of manufacturing wiring board |
| 01/22/2009 | US20090020316 Method of manufacturing chip on film and structure thereof |
| 01/22/2009 | US20090020315 Automated direct emulsion process for making printed circuits and multilayer printed circuits |
| 01/22/2009 | US20090020314 Direct emulsion process for making printed circuits |
| 01/22/2009 | US20090020313 Circuit logic embedded within ic protective layer |
| 01/22/2009 | US20090019693 Printed wiring board and method of manufacturing the same |
| 01/22/2009 | DE102008030357A1 Zwischenverbindungsstruktur für Platinen und Anschlussteile Interconnect structure for boards and Fittings |
| 01/21/2009 | EP2016810A2 Printed circuit boards with stacked micros vias |
| 01/21/2009 | EP1645013B1 Component for a printed circuit board |
| 01/21/2009 | EP1342284B1 Process for securing a microwave module to a support |
| 01/21/2009 | CN201185531Y Fixed buffering pad for electronic line board |
| 01/21/2009 | CN201185509Y Hole-conducting structure for circuit board |
| 01/21/2009 | CN201185508Y Printing circuit boards |
| 01/21/2009 | CN201185507Y 印制电路板 Printed circuit board |
| 01/21/2009 | CN201185506Y Open pore type multimedia circuit board |
| 01/21/2009 | CN201184794Y Circuit board for intelligent increment type or absolute value encoder |
| 01/21/2009 | CN101352109A Printed wiring board and process for producing the same |
| 01/21/2009 | CN101351923A High speed interconnect |
| 01/21/2009 | CN101351817A Article provided with electromagnetically coupled module |
| 01/21/2009 | CN101351091A Line connection technique and structure thereof |
| 01/21/2009 | CN101351088A Inside imbedded type line structure and technique thereof |
| 01/21/2009 | CN101351085A Gold finger for circuit board and preparation method thereof |
| 01/21/2009 | CN101351084A Circuit board and metal surface treatment technique thereof |
| 01/21/2009 | CN101351083A Line board and technique |
| 01/21/2009 | CN101351081A Illumination application circuit board with pins type LED |
| 01/21/2009 | CN101351080A Printed circuit board |
| 01/21/2009 | CN101351079A Method for processing step ladder PCB plate |
| 01/21/2009 | CN101351078A Method for processing step ladder PCB plate |
| 01/21/2009 | CN101351077A Wired circuit board |
| 01/21/2009 | CN101351062A Method for manufacturing LED indicating lamp and LED indicating lamp using the method |
| 01/21/2009 | CN101350338A Embedded type chip substrate structure |
| 01/21/2009 | CN101350314A Method of manufacturing pipe chip on film joint and structure thereof |
| 01/21/2009 | CN101349795A Method for assembling automatic focusing module of liquid lens |
| 01/21/2009 | CN101349408A LED lamp cap |
| 01/21/2009 | CN101349407A LED lamp cap |
| 01/21/2009 | CN101348576A Prepreg and metal foil-clad laminate and printed circuit board obtained by using the same |
| 01/21/2009 | CN101348575A Prepreg and metal foil-clad laminate and printed circuit board obtained by using the same |
| 01/21/2009 | CN100455178C Electromagnetic wave noise suppressor, structural body with electromagnetic wave noise suppressing function, and process for producing them |
| 01/21/2009 | CN100455167C Printing-head electromagnet fixing method and device |
| 01/21/2009 | CN100455160C Flexible circuit board mounted with semiconductor chip and method for mounting semiconductor chip |
| 01/21/2009 | CN100455159C Wired circuit board |
| 01/21/2009 | CN100455078C Antenna and communication machine with the antenna |
| 01/21/2009 | CN100454602C Film comprising organic semiconductors |
| 01/21/2009 | CN100454537C Electronic apparatus and method for manufacturing the same |
| 01/21/2009 | CN100454533C EMI shielding for electronic component packaging |
| 01/21/2009 | CN100454525C Composite material, electrical circuit or electric module |
| 01/21/2009 | CN100454502C Method for fabricating a multilayer wiring board, multilayer wiring board, and electronic device using the same |
| 01/21/2009 | CN100454444C Conductive paste composition, conductive paste and its preparation |
| 01/21/2009 | CN100454118C Tape circuit substrate with reduced size of base film |
| 01/21/2009 | CN100454064C Apparatus for electrical and optical interconnection |