Patents for H05K 1 - Printed circuits (98,583) |
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11/19/2009 | US20090284937 Electric Circuitry Arrangement |
11/19/2009 | US20090284936 Combination of a Main Carrier and a Printed Circuit Board with Components |
11/19/2009 | US20090284935 Structure and manufacturing process for circuit board |
11/19/2009 | US20090284909 Flat panel display and chip bonding pad |
11/19/2009 | US20090283901 Semiconductor device and multilayer wiring board |
11/19/2009 | US20090283894 Semiconductor chip package and printed circuit board having through interconnections |
11/19/2009 | US20090283790 Circuit substrate and light emitting diode package |
11/19/2009 | US20090283511 Controllable electrothermal element of PTC thick film circuit |
11/19/2009 | US20090283317 Wiring board |
11/19/2009 | US20090283316 Circuit board viaholes and method of manufacturing the same |
11/19/2009 | US20090283315 High density package substrate and method for fabricating the same |
11/19/2009 | US20090283314 Wired circuit board and producing method thereof |
11/19/2009 | US20090283313 Small form factor molded memory card and a method thereof |
11/19/2009 | US20090283312 Printed wiring board and method for manufacturing the same |
11/19/2009 | US20090283311 Electronic element wafer module and method for manufacturing electronic element wafer module, electronic element module, and electronic information device |
11/19/2009 | US20090283310 Multi cap layer and manufacturing method thereof |
11/19/2009 | US20090283309 Ceramic-metal bonded body, method for manufacturing the bonded body and semi-conductor device using the bonded body |
11/19/2009 | US20090283308 Curable Resin Composition and Use Thereof |
11/19/2009 | US20090283307 Silicon nitride substrate, silicon nitride circuit substrate using the same, and its use |
11/19/2009 | US20090283306 Photosensitive glass paste and multilayer wiring chip component |
11/19/2009 | US20090283305 Tin-silver compound coating on printed circuit boards |
11/19/2009 | US20090283304 Methods and compositions for ink jet deposition of conductive features |
11/19/2009 | US20090283303 Package substrate having landless conductive traces |
11/19/2009 | US20090283302 Printed circuit board and manufacturing method thereof |
11/19/2009 | US20090283301 Multilayer wiring board and method for manufacturing the same |
11/19/2009 | US20090283300 Flex Circuit with Single Sided Routing and Double Sided Attach |
11/19/2009 | US20090283299 Component-embedded printed circuit board, method of manufacturing the same, and electronic apparatus including the same |
11/19/2009 | US20090282674 Electrical interconnect structure and process thereof and circuit board structure |
11/19/2009 | DE102008023882A1 Druckbare Zusammensetzung auf Basis von Silberpartikeln zur Erzeugung elektrisch leitfähiger Beschichtungen Printable composition based on silver particles for forming electrically conductive coatings |
11/19/2009 | DE102008023602A1 Ballast for high pressure gas discharge lamp in motor vehicle, has transformer with primary coil and secondary coil designed as wire winding, where halves of primary coil are made of conductor areas arranged on board layer |
11/19/2009 | DE10107072B4 Verfahren zur Herstellung einer Chipkarte A method of manufacturing a smart card |
11/18/2009 | EP2120523A2 Assembly with a main beam and a PCB with construction elements |
11/18/2009 | EP2120521A1 A method of manufacturing a mutual connection structure between multi-layer baseboards and structure thereof |
11/18/2009 | EP2120520A2 Flexible film and display device including the same |
11/18/2009 | EP2120519A1 Electrical interconnect structure and process thereof and circuit board structure |
11/18/2009 | EP2120518A2 Circuit substrate and light emitting diode package |
11/18/2009 | EP2120517A1 A mutual connection structure between multi-layer boards and manufacturing method thereof |
11/18/2009 | EP2120516A1 Flexible printed wiring board |
11/18/2009 | EP2120515A1 Structure and manufacturing process for circuit board |
11/18/2009 | EP2120352A1 High-frequency part and communication device |
11/18/2009 | EP2120263A1 Heat dissipating structure base board, module using heat dissipating structure base board, and method for manufacturing heat dissipating structure base board |
11/18/2009 | EP2119330A1 Method for producing a flexi-rigid printed circuit board and flexi-rigid printed circuit board |
11/18/2009 | EP2119329A2 Device and method for constructing optoelectronic assemblies |
11/18/2009 | EP2119328A1 Nonstick material, method for removing a part of a planar material layer and multilayer structure and use therefor |
11/18/2009 | EP2119327A1 Method for removing a part of a planar material layer and multilayer structure |
11/18/2009 | EP2119197A1 Wireless headset comprising a housing and an earbud electri.cally coupled t the housing by a flexible circuit board |
11/18/2009 | EP1170983B1 Circuit forming board and method of manufacturing circuit forming board |
11/18/2009 | CN201349384Y High conduction and heat dissipation aluminum coated metal substrate structure |
11/18/2009 | CN201349379Y Fixed column and light-emitting diode module with the fixed column |
11/18/2009 | CN201349364Y Circuit board composition |
11/18/2009 | CN201349363Y PCB used for LED lamp |
11/18/2009 | CN201349362Y PCB connecting device |
11/18/2009 | CN201349361Y Main board of mobile communication terminal |
11/18/2009 | CN201349360Y Punching-resistant flexible printed circuit board |
11/18/2009 | CN201349212Y Moving terminal |
11/18/2009 | CN201349024Y Substrate of heat radiating circuit |
11/18/2009 | CN201349023Y Substrate of heat radiating circuit |
11/18/2009 | CN201348928Y PCB inductor |
11/18/2009 | CN201348807Y Demountable memory module of electronic cash register |
11/18/2009 | CN101584258A Method for the production of structured, electrically conductive surfaces |
11/18/2009 | CN101584257A Standardized electronics housing having modular contact partners |
11/18/2009 | CN101583489A Insulating resin sheet multilayer body, multilayer printed wiring board obtained by laminating the insulating resin sheet multilayer bodies |
11/18/2009 | CN101583250A Method for processing through hole of printed circuit board, printed circuit board and communication equipment |
11/18/2009 | CN101583243A Wired circuit board and producing method thereof |
11/18/2009 | CN101583241A Method for assembling heat sink on circuit board and radiating circuit substrate manufactured by method |
11/18/2009 | CN101583240A Combination of a main carrier and a printed circuit board with components |
11/18/2009 | CN101583239A Component-embedded printed circuit board, manufacture method thereof and electronic apparatus containing the same |
11/18/2009 | CN101583238A Flexible film and display device including the same |
11/18/2009 | CN101583237A Multi-layer printed wiring board, electronic device and manufacture method thereof |
11/18/2009 | CN101583236A Circuit board and fixing method for plug-in type element applying to same |
11/18/2009 | CN101583235A Circuit board and fixing method for part without electrical properties applying to same |
11/18/2009 | CN101582321A Integrated magnetic module and conductive structure thereof |
11/18/2009 | CN101582266A Suspension board with circuit |
11/18/2009 | CN101582225A Flexible light emitting diode (LED) display screen |
11/18/2009 | CN101581995A Flex circuit with single sided routing and double sided attach |
11/18/2009 | CN101581853A Backlight unit containing light emitting diode and liquid crystal display device containing the same |
11/18/2009 | CN101581841A Printed circuit board and liquid crystal display device having the same |
11/18/2009 | CN101581404A Light emitting component module |
11/18/2009 | CN101580659A Printable compound containing silver nanometer particles, method for producing electrical conducting coatings and prepared coatings |
11/18/2009 | CN101580626A Resin composition with high thermal conductivity, no halogen and difficult fire retardance and pre-impregnated body and coating material thereof |
11/18/2009 | CN100562225C Printed circuit board and method for processing printed circuit board and method for manufacturing printed circuit board |
11/18/2009 | CN100562224C Multilayer wiring board, base for multilayer wiring board, printed wiring board, and its manufacturing method |
11/18/2009 | CN100562223C Method of manufacturing substrate for circuit board and smart label having the substrate |
11/18/2009 | CN100562217C Circuit board for wireless transmission |
11/18/2009 | CN100562216C Heat sink arrangement for electrical apparatus |
11/18/2009 | CN100562215C Soft circuit board |
11/18/2009 | CN100562214C Printed circuit board with improved hole |
11/18/2009 | CN100562213C Circuit board structure of pipe leakage detector |
11/18/2009 | CN100562212C Insulation structure for high thermal condition and its manufacturing method |
11/18/2009 | CN100562211C Polybutadiene thermosetting resin printed circuit carrier plate composition and method for making the same |
11/18/2009 | CN100562210C Circuit board combination |
11/18/2009 | CN100561726C Circuit wiring board |
11/18/2009 | CN100561335C Test device for mobile phone camera module with automatic focusing function and the test method |
11/18/2009 | CN100560632C Silicon-phosphor-containing heat-stable hybridized epoxide resin and the preparing method and application thereof |
11/17/2009 | US7619901 Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system |
11/17/2009 | US7619899 Securable electronic module |
11/17/2009 | US7619898 Control box for electrical actuators, especially for adjustable furniture |
11/17/2009 | US7619867 Conformal coating enhanced to provide heat detection |
11/17/2009 | US7619317 Carrier structure for semiconductor chip and method for manufacturing the same |
11/17/2009 | US7619168 Flexible substrate, mounted structure, display unit, and portable electronic apparatus |