| Patents for H05K 1 - Printed circuits (98,583) |
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| 04/29/2009 | CN101420818A Differentiate wiring architecture |
| 04/29/2009 | CN101420817A Circuit board having improved welding disk |
| 04/29/2009 | CN101419966A Semiconductor integrated circuit device |
| 04/29/2009 | CN101419950A Circuitized substrate with internal cooling structure and electrical assembly utilizing same |
| 04/29/2009 | CN101419949A Circuit apparatus and method of manufacturing the same |
| 04/29/2009 | CN101419324A Camera shooting module |
| 04/29/2009 | CN100484372C Printed-wiring board and method of producing the same |
| 04/29/2009 | CN100484371C Welding disk for preventing host board short circuit |
| 04/29/2009 | CN100484368C Signal wiring capable of being overlay combined |
| 04/29/2009 | CN100484367C Printed circuit board with high speed holding-wire wiring structure |
| 04/29/2009 | CN100484366C Method for preparing multilayer ceramic substrate |
| 04/29/2009 | CN100484365C Flexible printed circuit board |
| 04/29/2009 | CN100484364C Near-end crosstalk compensation at multi-stages |
| 04/29/2009 | CN100484363C Wiring circuit board and production method thereof |
| 04/29/2009 | CN100484200C Camera assembly package |
| 04/29/2009 | CN100483763C Method for preparing copper film thicken copper-coating ceramic substrate |
| 04/29/2009 | CN100483706C An integrated circuit package substrate having a thin film capacitor structure |
| 04/29/2009 | CN100483694C Package for semiconductor devices |
| 04/29/2009 | CN100483565C Insulating material, film, circuit board and method for manufacture thereof |
| 04/29/2009 | CN100483487C Image display apparatus using thin-film transistors |
| 04/29/2009 | CN100483457C Memory cards having two standard sets of contacts |
| 04/29/2009 | CN100483190C Audio signal processing circuit and a display device incorporating the same |
| 04/29/2009 | CN100483024C Heat radiation structure of LED lamp |
| 04/29/2009 | CN100482756C Electrode connection method and surface processing distribution panel and adhesive film used thereof |
| 04/28/2009 | US7526207 Flexible circuit design for improved laser bias connections to optical subassemblies |
| 04/28/2009 | US7526153 Optical element device and two-dimensional optical waveguide device and optoelectronic circuit board using the same |
| 04/28/2009 | US7526152 Substrate for mounting IC chip, substrate for motherboard, device for optical communication, manufacturing method of substrate for mounting IC chip, and manufacturing method of substrate for motherboard |
| 04/28/2009 | US7525817 Wiring layout of auxiliary wiring package and printed circuit wiring board |
| 04/28/2009 | US7525816 Wiring board and wiring board connecting apparatus |
| 04/28/2009 | US7525814 Wiring board and method for manufacturing the same |
| 04/28/2009 | US7525808 Device, system, and method of flexible hardware connectivity |
| 04/28/2009 | US7525807 Semiconductor memory device |
| 04/28/2009 | US7525768 Electrical connection between a suspension flexure cable and a head stack assembly flexible circuit |
| 04/28/2009 | US7525628 Planar display module |
| 04/28/2009 | US7525602 Liquid crystal television apparatus |
| 04/28/2009 | US7525221 Connection arrangement for connecting an electronic component and a power circuit of a control device |
| 04/28/2009 | US7525190 Printed wiring board with wiring pattern having narrow width portion |
| 04/28/2009 | US7525139 Image sensor with a protection layer |
| 04/28/2009 | US7525093 Liquid or gas sensor and method |
| 04/28/2009 | US7525049 Electronic component case and battery and electric double layer capacitor |
| 04/28/2009 | US7524703 Integrated circuit stacking system and method |
| 04/28/2009 | US7524552 Copper foil provided with dielectric layer for forming capacitor layer, copper clad laminate for formation of capacitor layer using such copper foil with dielectric layer, and method for manufacturing producing such copper foil with dielectric layer for formation of capacitor layer |
| 04/28/2009 | US7524528 Precursor compositions and methods for the deposition of passive electrical components on a substrate |
| 04/28/2009 | CA2497118C Surface mount technology evaluation board |
| 04/28/2009 | CA2230321C A two-part electromagnetic radiation shielding device for mounting on a printed circuit board |
| 04/23/2009 | WO2009051679A2 Process for placing, securing and interconnecting electronic components |
| 04/23/2009 | WO2009051239A1 Wiring board, mounting structure and method for manufacturing wiring board |
| 04/23/2009 | WO2009051183A1 Connecting terminal, semiconductor package, wiring board, connector and micro contactor |
| 04/23/2009 | WO2009051071A1 Flexible board |
| 04/23/2009 | WO2009051067A1 Adhesive composition, circuit connecting material using the adhesive composition, method for connecting circuit member, and circuit connecting body |
| 04/23/2009 | WO2009051043A1 Circuit connecting adhesive film and circuit connecting structure |
| 04/23/2009 | WO2009050851A1 Circuit board and electronic device |
| 04/23/2009 | WO2009050779A1 Printed board unit and electronic device |
| 04/23/2009 | WO2009050629A1 Multi-layer woven fabric display |
| 04/23/2009 | WO2009050515A1 Product packaging |
| 04/23/2009 | WO2009049891A1 Method for producing a vehicle antenna device |
| 04/23/2009 | WO2009021233A3 Pcb droplet actuator fabrication |
| 04/23/2009 | US20090105060 Composition for ceramic substrate, ceramic substrate, method for process for producing ceramic substrate, and glass composition |
| 04/23/2009 | US20090103385 Motherboard for supporting different types of memories |
| 04/23/2009 | US20090103302 Circuit Board Assembly and Backlight Module Comprising the Same |
| 04/23/2009 | US20090103276 Circuit device and method of manufacturing the same |
| 04/23/2009 | US20090103274 Warpage preventing substrates and method of making same |
| 04/23/2009 | US20090103272 Dc-dc converter |
| 04/23/2009 | US20090102881 Surface Metallization Of Metal Oxide Pre-Ceramic |
| 04/23/2009 | US20090102812 Wiring board and touch panel using the same |
| 04/23/2009 | US20090102047 Flip chip package structure and carrier thereof |
| 04/23/2009 | US20090101402 Circuit board, and electronic device |
| 04/23/2009 | US20090101401 Wiring board |
| 04/23/2009 | US20090101400 Method for manufacturing component-embedded substrate and component-embedded substrate |
| 04/23/2009 | US20090101399 Suspension board with circuit |
| 04/23/2009 | US20090101398 Method for fixing an electronic component on a printed circuit board and system comprising a printed circuit board and at least one electronic component |
| 04/23/2009 | US20090101397 Printed circuit board having improved solder pad layout |
| 04/23/2009 | US20090101396 Electronic device |
| 04/23/2009 | US20090101395 Printed wiring board and electronic apparatus |
| 04/23/2009 | US20090101394 Photosensitive resin composition and flexible printed wiring circut board having insulative cover layer formed of photosensitive resin composition |
| 04/23/2009 | US20090101393 Metallic Laminate and Method for Preparing the Same |
| 04/23/2009 | US20090101392 Circuit board and semiconductor module using this, production method for circuit board |
| 04/23/2009 | US20090101391 Circuit board having barcode and fabrication method thereof |
| 04/23/2009 | US20090101390 Electronic control unit and process of producing the same |
| 04/23/2009 | US20090101274 Single or Multi-Layer Printed Circuit Board With Improved Via Design |
| 04/23/2009 | DE4345586B4 Verfahren zum Erzeugen von Vielfach-Dickschichtsubstraten A method of generating multiple thick film substrates |
| 04/23/2009 | DE19980146B4 Verfahren zum Verwerten von Altplatinen und mit diesem hergestellte Verbundplatte Method for utilizing Altplatinen and with this manufactured composite board |
| 04/23/2009 | DE102008049404A1 Elektronische Schaltungsvorrichtung und Verfahren zur Herstellung derselben An electronic circuit device and method of manufacturing the same |
| 04/23/2009 | DE102008004842B3 Component arrangement for inserting into high frequency-shielded housing of electronic device i.e. printing device, has electrically conducting yoke inserted into opening of front plate, and card-module extendable into guides via opening |
| 04/23/2009 | DE102007045510A1 Bauteil mit einer flexiblen Kontaktfolie Component with a flexible contact foil |
| 04/23/2009 | DE102007044602A1 Multilayer-Leiterplatte und Verwendung einer Multilayer-Leiterplatte Multi-layer printed circuit board and using a multi-layer printed circuit board |
| 04/22/2009 | EP2051570A1 Method of producing multilayer ceramic substrate |
| 04/22/2009 | EP2051569A2 Laminated printed wiring board with controlled spurious rf emission capability/characteristics |
| 04/22/2009 | EP2050756A1 Phosphorus-containing benzoxazine compound, process for production thereof, curable resin composition, cured article, and laminate plate |
| 04/22/2009 | EP2050319A1 Method for manufacturing conductors and semiconductors |
| 04/22/2009 | EP2050197A1 RF Rx FRONT END MODULE FOR PICOCELL AND MICROCELL BASE STATION TRANSCEIVERS |
| 04/22/2009 | EP1623609B1 Electrical supply unit |
| 04/22/2009 | EP1552732B1 Method and device for joining at least two parts |
| 04/22/2009 | EP1500743B1 Heat-resistant synthetic fiber sheet |
| 04/22/2009 | EP0782766B1 Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same |
| 04/22/2009 | CN201226592Y Silicon microphone packaged by flexible circuit board |
| 04/22/2009 | CN101416567A Relay substrate, method for manufacturing the relay substrate and three-dimensional circuit device using the relay substrate |
| 04/22/2009 | CN101416350A Article provided with feed circuit board |
| 04/22/2009 | CN101416259A Inkjet patterning for thin-film capacitor fabrication, thin-film capacitors fabricated thereby, and systems containing same |
| 04/22/2009 | CN101415317A Anti electromagnetic interference structure for multi-layer printed circuit board |