| Patents for H05K 1 - Printed circuits (98,583) |
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| 04/22/2009 | CN101415297A Printed plate component and method of processing the same |
| 04/22/2009 | CN101415296A Structure for covering copper plate |
| 04/22/2009 | CN101415295A Graphite-based novel electronic circuit board and preparation technique thereof |
| 04/22/2009 | CN101415294A Carbon alloy base novel electronic circuit board and preparation technique thereof |
| 04/22/2009 | CN101414592A Image sensor encapsulation |
| 04/22/2009 | CN101414566A Wiring circuit board, manufacturing method thereof, circuit module provided with this wiring circuit board |
| 04/22/2009 | CN101414499A Multi-layer type over-current and over-temperature protection structure, and preparation method thereof |
| 04/22/2009 | CN101414205A Double-layer computer host |
| 04/22/2009 | CN101414081A Display device |
| 04/22/2009 | CN101412317A Method for placing chip of thermal printhead |
| 04/22/2009 | CN101412298A Method of producing flexible single-sided polyimide copper-clad laminate |
| 04/22/2009 | CN100482048C Wiring board and fabrication method thereof |
| 04/22/2009 | CN100482045C Method and apparatus for manufacturing circuit board |
| 04/22/2009 | CN100482037C Method for manufacturing embedded film resistor of printed circuit board |
| 04/22/2009 | CN100482035C Method for manufacturing heat conductive substrate |
| 04/22/2009 | CN100482033C Connection structure of printed wiring board |
| 04/22/2009 | CN100482032C Printed circuit board having embedded RF module power stage circuit |
| 04/22/2009 | CN100481841C Rotatable hinge mechanism with flexible printed circuit casing |
| 04/22/2009 | CN100481530C Light-emitting unit, light-emitting unit assembly and light-emitting device composed of multiple light-emitting units |
| 04/22/2009 | CN100481444C A modular integrated circuit chip carrier |
| 04/22/2009 | CN100481443C Electronic apparatus |
| 04/22/2009 | CN100481442C Optical module with flexible substrate |
| 04/22/2009 | CN100481362C Fabrication method of semiconductor integrated circuit device |
| 04/22/2009 | CN100481357C Method for manufacturing a substrate with cavity |
| 04/22/2009 | CN100480789C Display device |
| 04/22/2009 | CN100480620C System and method for manufacturing printed circuit boards employing non-uniformly modified images |
| 04/21/2009 | US7523247 Memory module having a clock line and termination |
| 04/21/2009 | US7523246 Memory system having memory devices on two sides |
| 04/21/2009 | US7523244 Memory module having memory devices on two sides |
| 04/21/2009 | US7522886 Radio frequency transceivers |
| 04/21/2009 | US7522428 Electric device designed to be attached to a mounting rail, and corresponding mounting method |
| 04/21/2009 | US7522425 High capacity thin module system and method |
| 04/21/2009 | US7522384 Method of head stack assembly flexible circuit assembly attached to an actuator arm |
| 04/21/2009 | US7522262 Method for determining position of reference point |
| 04/21/2009 | US7521809 Semiconductor device having a chip stack on a rewiring plate |
| 04/21/2009 | US7521789 Electrical assembly having heat sink protrusions |
| 04/21/2009 | US7521788 Semiconductor module with conductive element between chip packages |
| 04/21/2009 | US7521637 Multilayer printed circuit board having via arrangements for reducing crosstalk among vias |
| 04/21/2009 | US7521511 Containing at least one polyimide resin, a phenolic resin component containing at least one phenolic resin, and an epoxy resin component containing at least one epoxy resin; phosphazene and cyanate ester; excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability |
| 04/21/2009 | US7521494 Epoxy resin, SMA copolymer and bis-maleimidetriazine resin |
| 04/21/2009 | US7520784 Electrical connector with improved crosstalk compensation |
| 04/21/2009 | US7520767 Joint member and joint connector for wire harness |
| 04/21/2009 | US7520416 Transparent window with non-transparent contact surface for a soldering bonding |
| 04/21/2009 | US7520053 Method for manufacturing a bump-attached wiring circuit board |
| 04/16/2009 | WO2009048095A1 Circuit device having transmission line and printed circuit board |
| 04/16/2009 | WO2009048070A1 Circuit connecting material and connection structure for circuit member using the same |
| 04/16/2009 | WO2009047854A1 Electrical connection body, method for forming electrical connection body, and cartridge |
| 04/16/2009 | WO2009046546A1 Systems, methods, and apparatus for multilayer superconducting printed circuit boards |
| 04/16/2009 | WO2006089272A3 Selective deposition of embedded transient protection for printed circuit boards |
| 04/16/2009 | US20090099025 Systems, methods, and apparatus for multilayer superconducting printed circuit boards |
| 04/16/2009 | US20090098750 Reliable contact and safe system and method for providing power to an electronic device |
| 04/16/2009 | US20090098643 Multilayer circuit devices and manufacturing methods using electroplated sacrificial structures |
| 04/16/2009 | US20090098350 Conductor composition v |
| 04/16/2009 | US20090097803 Board to board optical interconnect using an optical interconnect assembly |
| 04/16/2009 | US20090097220 Printed circuit board |
| 04/16/2009 | US20090097219 Magnetic and dielectric composite electronic device |
| 04/16/2009 | US20090097218 Capacitor-embedded printed wiring board and method of manufacturing the same |
| 04/16/2009 | US20090097213 Daisy chain optical interconnect |
| 04/16/2009 | US20090097212 Optimization of connector density and identification carrier for high density front plates |
| 04/16/2009 | US20090097211 Circuit module and circuit board assembly having sip connector |
| 04/16/2009 | US20090097209 Driver module structure |
| 04/16/2009 | US20090096082 High speed electrical interconnects and method of manufacturing thereof |
| 04/16/2009 | US20090096063 Semiconductor apparatus with decoupling capacitor |
| 04/16/2009 | US20090095524 Core substrate and method of producing the same |
| 04/16/2009 | US20090095520 Wiring substrate and method of manufacturing the same |
| 04/16/2009 | US20090095519 Current distribution structure and method |
| 04/16/2009 | US20090095518 Wiring board and method of manufacturing the same |
| 04/16/2009 | US20090095517 Double-sided pressure-sensitive adhesive tape or sheet for wiring circuit board and wiring circuit board |
| 04/16/2009 | US20090095516 Double-sided pressure-sensitive adhesive tape or sheet for use in wiring circuit board and wiring circuit board |
| 04/16/2009 | US20090095515 Electro-deposited copper foil, surface-treated copper foil using the electro-deposited copper foil and copper clad laminate using the surface-treated copper foil, and a method for manufacturing the electro-deposited copper foil |
| 04/16/2009 | US20090095514 Wiring board, semiconductor apparatus and method of manufacturing them |
| 04/16/2009 | US20090095513 Solder layer, substrate for device joining utilizing the same and method of manufacturing the substrate |
| 04/16/2009 | US20090095512 Method for producing a glass plate with a conductive printed wire and glass plate with a conductive printed wire |
| 04/16/2009 | US20090095511 Circuit board and method of producing the same |
| 04/16/2009 | US20090095510 Electronic device, electronic module, and methods for manufacturing the same |
| 04/16/2009 | US20090095509 Core substrate and method of producing the same |
| 04/16/2009 | US20090095508 Printed circuit board and method for manufacturing the same |
| 04/16/2009 | US20090095507 Method of selective coating of a composite surface production of microelectronic interconnections using said method and integrated circuits |
| 04/16/2009 | US20090094826 Contacting component, method of producing the same, and test tool having the contacting component |
| 04/16/2009 | DE112007001047T5 Harzzusammensetzung, Prepreg, Laminat und Leiterplatte Resin composition, prepreg laminate and PCB |
| 04/16/2009 | DE10210041B4 Wärmeableitvorrichtung zum Ableiten von Wärme, die von einem elektrischen Bauelement erzeugt wird und Verfahren zum Herstellen einer derartigen Wärmeableitvorrichtung Heat sink for dissipating heat generated by an electrical component and method for manufacturing such a heat sink |
| 04/16/2009 | DE102007048798A1 Raumgebilde mit einem RFID-Transponder Spatial structure with an RFID transponder |
| 04/16/2009 | CA2640990A1 Parallel gapped ferrite core |
| 04/15/2009 | EP2048922A2 COF Board |
| 04/15/2009 | EP2048921A2 Hole in pad thermal management |
| 04/15/2009 | EP2048920A2 Power electronic module having improved heat dissipation capability |
| 04/15/2009 | EP2048919A1 Noise suppressing wiring member and printed wiring board |
| 04/15/2009 | EP2048918A1 Manufacture of a conductive pattern on a plastic component |
| 04/15/2009 | EP2048743A1 Power supply board, board connector, luminaire, display, and television receiver |
| 04/15/2009 | EP2048737A1 Chip device |
| 04/15/2009 | EP2048209A1 Adhesive composition, and connection structure for circuit member |
| 04/15/2009 | EP2048205A1 Dispersion conatining metal fine particles, process for production of the dispersion, and articles having metal films |
| 04/15/2009 | EP2048147A1 Phosphorus-containing benzoxazine compound, process for production thereof, curable resin composition, cured article, and laminate plate |
| 04/15/2009 | EP2047723A2 Reconfigurable data processing system |
| 04/15/2009 | EP2047722A2 Card connector dampening assembly |
| 04/15/2009 | EP2047715A1 Resistor assembly and method for producing said assembly |
| 04/15/2009 | EP1663569A4 Closed loop backdrilling system |
| 04/15/2009 | EP1474811B1 Process for forming an embedded resistor |
| 04/15/2009 | EP1447712B1 Methods of producing photosensitive ceramic composition and multi-layer substrate using it |
| 04/15/2009 | EP1354351B1 Direct build-up layer on an encapsulated die package |