| Patents for H05K 1 - Printed circuits (98,583) |
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| 12/15/2009 | US7631966 Print roll for a camera having an internal printer |
| 12/15/2009 | US7631422 Method of manufacturing wiring substrate having terminated buses |
| 12/15/2009 | CA2307511C Improved smart card reader for elevated placement relative to a printed circuit board |
| 12/10/2009 | WO2009149153A2 Ignition of reactive multilayer foils in microelectronics assemblies |
| 12/10/2009 | WO2009147099A1 Cooling system for an led chip array |
| 12/10/2009 | WO2009147036A1 Led lighting array |
| 12/10/2009 | WO2009146830A1 Electronic device and method for testing a circuit board |
| 12/10/2009 | WO2009146829A1 Electronic device and method for testing a circuit board |
| 12/10/2009 | WO2009146828A1 Electronic device and method for testing a circuit board |
| 12/10/2009 | WO2009107085A3 Led lamp and method for its design |
| 12/10/2009 | US20090305527 Socket connector with flexible orientation heat pipe |
| 12/10/2009 | US20090303691 Portable terminal |
| 12/10/2009 | US20090303687 Subsea Electronics Module |
| 12/10/2009 | US20090303426 Flexible printed circuit board and liquid crystal display device including the same |
| 12/10/2009 | US20090302756 Film with Transparent Conductive Layer, Flexible Functional Element and Flexible Dispersion-Type Electroluminescent Element, and Method for Producing the Same and Electronic Device by the Use Thereof |
| 12/10/2009 | US20090302462 Prepreg, Method for Manufacturing Prepreg, Substrate, and Semiconductor Device |
| 12/10/2009 | US20090302454 Technology for fabrication of packaging interface substrate wafers with fully metallized vias through the substrate wafer |
| 12/10/2009 | US20090302109 Protection Against Manipulation and Through-Drilling for an Apparatus to be Connected to an Electrical Circuit |
| 12/10/2009 | US20090301771 Conductive bump, method for forming the same, and electronic component mounting structure using the same |
| 12/10/2009 | US20090301770 Embedded thin films |
| 12/10/2009 | US20090301769 Method for manufacturing conductors and semiconductors |
| 12/10/2009 | US20090301768 Printed circuit board |
| 12/10/2009 | US20090301767 Printed circuit board and method of manufacturing the same |
| 12/10/2009 | US20090301766 Printed circuit board including electronic component embedded therein and method of manufacturing the same |
| 12/10/2009 | US20090301764 Method for smoothing electrode, method for manufacturing ceramic substrate, and ceramic substrate |
| 12/10/2009 | US20090301763 Ink, method of forming electrical traces using the same and circuit board |
| 12/10/2009 | US20090301762 Oligomeric halogenated chain extenders for preparing epoxy resins |
| 12/10/2009 | US20090301761 Cable assembly having connector with interior printed circuit board facilitating termination |
| 12/10/2009 | US20090301760 Method of Soldering a Module Board |
| 12/10/2009 | DE102008025028A1 Anordnung zur Aufhängung und Kontaktierung eines piezoelektrischen Bauelements Arrangement for suspension and contacting a piezoelectric component |
| 12/09/2009 | EP2131635A1 Active electrode and method for manufacturing it using flex circuit technology |
| 12/09/2009 | EP2130804A2 Dielectric ceramic composition, multilayer complex electronic device, multilayer common mode filter, multilayer ceramic coil and multilayer ceramic capacitor |
| 12/09/2009 | EP2130627A1 Photochemical synthesis of bimetallic core-shell nanoparticles |
| 12/09/2009 | EP2130416A1 Conductor plate protection for a battery |
| 12/09/2009 | EP2130415A1 Improved noise isolation in high-speed digital systems on packages and printed circuit boards (pcbs) |
| 12/09/2009 | EP1357775B1 Circuit board and its manufacturing method |
| 12/09/2009 | EP1272020B1 Method of manufacturing ceramic multi-layer substrate, and unbaked composite laminated body |
| 12/09/2009 | EP1106656B1 Process for preparing green pigment composition containing no halogen |
| 12/09/2009 | CN201360330Y Minitype microphone with high installing reliability |
| 12/09/2009 | CN201360295Y Ultra-long linear array CCD drive for spatial multi-spectral remote sensor |
| 12/09/2009 | CN101600575A Printer with configurable memory |
| 12/09/2009 | CN101600307A Circuit board and manufacture method thereof |
| 12/09/2009 | CN101600306A Method for processing stamped rigid-flexible board and rigid-flexible board |
| 12/09/2009 | CN101600297A Advanced print circuit board and the method of the same |
| 12/09/2009 | CN101600296A Polyimide copper clad lamination containing thioether structure and preparation method thereof |
| 12/09/2009 | CN101600295A Anisotropic conducting film and circuit board using same |
| 12/09/2009 | CN101600294A Anisotropic conducting film and circuit board using same |
| 12/09/2009 | CN101600293A Printing circuit board |
| 12/09/2009 | CN101600292A Circuit board |
| 12/09/2009 | CN101600291A Liquid crystal display module and flexible printed circuit board thereof |
| 12/09/2009 | CN101600290A Hollowed double-sided flexible printed circuit board |
| 12/09/2009 | CN101599583A Chipcard gripping structure and circuit board components using same |
| 12/09/2009 | CN101599476A Thin double-sided packaging substrate and preparation method thereof |
| 12/09/2009 | CN101599475A Buried circuit board and flip-chip encapsulating structure |
| 12/09/2009 | CN101599438A Circuit structure and manufacture method thereof |
| 12/09/2009 | CN101598267A Light-emitting device |
| 12/09/2009 | CN101597416A Circuit carrier plate constituent and manufacture method thereof |
| 12/09/2009 | CN100569051C Circuit substrate manufacturing method |
| 12/09/2009 | CN100569050C Method for fixing photo detector and used PCB |
| 12/09/2009 | CN100569047C Wiring basal plate |
| 12/09/2009 | CN100569046C Multilayer substrate and method of manufacturing the same |
| 12/09/2009 | CN100569045C Light-receiving element |
| 12/09/2009 | CN100569044C Portable terminal device and arrangement strcuture and method of connector of flexible printed circuit board theroef |
| 12/09/2009 | CN100568714C Electronic circuit for distribution of radio-frequency signals |
| 12/09/2009 | CN100568614C Triangular conforming transmission structure |
| 12/09/2009 | CN100568501C Electronic apparatus |
| 12/09/2009 | CN100568489C 电路模块及其制造方法 Circuit module and manufacturing method thereof |
| 12/09/2009 | CN100568422C Plated terminals |
| 12/09/2009 | CN100566992C Metallized polyimide film and preparation method thereof |
| 12/08/2009 | US7630601 Connecting a component with an embedded optical fiber |
| 12/08/2009 | US7630592 Method for the production of electrooptical printed circuit boards comprising polysiloxane wave guides and use thereof |
| 12/08/2009 | US7630536 Printing inspection apparatus, printing inspection method, printing inspection data generating apparatus, and printing inspection data generating method |
| 12/08/2009 | US7630208 Multilayer chip capacitor, circuit board apparatus having the capacitor, and circuit board |
| 12/08/2009 | US7629541 High speed interposer |
| 12/08/2009 | US7629540 Wired circuit board and production method thereof |
| 12/08/2009 | US7629539 Wired circuit board |
| 12/08/2009 | US7629538 Stripline flex circuit |
| 12/08/2009 | US7629537 Single layer flex circuit |
| 12/08/2009 | US7629045 layer contains novolak epoxy resin, crosslinked acrylonitrile-butadiene rubber particles, and curing agent novolak phenol resin; excellent high frequency properties, high reliability; provide bonding strength, waterproofing, heat resistance; multilayer circuit board in semiconductors |
| 12/03/2009 | WO2009145727A1 A semiconductor structure and a method of manufacturing a semiconductor structure |
| 12/03/2009 | WO2009145224A1 Epoxy resin composition for printed wiring board, solder resist composition, resin film, resin sheet, prepreg, metal foil with resin, cover lay, and flexible printed wiring board |
| 12/03/2009 | WO2009145179A1 Resin composition for forming the adhesive layers of a multi-layer flexible printed circuit board |
| 12/03/2009 | WO2009145109A1 Metal base circuit board |
| 12/03/2009 | WO2009144954A1 Heat-hardened resin composition and printed wiring board |
| 12/03/2009 | WO2009144215A1 Circuit board arrangement for thermally stressed electronic components, in particular in motor vehicle control apparatus |
| 12/03/2009 | WO2009143796A2 Optoelectronic semiconductor component and printed circuit board |
| 12/03/2009 | WO2009143759A1 A manufacturing method for circuit board stepped grooves and an equipment for manufacturing circuit board stepped grooves |
| 12/03/2009 | WO2009143550A1 Method for integrating at least one electronic component into a printed circuit board, and printed circuit board |
| 12/03/2009 | WO2009126366A3 Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom |
| 12/03/2009 | WO2009115841A3 Display system |
| 12/03/2009 | US20090298306 Memory card connector |
| 12/03/2009 | US20090298230 Stacked Module Systems and Methods |
| 12/03/2009 | US20090296364 Wiring substrate and semiconductor package |
| 12/03/2009 | US20090296362 Multilayer Printed Circuit Board, and Design Method of Multilayer Printed Circuit Board |
| 12/03/2009 | US20090296310 Chip capacitor precursors, packaged semiconductors, and assembly method for converting the precursors to capacitors |
| 12/03/2009 | US20090295364 Methods of Using a Nanotransfer Printing Stamp Having Conductively Coated Sidewalls |
| 12/03/2009 | US20090295285 Spontaneous emission display, spontaneous emission display manufacturing method, transparent conductive film, electroluminescence device, solar cell transparent electrode, and electronic paper transparent electrode |
| 12/03/2009 | US20090295046 Aluminum nitride powder and aluminum nitride sintered compact |
| 12/03/2009 | US20090294975 Package for a Die |
| 12/03/2009 | US20090294964 Electrically-conductive inorganic coating, method for producing the coating, circuit board, and semiconductor apparatus |