| Patents for H05K 1 - Printed circuits (98,583) |
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| 01/20/2009 | US7480364 High voltage tank assembly for radiation generator |
| 01/20/2009 | US7480152 Thin module system and method |
| 01/20/2009 | US7480150 Printed wiring board and method of manufacturing the same |
| 01/20/2009 | US7479857 Systems and methods for blocking microwave propagation in parallel plate structures utilizing cluster vias |
| 01/20/2009 | US7479849 Dielectric resonator device, oscillator and transmitter-receiver apparatus |
| 01/20/2009 | US7479697 Resilient carrier assembly for an integrated circuit |
| 01/20/2009 | US7479620 Heater and the method for producing the same using PCB |
| 01/20/2009 | US7479604 Flexible appliance and related method for orthogonal, non-planar interconnections |
| 01/20/2009 | US7479345 Circuit assembly for battery pack or the like, and method of making the same |
| 01/20/2009 | US7479018 Electronic component assembly |
| 01/20/2009 | US7478472 Method of making circuitized substrate with signal wire shielding |
| 01/20/2009 | CA2270415C Flexible wearable computer system |
| 01/15/2009 | WO2009009072A1 Compositions and methods for creating electronic circuitry |
| 01/15/2009 | WO2009009070A1 Compositions and methods for creating electronic circuitry |
| 01/15/2009 | WO2009008471A1 Copper foil with dielectric layer |
| 01/15/2009 | WO2009008131A1 Resin sheet for circuit board and method for manufacturing the resin sheet |
| 01/15/2009 | WO2009008029A1 Circuit substrate |
| 01/15/2009 | WO2009006762A1 Multilayer substrate and fabricating method thereof |
| 01/15/2009 | WO2008137335A3 Heat management system for a power switching device |
| 01/15/2009 | US20090016671 Multilayer printed circuit board |
| 01/15/2009 | US20090016033 Integrated circuit package system with flexible substrate and mounded package |
| 01/15/2009 | US20090016032 Integrated circuit package system with flexible substrate and recessed package |
| 01/15/2009 | US20090016031 Circuit connection structure and printed circuit board |
| 01/15/2009 | US20090016030 Circuit board, connection structure, and apparatus |
| 01/15/2009 | US20090015354 Electromagnetic bandgap structure, printed circuit board comprising this and method thereof |
| 01/15/2009 | US20090015289 Signal transmitting device suited to fast signal transmission |
| 01/15/2009 | US20090014895 Interposer chip, method of manufacturing the interposer chip, and multi-chip package having the interposer chip |
| 01/15/2009 | US20090014207 Wiring board and method of manufacturing the same |
| 01/15/2009 | US20090014206 Printed wiring board and electronic apparatus including same |
| 01/15/2009 | US20090014205 Printed circuit board assembled panel, unit sheet for packaging a printed circuit board, rigid-flexible board and method for manufacturing the same |
| 01/15/2009 | US20090014204 Flexible printed circuit board |
| 01/15/2009 | DE102007032278A1 Panel for use as module substrate of high-frequency device, has contact surfaces on upper sides of module sections, and connecting line electrically connecting test points or switching circuits in panel with each other |
| 01/15/2009 | DE102007032277A1 Multi-layer panel with module sections, for integrated circuits, has external test connections linked to internal test points unconnected to any components |
| 01/14/2009 | EP2015360A2 Electronic component with side contacts |
| 01/14/2009 | EP2014143A2 Conductive polymer electronic devices with surface mountable configuration and methods for manufacturing same |
| 01/14/2009 | EP2013937A2 Planar mixed-signal circuit board |
| 01/14/2009 | EP1625778A4 Method for simulation of electronic circuits and n-port systems |
| 01/14/2009 | EP1610132B1 Fabricating interconnects using sacrificial substrates |
| 01/14/2009 | EP1576205B1 Plating of multi-layer structures |
| 01/14/2009 | EP1559165A4 Improved energy devices |
| 01/14/2009 | EP1275153B1 Carrier substrate for electronic components |
| 01/14/2009 | CN201182037Y Two-sided hollow-out plate |
| 01/14/2009 | CN201181617Y Labeling seat and electronic element using the same |
| 01/14/2009 | CN201179114Y CMOS die set |
| 01/14/2009 | CN101347058A Method of producing multilayer ceramic substrate |
| 01/14/2009 | CN101347057A Multilayer wiring board, and electronic module and electronic device provided with such multilayer wiring board |
| 01/14/2009 | CN101347055A Soldering mounting structure, production method and device for the same, electronic apparatus, and wiring board |
| 01/14/2009 | CN101347052A Method and apparatus for connecting printed wiring boards |
| 01/14/2009 | CN101346787A Electrical circuit device |
| 01/14/2009 | CN101346449A Adhesive composition, circuit connecting material and connecting structure of circuit member |
| 01/14/2009 | CN101346047A Multi-layer circuit board production method and inner layer substrates for producing the same |
| 01/14/2009 | CN101346042A Rolled copper foil |
| 01/14/2009 | CN101346041A Configurable printed circuit board |
| 01/14/2009 | CN101346040A Circuit connection structure and printed circuit board |
| 01/14/2009 | CN101346039A Novel via structure for improving signal integrity |
| 01/14/2009 | CN101346038A Multi-layer substrate and manufacturing method thereof |
| 01/14/2009 | CN101346037A Multi-layer substrate and manufacturing method thereof |
| 01/14/2009 | CN101346036A Coiling examination module for line on circuit board and its coiling method |
| 01/14/2009 | CN101346035A Flexible circuit board |
| 01/14/2009 | CN101345297A Button battery electrical connection structure and its manufacture process |
| 01/14/2009 | CN101345228A Substrate for mounting device, manufacturing method thereof, semiconductor module and portable equipment |
| 01/14/2009 | CN101345131A Finger insertion type capacitor |
| 01/14/2009 | CN101344831A Condenser type touching control panel reducing line impedence by FPC |
| 01/14/2009 | CN101344624A Optoelectronic combination printing circuit board with optical interconnection direct coupling between chips |
| 01/14/2009 | CN101343412A Prepreg and laminate |
| 01/14/2009 | CN101342817A Terminals for circuit board |
| 01/14/2009 | CN100452943C Electronic device substrate, electronic device, method of manufacturing electronic device |
| 01/14/2009 | CN100452600C Anti-distort casing for electronic circuit |
| 01/14/2009 | CN100452536C Printing circuit board with shielded joint |
| 01/14/2009 | CN100452372C Semiconductor device having tin-based solder layer and method for manufacturing the same |
| 01/14/2009 | CN100452342C Method for manufacturing board with built-in device and board with built-in device, and method for manufacturing printed wiring board and printed wiring board |
| 01/14/2009 | CN100452176C Method for providing electrical crossover in laminated structure |
| 01/14/2009 | CN100451583C Electronic circuit device |
| 01/14/2009 | CN100450648C Surface mount-type vibration motor and fixation structure for surface mount-type vibration motor |
| 01/13/2009 | US7478353 Non-uniform decoupling capacitor distribution for uniform noise reduction across chip |
| 01/13/2009 | US7478287 Semiconductor integrated circuit and electronic device |
| 01/13/2009 | US7477736 Simple hinge unit capable of providing electrical connection in an electronic apparatus |
| 01/13/2009 | US7477526 Branching fully-buffered memory-module with two downlink and one uplink ports |
| 01/13/2009 | US7477521 Isolating stress on a printed circuit board |
| 01/13/2009 | US7477194 Conductive pattern and method of making |
| 01/13/2009 | US7476995 Central power distributing member for a brushless motor, a brushless motor provided therewith and a method of assembling it |
| 01/13/2009 | US7476977 Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip |
| 01/13/2009 | US7476814 Multilayer interconnection board |
| 01/13/2009 | US7476813 Multilayer flip-chip substrate interconnect layout |
| 01/13/2009 | US7476812 Printed circuit board and manufacturing method thereof |
| 01/13/2009 | US7476811 Semiconductor device and manufacturing method therefor |
| 01/13/2009 | US7476449 Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield |
| 01/13/2009 | US7476113 Joint member and joint connector for wire harness |
| 01/13/2009 | US7476109 Electrical connector assembled with a bondable element |
| 01/13/2009 | US7475825 Data distribution method |
| 01/13/2009 | US7475784 Device for detecting the removal of a product from a packing system by an electronic unit |
| 01/13/2009 | US7475474 Method of making tamper detection circuit for an electronic device |
| 01/13/2009 | CA2385562C Split inductor with fractional turn of each winding and pcb including same |
| 01/08/2009 | WO2009004894A1 Display module, liquid crystal display device and method for manufacturing display module |
| 01/08/2009 | WO2009004855A1 Wiring substrate manufacturing method |
| 01/08/2009 | WO2009003791A1 Electronic module and method for producing an electronic module |
| 01/08/2009 | WO2009003652A1 Substrate comprising a highly conductive layer |
| 01/08/2009 | WO2009003505A1 A multilayer pwb and a method for producing the multilayer pwb |
| 01/08/2009 | WO2009003252A1 Automotive electromechanic relay base with parallel terminals, for use in multiple pins boxes, with fast electric central clamping system |
| 01/08/2009 | WO2008008552A3 Build-up printed wiring board substrate having a core layer that is part of a circuit |