Patents for H05K 1 - Printed circuits (98,583) |
---|
04/15/2009 | CN201222820Y Circuit board structure compatible with various integrated block installation |
04/15/2009 | CN201222819Y Antistatic apparatus |
04/15/2009 | CN201222815Y Compact high-intensity discharge lamp trigger and circuit board |
04/15/2009 | CN201221735Y Light guiding structure |
04/15/2009 | CN201221706Y Side light LED soft lamp strip |
04/15/2009 | CN201220996Y Electronic grade glass fibre ultrathin fabric |
04/15/2009 | CN101411248A Electronic system comprising slots for any possible excess fusible material, and corresponding assembly method |
04/15/2009 | CN101410976A Method for manufacturing substrate having electric component |
04/15/2009 | CN101410973A Wafer-level chip scale package and method for fabricating and using the same |
04/15/2009 | CN101410914A Low temperature deposition and ultra fast annealing of integrated circuit thin film capacitor |
04/15/2009 | CN101410344A Dielectric porcelain composition and electronic component |
04/15/2009 | CN101409997A Co-baking ceramic module |
04/15/2009 | CN101409987A Core substrate and method of producing the same |
04/15/2009 | CN101409982A Method for manufacturing circuit board |
04/15/2009 | CN101409981A Circuit board with imbedded capacitance and electric resistance structure |
04/15/2009 | CN101409980A Soft and hard composite circuit board |
04/15/2009 | CN101409979A Circuit board and processing method thereof |
04/15/2009 | CN101409978A Multi-layer wiring board, interconnection blank and interconnection element capable of being patterned, and manufacturing method of the multi-layer wiring board |
04/15/2009 | CN101409977A Core member and method of producing the same |
04/15/2009 | CN101409976A Multilayer flexible circuit board |
04/15/2009 | CN101409316A Welding-free LED device |
04/15/2009 | CN101409274A COF board |
04/15/2009 | CN101409273A Ball-placing side surface structure for package substrate and manufacturing method thereof |
04/15/2009 | CN101409239A Method for manufacturing wiring plate |
04/15/2009 | CN101409238A Method for preparing seedless layer package substrate |
04/15/2009 | CN101408949A Chinese dot array display smart card system |
04/15/2009 | CN101408671A Optical scanning unit and electro photography type image device comprising the same |
04/15/2009 | CN101408650A Method of making circuitized substrate with internal optical pathway |
04/15/2009 | CN101408649A Method of making circuitized substrate with internal optical pathway using photolithography |
04/15/2009 | CN101408583A Method and device for detecting inserting state between printed circuit boards and printed circuit boards |
04/15/2009 | CN101408302A Light source module group with good heat radiating performance |
04/15/2009 | CN101407636A Resin composition for appearance inspection of printed circuit board |
04/15/2009 | CN100479635C Circuit board, circuit board mounting method, and electronic device using the circuit board |
04/15/2009 | CN100479261C Fixing member and mounting structure |
04/15/2009 | CN100479131C Method for manufacturing trajectory with enlarged capacitive coupling and corresponding trajectory |
04/15/2009 | CN100478985C Method and device for continuously producing electronic film components, and an electronic film component |
04/15/2009 | CN100478827C Memory bus wiring structure and wiring method for low profile display card |
04/15/2009 | CN100478743C Display device |
04/15/2009 | CN100478516C Collecting agent for glass fiber yarn and glass fiber yarn using the same |
04/14/2009 | US7519757 Memory system having a clock line and termination |
04/14/2009 | US7518884 Tailoring impedances of conductive traces in a circuit board |
04/14/2009 | US7518882 Circuit module |
04/14/2009 | US7518880 Shielding arrangement for electronic device |
04/14/2009 | US7518879 Universal Serial Bus (USB) memory plug |
04/14/2009 | US7518858 Mounting structure and mounting method for rotating disk storage device |
04/14/2009 | US7518572 Apparatus of driving plasma display panel |
04/14/2009 | US7518248 Inductive filters and methods of fabrication therefor |
04/14/2009 | US7518244 Reducing line to line capacitance using oriented dielectric films |
04/14/2009 | US7518228 Hybrid integrated circuit device, and method for fabricating the same, and electronic device |
04/14/2009 | US7518066 Conformable interface device for improved electrical joint |
04/14/2009 | US7518065 Printed wiring board for plasma display and process for producing the same |
04/14/2009 | US7517606 Fuel cells and batteries including metal-carbon composite powders |
04/14/2009 | US7517419 Substrate support jig, circuit board production apparatus, and method of producing circuit board |
04/14/2009 | US7517410 Micro adhesive nozzle and adhesive applying apparatus |
04/09/2009 | WO2009045888A2 Printed circuit board coil |
04/09/2009 | WO2009044706A1 Circuit-connecting material and circuit terminal connection structure |
04/09/2009 | WO2009044678A1 Circuit connecting material, circuit connection structure, and method for producing the same |
04/09/2009 | WO2009044446A1 Printed board unit and electronic device |
04/09/2009 | WO2009043724A1 Connecting film and electrical connection element |
04/09/2009 | WO2009043649A2 Three-dimensional electronic circuit board structure, and circuit board base comprising said circuit board structure as a functional component and three-dimensional circuit assembly consisting of at least two such three-dimensional circuit board structures |
04/09/2009 | WO2009043642A1 Sealable printed circuit board housing and printed circuit board for use in the printed circuit board housing |
04/09/2009 | WO2008138015A3 Light-emitting diode assembly without solder |
04/09/2009 | WO2008042549A3 Scalable interchangeable multiband power package mounting apparatus |
04/09/2009 | WO2006028633A3 Hermaphroditic socket/adapter |
04/09/2009 | US20090093136 Single Shot Molding Method For COB USB/EUSB Devices With Contact Pad Ribs |
04/09/2009 | US20090092399 Monolithic shell for an optical electrical device |
04/09/2009 | US20090091916 Manufacturing method of substrate, manufacturing method of wiring board, wiring board, electronic device, electron source, and image display apparatus |
04/09/2009 | US20090091904 Circuit Module and Radio Communications Equipment, and Method for Manufacturing Circuit Module |
04/09/2009 | US20090091903 Stack structure of circuit boards embedded with semiconductor chips |
04/09/2009 | US20090091902 Display apparatus and method for reducing electromagnetic interference thereof |
04/09/2009 | US20090091895 Electronic circuit module |
04/09/2009 | US20090091894 Multichip module |
04/09/2009 | US20090091860 HGA suspension pad barrier for elimination of solder bridging defect |
04/09/2009 | US20090091406 Compact via transmission line for printed circuit board and design method of the same |
04/09/2009 | US20090090547 Multilayer printed wiring board |
04/09/2009 | US20090090546 Substrate for ac/ac multiple-phase power converter |
04/09/2009 | US20090090545 Electroconductive Particle Placement Sheet and Anisotropic Electroconductive Film |
04/09/2009 | US20090090544 System and Method for Substrate with Interconnects and Sealing Surface |
04/09/2009 | US20090090543 Circuit board, semiconductor device, and method of manufacturing semiconductor device |
04/09/2009 | US20090090542 Multilayer printed wiring board |
04/09/2009 | US20090090540 Hole in pad thermal management |
04/09/2009 | US20090090465 Printed wiring board with conductive constraining core including resin filled channels |
04/09/2009 | DE19651800B4 Leitungs-Steckverbindung Line plug-in connection |
04/09/2009 | DE112006003502T5 Hochgeschwindigkeitszwischenverbindung High-speed interconnect |
04/09/2009 | DE102008039768A1 Befestigungsstruktur für eine elektronische Vorrichtung für eine Stromschiene Mounting structure for an electronic device for a conductor rail |
04/09/2009 | DE102008022977A1 Encapsulated circuit manufacturing method for hearing aid, involves not encapsulating printed circuit board region by encapsulation and by rotatary attachment of upper surface to self-adhesive encapsulation, where surface is encapsulated |
04/09/2009 | DE102007047708A1 Verfahren und Vorrichtung zur Herstellung zumindest einer Leiterplatte Method and apparatus for production of at least one printed circuit board |
04/09/2009 | DE102007047007A1 Elektrisches Kontaktelement und ein Verfahren zum Herstellen desselben The same electrical contact element and a method for producing |
04/09/2009 | DE102007046493A1 Dreidimensionaler elektronischer Schaltungsträgeraufbau, sowie Schaltungsgrundträger aufweisend den Schaltungsträgeraufbau als Funktionsbauteil und dreidimensionale Schaltungsanordnung bestehend aus zumindest zwei derartigen dreidimensionalen Schaltungsträgeraufbauten Three-dimensional electronic circuit support structure, as well as basic circuit carrier comprising the circuit board structure as a functional component and three-dimensional circuit arrangement consisting of at least two of such three-dimensional circuit carrier assemblies |
04/09/2009 | DE102007046428A1 Anschlussfolie und elektrische Anschlussverbindung Connection foil and electrical terminal connection |
04/09/2009 | DE102007045732A1 Component e.g. electronic component such as sensor, has three-dimensional soldering surface with soldering body having slots at surface, where slots are fixed for receiving of fluid solder during soldering process by capillary forces |
04/09/2009 | DE102007045630A1 Vibration resistance ensuring method for cup capacitor, involves assembling and soldering components using supporting balls for capacitor, whose body form protrudes in surface level of flat module over pad at rim of capacitor |
04/09/2009 | DE102007044754A1 Verfahren zur Herstellung einer elektronischen Baugruppe sowie elektronische Baugruppe A process for preparing an electronic assembly and electronic assembly |
04/09/2009 | DE102005017331B4 Schaltungsplatine Circuit board |
04/09/2009 | DE102004037629B4 Verbindungselement für Leiterplatten Connecting element for printed circuit boards |
04/09/2009 | DE10143919B4 Elekrisch leitende Paste und Verfahren zur Herstellung eines mehrlagigen keramischen elektronischen Bauteils unter verwendung dieser Paste By electricity-conducting paste and method of manufacturing a multilayer ceramic electronic component using this paste |
04/09/2009 | DE10120641B4 Keramik mit sehr guten Hochfrequenzeigenschaften und Verfahren zu ihrer Herstellung Ceramic having excellent high-frequency properties and processes for their preparation |
04/09/2009 | CA2697440A1 Printed circuit board coil |
04/08/2009 | EP2046107A1 Circuit board device, electronic device provided with the circuit board device and gnd connecting method |
04/08/2009 | EP2046104A1 Circuit connection material, circuit member connecting structure and method of connecting circuit member |