| Patents for H05K 1 - Printed circuits (98,583) |
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| 11/17/2009 | US7618843 stacking and firing; dimensional stability without delamination and warp; insulations, dielectrics, magnetism, piezoelectric; resistor thick films; semiconductor devices such as communication modules, vehicle modules |
| 11/17/2009 | US7618526 Method for manufacturing plated film, cathode roll for plating, and method for manufacturing circuit board |
| 11/17/2009 | US7618281 Interconnect assemblies and methods |
| 11/17/2009 | US7618261 Distribution connecting module |
| 11/17/2009 | US7617774 Method for printing an electronic circuit component on a substrate using a printing machine |
| 11/17/2009 | US7617600 Process of making an electronic circuit device having flexibility and a reduced footprint |
| 11/17/2009 | US7617591 Method for fabricating embedded thin film resistors of printed circuit board |
| 11/17/2009 | CA2415891C Drug delivery management system |
| 11/12/2009 | WO2009136535A1 Substrate incorporating esd protection function |
| 11/12/2009 | US20090281267 Material for planting and use thereof |
| 11/12/2009 | US20090279274 Circuit boards |
| 11/12/2009 | US20090279273 Multi-layer printed wiring board, electronic device, and fabrication method of electronic device |
| 11/12/2009 | US20090279270 Dual-channel optical navigation device |
| 11/12/2009 | US20090278249 Printed circuit board and method thereof and a solder ball land and method thereof |
| 11/12/2009 | US20090278232 Ruthenium silicide diffusion barrier layers and methods of forming same |
| 11/12/2009 | US20090277679 Method of manufacturing PCB and PCB manufactured by the same |
| 11/12/2009 | US20090277678 Surface mount adhesive, mounting structure including the same, and method for producing mounting structure |
| 11/12/2009 | US20090277677 Electronic Assemblies without Solder and Method for their Design, Prototyping, and Manufacture |
| 11/12/2009 | US20090277676 In-mold decoration device and manufacturing method thereof |
| 11/12/2009 | US20090277675 Substrate for mounting electronic component and electronic apparatus including the substrate |
| 11/12/2009 | US20090277674 Printed circuit board and manufacturing method thereof |
| 11/12/2009 | US20090277673 PCB having electronic components embedded therein and method of manufacturing the same |
| 11/12/2009 | US20090277672 Method for forming metal pattern, metal pattern and printed wiring board |
| 11/12/2009 | US20090277671 Glass pane having soldered electrical terminal connections |
| 11/12/2009 | US20090277670 High Density Printed Circuit Board Interconnect and Method of Assembly |
| 11/12/2009 | US20090277669 Flexible printed circuitboard with anti-solder crack structure |
| 11/12/2009 | US20090277668 Infrared emitter with flexible Circuit board |
| 11/12/2009 | US20090277667 Printed circuit board and method of manufacturing the same |
| 11/12/2009 | DE112007003197T5 Vorrichtung und Verfahren für Hochgeschwindigkeitssignale auf einer gedruckten Leiterplatte Apparatus and method for high speed signals on a printed circuit board |
| 11/12/2009 | DE102008021655A1 Substrat, Strahlungsquelle, Photozelle und Herstellungsverfahren Substrate radiation source, photocell and manufacturing processes |
| 11/12/2009 | DE10012510B4 Für Oberflächenmontage ausgelegter Verbinder und Verfahren zur Herstellung einer den Verbinder beinhaltenden Schaltungsvorrichtung Surface mount connector is laid out and the method of manufacturing a connector-containing circuit device |
| 11/11/2009 | EP2117285A1 Switch carrier for holding a ferrite construction element |
| 11/11/2009 | EP2117082A1 Electrical connection structure |
| 11/11/2009 | EP2117044A1 Printed circuit board and method of manufacuring the same |
| 11/11/2009 | EP2117018A1 Composite magnetic body, its manufacturing method, circuit substrate using the same, and electronic device using the same |
| 11/11/2009 | EP2116817A2 Connector module and meter employing the same |
| 11/11/2009 | EP2116816A2 Movement module and meter employing the same |
| 11/11/2009 | EP2116114A1 Production process of printed circuits on which electronic components without leading wire are soldered |
| 11/11/2009 | EP2114837A1 Low dielectric glass and fiber glass for electronic applications |
| 11/11/2009 | EP1665296B1 Fractional turns transformer with ferrite polymer core |
| 11/11/2009 | CN201345792Y Structure for connecting printed circuit board with zinc-alloy casing |
| 11/11/2009 | CN201345778Y Paster element segmented bonding pad |
| 11/11/2009 | CN201345562Y Output framework of redundant electric power system |
| 11/11/2009 | CN201345309Y Key-press circuit board and keyboard |
| 11/11/2009 | CN201345094Y Improved circuit for transparent current-conducting plate |
| 11/11/2009 | CN201344505Y Heat dissipation and connection structure with high power LED (light emitting diode) |
| 11/11/2009 | CN101578927A Printed wiring board and method for manufacturing the same |
| 11/11/2009 | CN101578014A Method of manufacturing PCB and PCB manufactured by the same |
| 11/11/2009 | CN101578010A Method for preparing high phase ratio electric leakage resistant tracking index leadless compatible CEM-3 copper-clad laminate |
| 11/11/2009 | CN101578009A Circuit board base film, circuit board substrate and circuit board |
| 11/11/2009 | CN101578008A Protective structure for a circuit board and method for fabricating the same |
| 11/11/2009 | CN101578007A Pad and circuit board used thereby |
| 11/11/2009 | CN101577781A Electronic apparatus |
| 11/11/2009 | CN101577159A Film resistance structure and manufacturing method thereof |
| 11/11/2009 | CN101576668A Display module assembly and method for fixing circuit wafer thereof |
| 11/11/2009 | CN101575439A Porefilling heat curing resin composition |
| 11/11/2009 | CN100559919C Manufacturing method of strip type macromolecular ESD protective device |
| 11/11/2009 | CN100559918C Flexible metal clad laminate and manufacturing method thereof |
| 11/11/2009 | CN100559914C Production method of suspension board with circuit |
| 11/11/2009 | CN100559913C High-frequency equipments assembly base plate and communication machine |
| 11/11/2009 | CN100559707C Method and apparatus for reducing electromagnetic radiation |
| 11/11/2009 | CN100559584C Semiconductor package having socket function, semiconductor module, electronic circuit module, and circuit board with socket |
| 11/11/2009 | CN100559580C Impedance matching external component connections with uncompensated leads |
| 11/10/2009 | US7616452 Flex circuit constructions for high capacity circuit module systems and methods |
| 11/10/2009 | US7616447 IC card |
| 11/10/2009 | US7616446 Mobile terminal device and method for radiating heat therefrom |
| 11/10/2009 | US7616285 Electronic circuit wiring and display device |
| 11/10/2009 | US7616016 Probe card assembly and kit |
| 11/10/2009 | US7615709 Circuit board through-hole impedance tuning using clearance size variations |
| 11/10/2009 | US7615708 Arrangement of non-signal through vias and wiring board applying the same |
| 11/10/2009 | US7615707 Printed circuit board and forming method thereof |
| 11/10/2009 | US7615706 Layout of a printed circuit board |
| 11/10/2009 | US7615705 Enhanced-reliability printed circuit board for tight-pitch components |
| 11/10/2009 | US7615704 Multiple digital printing techniques for fabricating printed circuits |
| 11/10/2009 | US7615478 Fabrication method for electronic system modules |
| 11/10/2009 | US7615477 Method of fabricating a BGA package having decreased adhesion |
| 11/10/2009 | US7615162 Printed wiring board and method for manufacturing the same |
| 11/10/2009 | US7614887 Electrical connector with improved contacts |
| 11/10/2009 | CA2316117C Method for making a display module including a liquid crystal and a single-face printed circuit, and module obtained via said method |
| 11/05/2009 | WO2009134127A1 Composite microphone, microphone assembly and method of manufacturing those |
| 11/05/2009 | WO2009133969A2 Method of producing circuit board by additive method, and circuit board and multilayer circuit board obtained by the method |
| 11/05/2009 | WO2009133901A1 Circuit connecting material, film-like adhesive, adhesive reel, and circuit connecting structural body |
| 11/05/2009 | WO2009133678A1 Printed wiring substrate unit, and freezing device |
| 11/05/2009 | WO2009133677A1 Electric circuit connection member |
| 11/05/2009 | WO2009133497A1 Electronic textile |
| 11/05/2009 | WO2009132615A1 Optoelectronic component |
| 11/05/2009 | WO2009100103A3 Method of connection of flexible printed circuit board and electronic device obtained thereby |
| 11/05/2009 | WO2009095559A3 Method for making a component having an electronic function |
| 11/05/2009 | US20090273910 Functional Unit And Method For The Production Thereof |
| 11/05/2009 | US20090273907 Circuit board and process thereof |
| 11/05/2009 | US20090273905 Integrated circuit package and integrated circuit module |
| 11/05/2009 | US20090273649 Inkjet Printhead With Nozzle Layer Defining Etchant Holes |
| 11/05/2009 | US20090273079 Semiconductor package having passive component bumps |
| 11/05/2009 | US20090273078 Electronic packages |
| 11/05/2009 | US20090273073 Connecting structure for flip-chip semiconductor package, build-up layer material, sealing resin composition, and circuit board |
| 11/05/2009 | US20090273069 Low profile chip scale stacking system and method |
| 11/05/2009 | US20090272974 Interposer chip and multi-chip package having the interposer chip |
| 11/05/2009 | US20090272569 Component Assembly |
| 11/05/2009 | US20090272568 Microwave Chip Supporting Structure |
| 11/05/2009 | US20090272567 Electronic device and method for making the same |