Patents for H05K 1 - Printed circuits (98,583)
03/2009
03/05/2009US20090056987 Multilayer ceramic electronic device and method for manufacturing the same
03/05/2009US20090056986 Integrated circuit (ic) carrier assembly with first and second suspension means
03/05/2009US20090056985 Printed circuit board and method of production of an electronic apparatus
03/05/2009US20090056984 Signal transmission structure and layout method for the same
03/05/2009US20090056983 Printed circuit board
03/05/2009US20090056982 Process for producing a double-sided flexible printed board and double-sided flexible printed board
03/05/2009US20090056981 Thin film-laminated polyimide film and flexible printed wiring board
03/05/2009US20090056980 Printed Circuit Board
03/05/2009US20090056979 Printed circuit board, method of manufacturing the printed circuit board, memory module having the printed circuit board and method of manufacturing the memory module
03/05/2009US20090056978 Multilayer ceramic circuit board having protruding portion and method for manufacturing the same
03/05/2009US20090056977 Production method of solder circuit board
03/05/2009US20090056120 Biosensor and method of making
03/05/2009US20090056117 Method of partially attaching an material for various types of printed circuit boards
03/05/2009DE202008010522U1 Gedruckte Leiterplattenanordnung Printed circuit board assembly
03/05/2009DE102007041904A1 Combined solder joint for attachment of electrical component with printed circuit board, has push through connection surface running through printed circuit board and connected with printed circuit board by reflow surface soldered joint
03/05/2009DE102007041892A1 Elektrische Schaltanordnung mit einem MID-Schaltungsträger und einer damit verbundenen Verbindungsschnittstelle Electrical switching arrangement having a circuit carrier MID and an associated connection interface
03/05/2009DE102007041770A1 Leiterplattenstapel aus löttechnisch miteinander verbundenen Leiterplatten PCB stack of löttechnisch interconnected printed circuit boards
03/05/2009DE102007041335A1 Vorrichtung zur Anordnung von LED-Leuchten Apparatus for assembly of LED lights
03/05/2009DE102004033401B4 Montageanordnung für eine elektronische Baueinheit und Baueinheit damit A mounting arrangement for an electronic assembly and assembly so that
03/05/2009CA2638256A1 Manufacturing method for a card and card obtained by said method
03/04/2009EP2031946A1 Wiring board with built-in component and method for manufacturing wiring board with built-in component
03/04/2009EP2031944A1 Printed wiring board
03/04/2009EP2031761A1 Communication device and electronic apparatus using the same
03/04/2009EP2030208A2 Transformer
03/04/2009EP1419560B1 High data rate interconnecting device
03/04/2009EP1327928B1 Connector receptacle
03/04/2009CN201204757Y Apparatus for restraining noise interference
03/04/2009CN201204756Y Circuit board for residual current motion protection circuit-breaker
03/04/2009CN201204755Y Multi-layer board type printed circuit board capable of ensuring power tube to earth well
03/04/2009CN201204754Y Paper phenol coating copper plate
03/04/2009CN201204753Y Novel paper phenol coating copper plate
03/04/2009CN201204752Y Epoxy glass-cloth coating copper plate
03/04/2009CN201204751Y Novel epoxy glass-cloth coating copper plate
03/04/2009CN201204750Y Epoxy paper glass-cloth coating copper plate
03/04/2009CN201204749Y Novel epoxy paper glass-cloth coating copper plate
03/04/2009CN201204748Y Paper phenol glass-cloth coating copper plate
03/04/2009CN201204747Y Novel paper phenol glass-cloth coating copper plate
03/04/2009CN201204746Y Moistureproof circuit board
03/04/2009CN201204745Y Printed circuit with electronic label
03/04/2009CN201204744Y Structure improvement for two-sided multilayer metal-based circuit board
03/04/2009CN201204743Y Typesetting structure for printed circuit board
03/04/2009CN201204742Y Typesetting structure for printed circuit board
03/04/2009CN201203754Y Image acquisition module
03/04/2009CN201203021Y Backlight module
03/04/2009CN201201562Y Automobile voltage-stabilizing apparatus
03/04/2009CN101379894A Printed circuit board with additional functional elements, method of production and use
03/04/2009CN101379893A Substrates for electronic circuitry type applications
03/04/2009CN101379892A Pulsed laser bonding method for stacking electric elements based on silicon throughhole
03/04/2009CN101379344A LED illumination assembly with compliant foil construction
03/04/2009CN101379118A Epoxy resin curable composition for prepreg
03/04/2009CN101378633A Printed wiring board
03/04/2009CN101378626A Ceramic circuit board and manufacturing method thereof
03/04/2009CN101378624A Module structure integrating perimeter circuit and manufacturing method thereof
03/04/2009CN101378623A Multilayer ceramic substrate with inner-imbedded foveae and manufacture method
03/04/2009CN101378622A Covering film for flexible circuit board and preparation method thereof
03/04/2009CN101378621A Connection structure between wired circuit boards
03/04/2009CN101378620A Heat-resisting structure
03/04/2009CN101378619A Electrical signal connecting unit, antenna device and mobile communication device having the same
03/04/2009CN101378618A 印刷电路板 A printed circuit board
03/04/2009CN101378617A Apparatus for dynamically configuring chip pin function
03/04/2009CN101378044A Wiring board, method of designing the same, and electronic apparatus
03/04/2009CN101377970A Interactive screw type inductive element
03/04/2009CN100466895C Radiator structure
03/04/2009CN100466881C Copper foil with resistive layer and circuit substrate materials with resistance layer
03/04/2009CN100466880C Electrode substrate of two-dimensional display
03/04/2009CN100466388C Connecting device of a flexible printed circuit board
03/04/2009CN100466338C Fuse used on lithium-ion cell and the lithium-ion cell including the fuse
03/04/2009CN100465633C A hand-held electrochemistry analyzer
03/04/2009CN100465597C An electronic heating-cost distributor
03/04/2009CN100465341C A forming method of copper for chrome-plating of printed circuit boards
03/04/2009CN100465336C A wiring substrate and a manufacturing method thereof and chemical copper plating solution therein
03/04/2009CN100464973C A multi-layer substrate and a semi-conductor device using the multi-layer substrate
03/04/2009CN100464967C A manufacturing method of flexible laminates
03/03/2009US7499287 Printed wiring board with enhanced structural integrity
03/03/2009US7498523 Direct wire attach
03/03/2009US7498522 Multilayer printed circuit board and manufacturing method thereof
03/03/2009US7498521 Method and apparatus for marking a printed circuit board
03/03/2009US7498520 Semiconductor multilayer wiring board and method of forming the same
03/03/2009US7498200 Electronic-parts-packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film
03/03/2009US7498193 Package with barrier wall and method for manufacturing the same
03/03/2009US7498086 Heat resistant film and metal laminate thereof
03/03/2009US7497703 Method and apparatus for providing symmetrical signal return path in differential systems
03/03/2009US7497697 PCB connector including plug and socket contacts for easy positioning
03/03/2009US7497695 Connection structure for printed wiring board
02/2009
02/26/2009WO2009025319A1 Polyimide composition, flexible wiring board, and process for producing flexible wiring board
02/26/2009WO2009025283A1 Novel polyimide resin and photosensitive polyimide resin composition
02/26/2009WO2009025156A1 Ceramic composition, method for producing the same, ceramic substrate and method for producing ceramic green layer
02/26/2009WO2009025059A1 Printed board and method for producing the same
02/26/2009WO2009024801A1 High thermal performance packaging for optoelectronics devices
02/26/2009WO2009024583A1 Method for assembling electrical components equipped with terminal pins on a printed circuit board
02/26/2009WO2009024565A1 Module for an integrated control logic having a simplified design
02/26/2009WO2009002513A3 Fpc-based relay connector
02/26/2009US20090053459 Conductive connecting pin and package substrate
02/26/2009US20090052171 Heat-dispensing structure for the led's lamp
02/26/2009US20090052150 Wiring board, method of manufacturing the same, and semiconductor device having wiring board
02/26/2009US20090052146 Printed Board
02/26/2009US20090052142 Electronic device and method of forming same
02/26/2009US20090051563 Electronic device with remote controller
02/26/2009US20090051015 Semiconductor device and printed circuit board
02/26/2009US20090050920 Ceramic wiring board and process for producing the same, and semiconductor device using the same