Patents for H05K 1 - Printed circuits (98,583)
11/2009
11/05/2009US20090272566 Electrically conductive paste and multilayer ceramic substrate
11/05/2009US20090272565 Control of carbon nanostructure growth in an interconnect structure
11/05/2009US20090272564 Method of producing circuit board by additive method, and circuit board and multilayer circuit board obtained by the method
11/05/2009US20090272563 Electronic carrier board
11/05/2009US20090272562 Method of producing circuit board by additive method, and circuit board and multilayer circuit board obtained by the method
11/05/2009US20090271973 Methods of Making a Radio Frequency Identification (RFID) Tags
11/05/2009DE102008021750A1 Contactlessly identifiable electronic printed circuit board for measuring device, has radio frequency identification transponder inserted into recess, and electronic component comprising connection soldered on contact surface
11/05/2009DE102008021231A1 Transponder i.e. radio frequency identification transponder, for use in e.g. electronic passport, has substrate for carrying functional structures, where functional structures are arranged in receptacles of substrate
11/05/2009DE102008020930A1 Elektrische Funktionseinheit und Verfahren zur Herstellung einer dreidimensionalen elektrischen Funktionseinheit Electric functional unit and method for producing a three-dimensional electrical functional unit
11/05/2009DE102008020268A1 Conductors connecting arrangement i.e. lead frame, for flat conductor-strip transmission line of cartridge in automobile engineering, has row of contact surfaces reversed from each other in relation to another row of contact areas
11/05/2009DE102004033933B4 Verfahren zum Herstellen eines Metall-Keramik-Substrates A method for producing a metal-ceramic substrate
11/05/2009DE10061613B4 Elektrische Steckvorrichtung mit einem Halter für ein elektronisches Bauteil An electric plug connector comprising a holder for an electronic component
11/04/2009EP2114114A1 Bimetallic nanoparticles for conductive ink applications
11/04/2009EP2114113A1 Conductor board and method for its production
11/04/2009EP2114085A1 Composite microphone, microphone assembly and method of manufacturing those
11/04/2009EP2113923A1 Memory module with reduced access granularity
11/04/2009EP2113749A2 Display module and meter employing the same
11/04/2009EP2113524A1 Epoxy resin composition, prepreg, laminates and printed wiring boards
11/04/2009CN201341274Y 总线结构总成 Bus structure assembly
11/04/2009CN201341273Y Multilayer printed circuit board with functional resin and metal foil composite
11/04/2009CN201341272Y Copper-clad plate with high anti-creep track property
11/04/2009CN201341271Y Circuit board with replaceable USB or S-VIDEO interface
11/04/2009CN201341270Y Breadboard with center ground wire
11/04/2009CN201340473Y 自动对焦摄像模组 Autofocus camera module
11/04/2009CN201340471Y Bottom contact gold finger fixed-focus camera module for mobile phone
11/03/2009US7613021 Small form factor power supply
11/03/2009US7613010 Stereoscopic electronic circuit device, and relay board and relay frame used therein
11/03/2009US7613007 Power core devices
11/03/2009US7612662 Drug delivery management system
11/03/2009US7612449 Optimized power delivery to high speed, high pin-count devices
11/03/2009US7612448 Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner
11/03/2009US7612296 Visually inspectable surface mount device pad
11/03/2009US7612295 Printed wiring board and method for manufacturing the same
11/03/2009US7612294 Electrical component having a flat mounting surface
11/03/2009US7612002 Glass fibre for the reinforcement of organic and/or inorganic materials, method for production of said glass fibres and corresponding composition
11/03/2009US7611982 Method of forming sheet having foreign material portions used for forming multi-layer wiring board and sheet having foreign portions
11/03/2009US7611981 Optimized circuit design layout for high performance ball grid array packages
11/03/2009US7611924 Integrated circuit package with chip-side signal connections
11/03/2009US7611747 insulating material having a curable norbornanes and vinyl monomeric layer, in which foreign matter having very small particle sizes within the range of 30 to 50 mu m, are minimized, without drastically changing the principal portions of existing production lines
10/2009
10/29/2009WO2009132061A2 Assembly method for implantable medical device
10/29/2009WO2009131204A1 Substrate, structure for mounting surface mounting component, and electronic device
10/29/2009WO2009131182A1 Flex-rigid wiring board and method for manufacturing the same
10/29/2009WO2009130856A1 Flexible wiring unit and electronic device
10/29/2009WO2009043649A3 Three-dimensional electronic circuit board structure, and circuit board base comprising said circuit board structure as a functional component and three-dimensional circuit assembly consisting of at least two such three-dimensional circuit board structures
10/29/2009US20090269952 Fastening assembly for heat dissipation device
10/29/2009US20090268423 Interconnect substrate and electronic circuit mounted structure
10/29/2009US20090268422 Scalable electronic package assembly for memory devices and other terminated bus structures
10/29/2009US20090268418 Printed circuit board having embedded rf module power stage circuit
10/29/2009US20090268417 Storage apparatus and printed wiring board unit
10/29/2009US20090268415 Battery Backup Unit (BBU) assembly
10/29/2009US20090268390 Printed circuit assembly with determination of storage configuration based on installed paddle board
10/29/2009US20090267989 Circuit substrate and liquid discharging apparatus
10/29/2009US20090267263 Thermosetting resin composition, material for substrate and film for substrate
10/29/2009US20090266699 Switch structures for use on printed circuit boards
10/29/2009US20090266599 Circuit board with high thermal conductivity and method for manufacturing the same
10/29/2009US20090266598 Wiring board
10/29/2009US20090266597 Printed circuit board preform with test facilitating means
10/29/2009US20090266596 Printed circuit board with embedded electronic components and methods for the same
10/29/2009US20090266595 Electronic device
10/29/2009US20090266594 Wiring substrate and method of manufacturing the same
10/29/2009US20090266593 Surface-mountable electronic device
10/29/2009US20090266592 Circuit board and method for jointing circuit board
10/29/2009US20090266591 Prepreg and printed wiring board using thin quartz glass cloth
10/29/2009US20090266590 Interconnect structure and method for fabricating the same
10/29/2009US20090266589 Process for producing metal wiring board
10/29/2009US20090266588 Multilayer printed wiring board
10/29/2009US20090266587 Flexible printed circuit board and method of forming fine pitch therein
10/29/2009US20090266586 Printed circuit board and semiconductor package
10/29/2009US20090266585 Flame-Retardant Composition for Solder Resist and Cured Product Thereof
10/29/2009US20090266584 Heat dissipating wiring board, method for manufacturing same, and electric device using heat dissipiating wiring board
10/29/2009US20090266583 Photosensitive resin composition, laminate, method of producing metal plated material, metal plated material, method of producing metal pattern material, metal pattern material and wiring substrate
10/29/2009US20090266582 Three-dimensional circuit board and its manufacturing method
10/29/2009US20090266412 Solar Cell, Prefabricated Base Part for a Solar Cell and Method for Manufacturing Such a Base Part and a Solar Cell
10/29/2009US20090265930 Printed wiring board with enhanced structural integrity
10/29/2009DE102008026627B3 Kühlsystem für LED-Chip-Anordnung Cooling system for LED chip array
10/29/2009DE102008020225A1 Hardware variant identifying device i.e. voltage divider circuit, for printed circuit board of measuring device, has electrical or electronic components geometrically arranged in way characteristic for auxiliary network variants
10/29/2009DE10056904B4 Verbindungsanordnung Connector assembly
10/28/2009EP2112875A2 Thermal management system and method for electronic equipment mounted on coldplates
10/28/2009EP2112873A2 Electric function unit and method for manufacturing a three-dimensional electric function unit
10/28/2009EP2112871A1 Circuit board with improved ground layer
10/28/2009EP2111339A1 Printer with configurable memory
10/28/2009EP1232540B1 Differential signal electrical connectors
10/28/2009CN101569246A Printed wiring board and process for producing the same
10/28/2009CN101569245A Metal compositions, thermal imaging donors and patterned multilayer compositions derived therefrom
10/28/2009CN101569054A Apparatus and method for high speed signals on a printed circuit board
10/28/2009CN101568867A Optical/electrical mixture mounting board and method for producing the same
10/28/2009CN101568228A Electronic component, circuit substrate and circuit device
10/28/2009CN101568227A Circuit board, manufacturing method thereof, and joint box using circuit board
10/28/2009CN101568226A Multi-layer flexible printed circuit board and method of manufacturing the same
10/28/2009CN101568225A Flexible circuit board
10/28/2009CN101568224A Circuit board and electronic device having circuit board
10/28/2009CN101567356A Circuit board structure and manufacture method thereof
10/28/2009CN101567326A Printed circuit board and method for forming same
10/28/2009CN101567228A Conductive paste and mounting structure using the same
10/28/2009CN101567204A Main shaft motor module for CD driver
10/28/2009CN101566642A Orthogonal radio frequency voltage/current sensor with high dynamic range
10/28/2009CN101565591A Thermosetting adhesive or pressure-sensitive adhesive tape or sheet
10/28/2009CN101564929A Method for preparing low-shrinkage-factor copper clad laminate by applying nano-stuffing
10/28/2009CN100556265C A shielding arrangement
10/28/2009CN100556259C Panel assembling apparatus and panel assembling method