Patents for H05K 1 - Printed circuits (98,583)
12/2009
12/03/2009US20090294779 Electronic element wafer module, method for manufacturing an electronic element wafer module, electronic element module,and electronic information device
12/03/2009US20090294169 Printed circuit board fabrication method, printed circuit board obtained thereby, and printed circuit board fabrication apparatus
12/03/2009US20090294168 Printed circuit board
12/03/2009US20090294167 Multilayer wiring board
12/03/2009US20090294166 Printed wiring board
12/03/2009US20090294164 Printed circuit board including landless via and method of manufacturing the same
12/03/2009US20090294162 Printed circuit board and manufacturing method thereof
12/03/2009US20090294161 Core substrate and printed wiring board
12/03/2009US20090294160 Method of making printed wiring board and electrically-conductive binder
12/03/2009US20090294159 Advanced print circuit board and the method of the same
12/03/2009US20090294158 Electronic circuit and method for manufacturing same
12/03/2009US20090294157 Electro-optic device and method for manufacturing the same
12/03/2009US20090294156 Intermediate multilayer wiring board product, and method for manufacturing multilayer wiring board
12/03/2009US20090294155 Flexible printed circuit board, shield processing method for the circuit board and electronic apparatus
12/03/2009US20090294154 Printed circuit board providing heat dissipation
12/03/2009US20090294153 Printing using a structure coated with ultraviolet radiation responsive material
12/03/2009US20090294152 Printed circuit board
12/03/2009DE102009016649A1 Halbleitervorrichtung und Verfahren mit einem ersten und zweiten Träger A semiconductor device and method having a first and second support
12/03/2009DE102008026216A1 Elektronische Schaltung Electronic circuit
12/03/2009DE102008025938A1 Printed circuit board arrangement for control unit of internal combustion engine of motor vehicle, has plug connectors conductive coupled with related rigid regions and positioned adjacent to one another to form common plug connector unit
12/03/2009DE102008024481A1 Elektrische Bauelementanordnung Electrical component assembly
12/03/2009DE102008024480A1 Elektrische Bauelementanordnung Electrical component assembly
12/03/2009DE102008023714A1 Anordnung mit einem Hauptträger und einer Leiterplatte mit Bauelementen Arrangement with a major carrier and a circuit board with components
12/03/2009DE102008002041A1 Printed circuit board, has connection bore provided on wired component for retaining connection wire, and tin coating provided in bore, where inner diameter of coating is smaller than diameter of connection wire of wired component
12/03/2009CA2726173A1 Metal base circuit board
12/02/2009EP2129196A1 Ceramic member, method of forming groove in ceramic member, and substrate for electronic part
12/02/2009EP2129195A1 Circuit board, multilayer circuit board, and electronic device
12/02/2009EP2129194A1 Electronic apparatus
12/02/2009EP2128519A2 Lighting apparatus and substrate having plurality of light-emitting elements mounted thereon and incorporated in this lighting apparatus
12/02/2009EP2127507A1 Method for the production of structured, electrically conductive surfaces
12/02/2009EP2127505A1 Method for producing an electrical resistor on a substrate
12/02/2009EP2127504A1 Electronic device with flip module having low height
12/02/2009EP2126933A1 A metal paste for forming a conductive layer
12/02/2009EP1521811B1 A method for the production of conductive and transparent nano-coatings and nano-powder coatings
12/02/2009CN201355893Y Electronic equipment and cooling baseplate thereof
12/02/2009CN201355883Y Circuit board with groove structure and mobile phone with circuit board
12/02/2009CN201355882Y Easily assembled flexible circuit board
12/02/2009CN201355014Y LED flood lamp
12/02/2009CN201354970Y Soft color-changing neon lamp capable of substituting for glass neon lamp
12/02/2009CN201354969Y Soft single-color neon lamp capable of substituting for glass neon lamp
12/02/2009CN101595769A Selective deposition of embedded transient protection for printed circuit boards
12/02/2009CN101595164A Crystalline encapsulants
12/02/2009CN101594751A Structural improvement of double-sided multi-layer metal base circuit board
12/02/2009CN101594750A Structure and manufacturing method of high-density substrate
12/02/2009CN101594741A Component-embedded printed circuit board, method of manufacturing the same, and electronic apparatus including the same
12/02/2009CN101594740A Circuit board with imbedded electronic device and method of imbedding electronic device therein
12/02/2009CN101594739A Embedded circuit board radiating device and processing method of element
12/02/2009CN101594738A Signal conduction element
12/02/2009CN101594737A Printing wiring cardinal plate and method for producing the same
12/02/2009CN101594736A A copper-clad laminate, a surface treating copper foil and a printed circuit board
12/02/2009CN101594735A Flexible film and display device including the same
12/02/2009CN101594734A Flexible film and display device including the same
12/02/2009CN101594733A Flexible film and display device including the same
12/02/2009CN101594732A Circuit board
12/02/2009CN101594731A Flexible printed wiring board
12/02/2009CN101594730A Circuit board with conductive structure
12/02/2009CN101594729A Circuit board
12/02/2009CN101594156A Super power amplifier
12/02/2009CN101593750A Core substrate and printed wiring board
12/02/2009CN101593612A Planar micro-strip inductance coil and manufacturing method thereof
12/02/2009CN101593592A Ferrite insert panel and core structure for passive substrate of switch power supply module
12/02/2009CN101593569A Conductive paste constituent
12/02/2009CN101593568A Conductive paste including a carbon nanotube and printed circuit board using the same
12/02/2009CN101592820A Backlight module and liquid crystal display applying same
12/02/2009CN101592760A Opto-electric hybrid module and manufacturing method thereof
12/02/2009CN101591471A Resin composition for processing halogen-free copper foil base plate materials
12/02/2009CN101591465A Composition for improving tellite material
12/02/2009CN100566515C Double layer film, production method of double layer film, production method of printing circuit board
12/02/2009CN100566511C Method for embedding a component in a base and forming a contact
12/02/2009CN100566510C Pattern transferring material, its manufacturing method, wiring substrate manufactured by using the same
12/02/2009CN100566507C Electronic device and method of manufacturing thereof
12/02/2009CN100566506C Embedded resistor devices
12/02/2009CN100566505C Double layer flexible board and method for manufacturing the same
12/02/2009CN100566504C Aluminium-based copper foil clad laminated board and producing technology
12/02/2009CN100566503C Laminate for wiring board
12/02/2009CN100566042C Housing comprising a liquid-tight electric bushing
12/02/2009CN100566030C Emc connector assembly
12/02/2009CN100566017C Dielectric assembly and process for manufacturing the assembly
12/02/2009CN100566014C Edge plated transmission line
12/02/2009CN100565870C Coupler module and its manufacture method
12/02/2009CN100565862C Embedded type chip substrate structure
12/02/2009CN100565728C Manufacture method of laminated ceramic electronic parts
12/02/2009CN100565286C Mother plate for a flexible printed circuit film and display device
12/02/2009CN100564612C Method for manufacturing plated film, cathode roll for plating, and method for manufacturing circuit board
12/02/2009CN100564447C Adhesive resin composition and use thereof
12/02/2009CN100564423C Epoxy resin composition
12/02/2009CN100564298C Glass fibre for the reinforcement of organic and/or inorganic materials, method for production of said glass fibres and corresponding composition
12/01/2009US7626831 Circuit board retention system
12/01/2009US7626828 Providing a resistive element between reference plane layers in a circuit board
12/01/2009US7626825 Optical transmitter module
12/01/2009US7626273 Low profile stacking system and method
12/01/2009US7626270 Coreless package substrate with conductive structures
12/01/2009US7626248 Semiconductor package with a controlled impedance bus
12/01/2009US7626126 Multilayer semiconductor device
12/01/2009US7626125 Wiring, display device and method of manufacturing the same
12/01/2009US7626124 Wiring board
12/01/2009US7626123 Electrical microfilament to circuit interface
12/01/2009US7625640 Electromagnetic noise suppressor, structure with electromagnetic noise suppressing function, and method of manufacturing the same
12/01/2009US7625633 Electromagnetic noise suppressor, article with electromagnetic noise suppressing function, and their manufacturing methods
12/01/2009US7625420 Small particle size, narrow size distribution, high crystallinity (large crystals) and spherical morphology; protective coatings; composites; alloys; green strength; thick film pastes; microelectronics; multilayer ceramic capacitors; multichip module;industrial scale