| Patents for H05K 1 - Printed circuits (98,583) |
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| 10/29/2008 | CN100429834C Electric power connector |
| 10/29/2008 | CN100429830C Apparatus for crosstalk compensation in a telecommunications connector |
| 10/29/2008 | CN100429773C Module and mounting structure using the same |
| 10/29/2008 | CN100429768C Vice mounting board and semiconductor apparatus using device mounting board |
| 10/29/2008 | CN100429767C Device mounting board |
| 10/28/2008 | US7444452 Computer system with a PCI express interface |
| 10/28/2008 | US7444041 System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards |
| 10/28/2008 | US7443697 Electronic device having bezel structure |
| 10/28/2008 | US7443696 Riser card to support different kinds of connectors |
| 10/28/2008 | US7443693 Electromagnetic interference shielding for a printed circuit board |
| 10/28/2008 | US7443647 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| 10/28/2008 | US7443434 Image sensing apparatus including a microcontroller |
| 10/28/2008 | US7443035 Method of forming a penetration electrode and substrate having a penetration electrode |
| 10/28/2008 | US7443025 Thermally improved placement of power-dissipating components onto a circuit board |
| 10/28/2008 | US7443021 Electronic component packaging structure and method for producing the same |
| 10/28/2008 | US7442968 Chip on film (COF) package having test pad for testing electrical function of chip and method for manufacturing same |
| 10/28/2008 | US7442879 Circuitized substrate with solder-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate |
| 10/28/2008 | US7442878 Low stress conductive polymer bump |
| 10/28/2008 | US7442092 Electrical connector with improved crosstalk compensation |
| 10/28/2008 | US7442091 Back-to-back PCB double-sided USB connector |
| 10/28/2008 | US7441701 Universal card reader apparatus and method |
| 10/28/2008 | US7441329 Fabrication process circuit board with embedded passive component |
| 10/28/2008 | CA2426861C Conductive metal paste |
| 10/23/2008 | WO2008128016A2 Metal core circuit boards for light emitting diode applications and methods of manufacture thereof |
| 10/23/2008 | WO2008127970A2 Circuit materials, multilayer circuits, and methods of manufacture thereof |
| 10/23/2008 | WO2008127365A2 Printed electronic device and methods of determining the electrical value thereof |
| 10/23/2008 | WO2008127196A1 Composite structure for an electronic circuit |
| 10/23/2008 | WO2008126825A1 Resin composition, prepreg, laminated board, multilayer printed wiring board and semiconductor device |
| 10/23/2008 | WO2008126817A1 Metallic foil-clad laminate plate and printed wiring board |
| 10/23/2008 | WO2008126642A1 Metal foil plated laminated board and printed wiring board |
| 10/23/2008 | WO2008126640A1 Printed wiring board and electronic device |
| 10/23/2008 | WO2008126564A1 Radiating member, circuit board using the member, electronic part module, and method for manufacturing the module |
| 10/23/2008 | WO2008126522A1 Copper electrolyte solution and two-layer flexible substrate obtained by using the same |
| 10/23/2008 | WO2008126486A1 Dielectric ceramic composition, ceramic substrate, and method for producing the same |
| 10/23/2008 | WO2008126426A1 Conductive-substance-adsorbing resin film, process for producing conductive-substance-adsorbing resin film, metal-layer-coated resin film made from the same, and process for producing metal-layer-coated resin film |
| 10/23/2008 | WO2008125373A1 Method for producing a conductive track structure on a metal base plate |
| 10/23/2008 | WO2008125372A1 Method for the production of a signal and potential distribution system for mechatronic modules |
| 10/23/2008 | WO2008125370A1 Module for an electronic controller having a simplified design |
| 10/23/2008 | WO2008125010A1 A method of manufacturing the high heat conductive circuit substrate |
| 10/23/2008 | WO2008125009A1 A high heat conductive circuit substrate |
| 10/23/2008 | WO2008073410A3 Crystalline encapsulants |
| 10/23/2008 | US20080261415 Electrical connection board and assembly of such a board and a semiconductor component comprising an integrated circuit chip |
| 10/23/2008 | US20080261338 Method For Manufacturing an Electronics Module Comprising a Component Electrically Connected to a Conductor-Pattern Layer |
| 10/23/2008 | US20080261086 Printed circuit board and fuel cell |
| 10/23/2008 | US20080260142 Splitter architecture for a telecommunications system |
| 10/23/2008 | US20080259581 Circuitized substrates utilizing smooth-sided conductive layers as part thereof |
| 10/23/2008 | US20080259577 Flexible biomonitor with emi shielding and module expansion |
| 10/23/2008 | US20080259576 Electronic Device or Circuit and Method for Fabricating the Same |
| 10/23/2008 | US20080259575 Tape-Style Flexible Circuit Board, and Manufacturing Method and Manufacturing Apparatus for the Same |
| 10/23/2008 | US20080258873 Functional Laminate |
| 10/23/2008 | US20080258561 Power interface apparatus and method |
| 10/23/2008 | US20080258283 Wiring board and semiconductor package using the same |
| 10/23/2008 | US20080257968 Ic card |
| 10/23/2008 | US20080257967 IC card module |
| 10/23/2008 | US20080257597 Printed circuit board manufacturing method and printed circuit board |
| 10/23/2008 | US20080257596 Wiring board manufacturing method, semiconductor device manufacturing method and wiring board |
| 10/23/2008 | US20080257594 Printed board assembly and a method |
| 10/23/2008 | US20080257593 Printed circuit board, method of manufacturing the same, and apparatus for perforating via holes |
| 10/23/2008 | US20080257591 Printed wiring board and a method of production thereof |
| 10/23/2008 | US20080257590 High thermal conducting circuit substrate and manufacturing process thereof |
| 10/23/2008 | US20080257589 Method for the production of expandable circuit carrier and expandable circuit carrier |
| 10/23/2008 | US20080257588 Capacitor Layer Forming Material, Manufacturing Method Thereof, and Printed Wiring Board with Embedded Capacitor Layer Obtained Using Capacitor Layer Forming Material |
| 10/23/2008 | US20080257587 Rigid-flex printed circuit board with weakening structure |
| 10/23/2008 | US20080257586 Flexible circuit structure with stretchability and method of manufacturing the same |
| 10/23/2008 | US20080257585 Electrical Power Substrate |
| 10/23/2008 | US20080257584 Multilayer wiring board |
| 10/23/2008 | US20080257583 Layout circuit |
| 10/23/2008 | DE112006003405T5 Hochfrequenzsubstrat und Herstellungsverfahren dafür High-frequency substrate and manufacturing method thereof |
| 10/23/2008 | DE102007039608A1 Circuit arrangement for use in signal processing device of e.g. channel hearing aid, has surface mount device components connected with contact on assembly sides of printed circuit boards, where assembly sides are opposite to each other |
| 10/23/2008 | DE102007018241A1 Elektrische Bedieneinheit, insbesondere Funkschlüssel für ein Kraftfahrzeug Electrical control unit, in particular radio key for a motor vehicle |
| 10/23/2008 | DE102007017529A1 Modul für ein elektronisches Steuergerät mit vereinfachtem Aufbau Module for an electronic control device with a simplified structure |
| 10/22/2008 | EP1983809A2 Printed wiring board |
| 10/22/2008 | EP1983808A1 Method for manufacturing tape carrier for contact type IC card |
| 10/22/2008 | EP1983591A1 Composite films suitable for use in opto-electronic and electronic devices |
| 10/22/2008 | EP1983467A1 Data carrier/transmission device and method for manufacturing it |
| 10/22/2008 | EP1982636A1 In vivo sensing device with a circuit board having rigid sections and flexible sections |
| 10/22/2008 | EP1651806A4 Cellulosic fibers having enhanced reversible thermal properties and methods of forming thereof |
| 10/22/2008 | EP1446993B1 I-channel surface-mount connector with extended flanges and method for interconnecting circuit boards |
| 10/22/2008 | CN201138891Y Assembly combination of printed circuit board |
| 10/22/2008 | CN201138890Y Construction of space keeping column of circuit board |
| 10/22/2008 | CN201138409Y Back light module unit and liquid crystal display |
| 10/22/2008 | CN201138405Y Liquid crystal display device |
| 10/22/2008 | CN201135457Y Auxiliary electronic plate for clinical percussion |
| 10/22/2008 | CN101292576A A component adapted for being mounted on a substrate and a method of mounting a surface mounted device |
| 10/22/2008 | CN101291565A Printed wiring board |
| 10/22/2008 | CN101291564A Manufacturing process of resistor plate, obtained resistor plate and application thereof |
| 10/22/2008 | CN101291562A Capacitor and its manufacture method |
| 10/22/2008 | CN101291090A Printed circuit board holding structure of micro motor |
| 10/22/2008 | CN101290919A Memory encapsulation component and module card using the same |
| 10/22/2008 | CN101290915A 布局电路 The layout of the circuit |
| 10/22/2008 | CN101290890A Circuit board with internally embedded conductive wire and manufacturing method therefor |
| 10/22/2008 | CN101290889A Wiring board manufacturing method, semiconductor device manufacturing method and wiring board |
| 10/22/2008 | CN101290663A Ic card and an adapter for the same |
| 10/22/2008 | CN101290429A LCD device and its backlight module group |
| 10/22/2008 | CN101290406A Line and liquid crystal display panel applying same |
| 10/22/2008 | CN100428875C 基底保持器 Substrate holder |
| 10/22/2008 | CN100428870C Six-layer printed circuit board laminated structure |
| 10/22/2008 | CN100428617C Temperature detection method of semiconductor device and power conversion apparatus |
| 10/22/2008 | CN100428448C Circuit apparatus and method of manufacturing the same |
| 10/22/2008 | CN100428373C Resistor with leading wires and its installing structure |