| Patents for H05K 1 - Printed circuits (98,583) |
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| 04/02/2009 | US20090086443 Interface module |
| 04/02/2009 | US20090086427 Semiconductor device |
| 04/02/2009 | US20090085193 Heat-releasing printed circuit board and semiconductor chip package |
| 04/02/2009 | US20090084598 Coreless substrate and method of manufacture thereof |
| 04/02/2009 | US20090084597 Circuit board and connection substrate |
| 04/02/2009 | US20090084596 Multi-layer board incorporating electronic component and method for producing the same |
| 04/02/2009 | US20090084595 Printed circuit board and manufacturing method of the same |
| 04/02/2009 | US20090084594 Heat resistant substrate incorporated circuit wiring board |
| 04/02/2009 | US20090084593 High-frequency circuit components |
| 04/02/2009 | US20090084592 Semiconductor device including wiring excellent in impedance matching, and method for designing the same |
| 04/02/2009 | US20090084591 Cavity capacitor fabrication method and printed circuit board having embedded cavity capacitor |
| 04/02/2009 | US20090084590 Circuit board |
| 04/02/2009 | US20090084589 Lead terminal bonding method and printed circuit board |
| 04/02/2009 | US20090084588 Circuit board, electronic device and method for manufacturing the same |
| 04/02/2009 | US20090084587 Wiring board and method of preventing high voltage damage |
| 04/02/2009 | US20090084586 Assembly comprising an electromagnetically screened smd component, method and use |
| 04/02/2009 | US20090084585 Wiring substrate and method of manufacturing the same |
| 04/02/2009 | US20090084584 Printed circuit board |
| 04/02/2009 | US20090084583 Multilayer printed wiring board and method for fabrication thereof |
| 04/02/2009 | US20090084582 Printed circuit board having stepped conduction layer |
| 04/02/2009 | DE102007046639A1 Electrical printed circuit board arrangement i.e. LED-illumination device, for illuminating objects, has carrier plate sections bent in angular position along material attenuation regions i.e. material bridges |
| 04/02/2009 | DE102004064028B4 Verfahren zum Herstellen eines Waferebenenpakets A method of manufacturing a wafer-level package |
| 04/01/2009 | EP2043417A2 Circuit device, circuit module, and outdoor unit |
| 04/01/2009 | EP2043412A1 Conductor rail with heat conduction |
| 04/01/2009 | EP2043153A1 Wiring board and solid-state imaging device |
| 04/01/2009 | EP2043130A2 Multipole coils |
| 04/01/2009 | EP2042540A1 Polyimide resin |
| 04/01/2009 | EP2042007A2 Photosensitive conductive paste for electrode formation and electrode |
| 04/01/2009 | EP2042006A2 Metal compositions, thermal imaging donors and patterned multilayer compositions derived therefrom |
| 04/01/2009 | EP2041209A2 Articles comprising a polyimide solvent cast film having a low coefficient of thermal expansion and method of manufacture thereof |
| 04/01/2009 | EP1676182B8 Circuit security |
| 04/01/2009 | EP1327265B1 Electronic module having canopy-type carriers |
| 04/01/2009 | CN201216042Y Second order hole overlapping construction constructed by reverse suspension type blind hole |
| 04/01/2009 | CN101401493A Methods of forming a flexible circuit board |
| 04/01/2009 | CN101401492A Layered label structure with timer |
| 04/01/2009 | CN101401491A Insulating resin layer, insulating resin layer with carrier and multilayer printed wiring board |
| 04/01/2009 | CN101401490A Illumination assembly with enhanced thermal conductivity |
| 04/01/2009 | CN101401304A 高频模块 High-frequency module |
| 04/01/2009 | CN101400706A Photocurable/thermosetting resin composition, cured product and printed wiring board |
| 04/01/2009 | CN101400246A Conductor rail with heat conduction |
| 04/01/2009 | CN101400221A Circuit board |
| 04/01/2009 | CN101400219A Multilayer printed wiring board and method for fabrication thereof |
| 04/01/2009 | CN101400212A Method for producing printed circuit board for local region high frequency circuit by half-addition method |
| 04/01/2009 | CN101400210A Printed circuit board equipped with LED |
| 04/01/2009 | CN101400209A Protective circuit board and battery pack using the same |
| 04/01/2009 | CN101400208A Printed circuit board |
| 04/01/2009 | CN101399403A Package construction module having high density electric connection and packaging method |
| 04/01/2009 | CN101399246A Package substrate structure and production method thereof |
| 04/01/2009 | CN101398623A Photosensitive composition, phososensitive film, photosensitive laminated body, permanent pattern forming method and printed substrate |
| 04/01/2009 | CN101398620A Photosensitive composition, photosensitive film, photosensitive laminated body, permanent pattern forming method and printed circuit board |
| 04/01/2009 | CN101397656A Metallised parts made from plastic material |
| 04/01/2009 | CN100475014C Operating circuit for a lamp with a heat sink |
| 04/01/2009 | CN100475006C Production technique for surface mounting multi-layer resistive plate |
| 04/01/2009 | CN100475004C Wiring board manufacturing method |
| 04/01/2009 | CN100475003C Printing circuit board embedding electronic device and manufacture method thereof |
| 04/01/2009 | CN100475002C Printed circuit board, method of soldering electronic components, and air conditioning apparatus with printed circuit board |
| 04/01/2009 | CN100475001C Multilayer structure forming method, method of manufacturing wiring board, and method for manufacturing electronic apparatus |
| 04/01/2009 | CN100475000C Electric circuit module and method for assembling the same |
| 04/01/2009 | CN100474999C Copper size and wiring board using the same |
| 04/01/2009 | CN100474709C Electrical connector |
| 04/01/2009 | CN100474704C EMI shielded module |
| 04/01/2009 | CN100474577C Base board and electric test method therefor |
| 04/01/2009 | CN100474470C Electrical equipment |
| 04/01/2009 | CN100474433C Stacked memory, memory module and memory system |
| 04/01/2009 | CN100474395C Suspension board with circuit |
| 04/01/2009 | CN100474347C Improved resonance security tag and method for producing the same |
| 04/01/2009 | CN100474024C Lens barrel for camera |
| 03/31/2009 | US7511969 Composite core circuit module system and method |
| 03/31/2009 | US7511968 Buffered thin module system and method |
| 03/31/2009 | US7511962 Flexible printed circuit board |
| 03/31/2009 | US7511378 Enhancement of performance of a conductive wire in a multilayered substrate |
| 03/31/2009 | US7511365 Thermal enhanced low profile package structure |
| 03/31/2009 | US7511228 Printed circuit board |
| 03/31/2009 | US7510759 Electronic part and manufacturing method thereof |
| 03/31/2009 | US7510617 Transfer sheet |
| 03/31/2009 | US7510592 reducing ions of a metal by precipitation with a reducing agent in a liquid-phase reaction system so that the metal is precipitated as metal powder particles; reducing agent is a reducing saccharide or a glycitol |
| 03/31/2009 | US7510427 Electrical connector with guiding portion |
| 03/26/2009 | WO2009038950A2 Flexible circuit board, manufacturing method thereof, and electronic device using the same |
| 03/26/2009 | WO2009038884A1 Lead frame for circuit board |
| 03/26/2009 | WO2009038190A1 Adhesive composition and bonded body |
| 03/26/2009 | WO2009038042A1 Laminated mounting structure and method for manufacturing laminated mounting structure |
| 03/26/2009 | WO2009037995A1 High output power amplifier, wireless transmitter, wireless transmitting and receiving device, and high output power amplifier mounting method |
| 03/26/2009 | WO2009037918A1 High frequency substrate and high frequency module using same |
| 03/26/2009 | WO2009037833A1 Solid printed wiring board, method for manufacturing solid printed wiring board, and electronic component module |
| 03/26/2009 | WO2009037807A1 Electronic component package and method for producing the same |
| 03/26/2009 | WO2009037796A1 Structure for fixing flexible wiring board |
| 03/26/2009 | WO2009037722A1 Led illuminating device |
| 03/26/2009 | WO2009037250A1 Multilayer circuit board and use of a multilayer circuit board |
| 03/26/2009 | WO2009037145A2 Method for the production of an electronic assembly, and electronic assembly |
| 03/26/2009 | WO2009036478A2 Printed circuit board element and method for the production thereof |
| 03/26/2009 | WO2009012914A4 Illumination device |
| 03/26/2009 | WO2008070524A8 Systems, devices, and methods for powering and/or controlling devices, for instance transdermal delivery devices |
| 03/26/2009 | WO2005065238A3 Micro pin grid array with pin motion isolation |
| 03/26/2009 | US20090081894 Insulative housing for configuring socket connector having pivotally mounted clip |
| 03/26/2009 | US20090080830 Optoelectronic integrated circuit board and communications device using the same |
| 03/26/2009 | US20090080168 Printed circuit board, fabrication method and apparatus |
| 03/26/2009 | US20090080164 Memory system and method |
| 03/26/2009 | US20090080158 Comb-shaped power bus bar assembly structure having integrated capacitors |
| 03/26/2009 | US20090080151 Heat transfer system |
| 03/26/2009 | US20090079059 Integrated semiconductor substrate structure using incompatible processes |