Patents for H05K 1 - Printed circuits (98,583)
01/2010
01/06/2010EP1707037B1 Method for the production of a circuit board element and circuit board element
01/06/2010EP1413178B1 Card manufacturing technique and resulting card
01/06/2010CN201378899Y Single-sided epoxy glass-cloth copper clad laminate
01/06/2010CN201378898Y Epoxy glass fiber and non-woven fabric double-side copper-clad plate
01/06/2010CN201378897Y Epoxy glass fiber or non-woven fabric single-side copper-clad plate
01/06/2010CN201378896Y Inner plate edge structure for producing printed circuit boards
01/06/2010CN201378872Y Condenser microphone device
01/06/2010CN201376387Y Phenolic paper and glass cloth double-side copper-clad plate
01/06/2010CN201376386Y Phenolic paper or glass cloth single-side copper-clad plate
01/06/2010CN101622914A Orthogonal header
01/06/2010CN101621892A Connection structure of flexible printed circuits and optical pickup device including the connection structure
01/06/2010CN101621891A Connection structure of flexible printed circuits and optical pickup device including the connection structure
01/06/2010CN101621890A Technology for improving welding disk circuit of flexible circuit board of back light source
01/06/2010CN101621889A Printed circuit board and electronic device
01/06/2010CN101621888A Method and system for realizing wiring of sensitive signal wire in printed circuit board
01/06/2010CN100579336C Method of forming metal wiring and method of manufacturing active matrix substrate
01/06/2010CN100579333C Member for circuit board, method for manufacturing circuit board, and apparatus for manufacturing circuit board
01/06/2010CN100579332C Circuit board, member for circuit board and production method therefor and method of laminating fexible film
01/06/2010CN100579331C Soft printed circuit board and LCD module with the soft printed circuit board
01/06/2010CN100579330C Technique for accommodating electronic components on a multilayer signal routing device
01/06/2010CN100578830C Light-emitting element mounting board and light-emitting element module
01/06/2010CN100578778C Electronic device
01/06/2010CN100578774C Interconnect module with reduced power distribution impedance and manufacturing method thereof
01/06/2010CN100578769C Organic matrices containing nano materials to enhance bulk thermal conductivity
01/06/2010CN100578768C Heat dissipation device and power module
01/06/2010CN100578762C Circuit device and mixing integrated circuit device
01/06/2010CN100577899C Multi-component fibers having reversible thermal properties and methods of manufacturing thereof
01/05/2010US7643308 Device and method for damping cavity resonance in a multi-layer carrier module
01/05/2010US7642998 Display apparatus and assembly of its driving circuit
01/05/2010US7642769 Insert and tray for electronic device handling apparatus, and electronic device handling apparatus
01/05/2010US7642704 Light-emitting diode with a base
01/05/2010US7642468 Multilayer wiring board and fabricating method of the same
01/05/2010US7642467 Method for fabrication of separators for electrode pairs in diodes
01/05/2010US7642466 Connection configuration for rigid substrates
01/05/2010US7642213 Method of producing membrane electrode assemblies for use in proton exchange membrane and direct methanol fuel cells
01/05/2010US7642126 Method of manufacturing circuits
01/05/2010US7641933 Pre-fired ceramic; improved direct current blocking
01/05/2010US7641817 Silver powder and method for producing same
01/05/2010US7641315 Printhead with reciprocating cantilevered thermal actuators
01/05/2010US7640951 Glass cloth and film substrate using the same
01/05/2010US7640660 Method for manufacturing multilayer wiring board incorporating carbon fibers and glass fibers
12/2009
12/31/2009US20090325105 Printed circuit board with embedded capacitors therein, and process for manufacturing the same
12/31/2009US20090324988 Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil
12/31/2009US20090323503 Connection structure of flexible printed circuits and optical pickup device including the connection structure
12/31/2009US20090323300 Conductor Foil with Adhesive Layer, Conductor-Clad Laminate, Printed Wiring Board and Multilayer Wiring Board
12/31/2009US20090323294 Memory card and method of manufacturing the same
12/31/2009US20090323293 Battery Cell Interconnect and Voltage Sensing Assembly and Method for Coupling Battery Cell Assemblies Thereto
12/31/2009US20090322309 Microelectrode Arrays
12/31/2009US20090322200 Nano Filament Structure and Methods of Forming the Same
12/31/2009US20090321921 Embedded wiring board, semiconductor package including the same and method of fabricating the same
12/31/2009US20090321126 Concentric Vias In Electronic Substrate
12/31/2009US20090321125 Plastic Land Grid Array (PLGA) Module and Printed Wiring Board (PWB) With Enhanced Contact Metallurgy Construction
12/31/2009US20090321123 Method for producing structured electrically conductive surfaces
12/31/2009US20090321122 Relay substrate, method for manufacturing the relay substrate and three-dimensional circuit device using the relay substrate
12/31/2009US20090321121 Ceramic multilayer substrate and its manufacturing method
12/31/2009US20090321120 Printed circuit board and electronic device
12/31/2009US20090321119 Device mounting board, semiconductor module, mobile device, and manufacturing method of device mounting board
12/31/2009US20090321118 Printed circuit board embedded chip and manufacturing method thereof
12/31/2009US20090321117 A curable epoxy resin composition having a mixed catalyst system and laminates made therefrom
12/31/2009US20090321116 Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same
12/31/2009US20090321115 Manufacturing method of metal structure in multi-layer substrate and structure thereof
12/31/2009US20090321114 Electrical inspection substrate unit and manufacturing method therefore
12/31/2009US20090321113 High contrast transparent conductors and methods of forming the same
12/31/2009US20090321112 Rigid-flexible printed circuit board having a peelable mask and method of making
12/31/2009US20090321111 Flexible printed circuit module
12/31/2009US20090321110 Micro electro-mechanical system
12/31/2009DE102008030367A1 Printed circuit board arrangement for motor vehicle, has plug contact plate whose contact regions are formed for accommodating plug contacts of plug element for soldering-free electrical and mechanical coupling of plug contacts with regions
12/31/2009DE102008029123A1 Folding fixture for fastening electronic unit on printed circuit board, has spacers fastened to edges of assembly element, where ends of spacers are not fastened to assembly element and connect fixture with printed circuit board
12/31/2009DE102007017005B4 Elektrisch leitende Zusammensetzung, Verfahren zur Herstellung eines elektrisch leitenden Films Electrically conductive composition, method of producing an electroconductive film
12/31/2009DE102004047302B4 Montageanordnung für einen Kondensator sowie elektrisches Steuergerät mit einer solchen Montageanordnung A mounting arrangement for a capacitor as well as electrical control device having such a mounting arrangement
12/30/2009WO2009157976A1 Curved flat cable
12/30/2009WO2009155808A1 Printed circuit board, its making method and relative equipment
12/30/2009WO2009106051A3 Miniature housing and support arrangement having at least one miniature housing
12/30/2009EP2139305A1 Method for eliminating engraving defects of a metallic layer deposited on a flexible support
12/30/2009EP2139304A1 Printed substrate and electronic device
12/30/2009EP2138020A1 Circuit substrate with plated through hole structure and method
12/30/2009EP2138019A1 A step card and method for making a step card
12/30/2009EP2137794A2 Modular connector with reduced termination variability and improved performance
12/30/2009EP2008021B1 Illuminator
12/30/2009EP1887031B1 White prepreg, white laminated plate, and metal foil clad white laminated plate
12/30/2009EP1719393B1 Printed circuit board
12/30/2009EP1565789B1 Photosensitive resin composition comprising a halogen-free colorant
12/30/2009EP1435020B1 Aqueous developable photoimageable thick film compositions
12/30/2009CN201374894Y Electronic device
12/30/2009CN201374871Y Central component for automation equipment capable of flexibly expanding
12/30/2009CN201374870Y Flexible printed wiring board for liquid crystal display module assemblies
12/30/2009CN201374869Y Circuit board and system for forming a plurality of solid conductive columns on circuit substrate
12/30/2009CN201374868Y Circuit board structure
12/30/2009CN201374867Y Circuit board with removable test point part
12/30/2009CN201371633Y Main board of pictorial machine
12/30/2009CN101617573A Composite organic encapsulants
12/30/2009CN101617572A 柔性印刷布线板 The flexible printed wiring board
12/30/2009CN101617571A Electronic card and aircraft including same
12/30/2009CN101617570A Printed circuit board
12/30/2009CN101617569A Nonstick material, method for removing a part of a planar material layer and multilayer structure and use therefor
12/30/2009CN101616544A PCB component and realizing method thereof
12/30/2009CN101616543A Printed substrate and electronic device
12/30/2009CN101616542A Flexible and rigid compound circuit board with deprivable protective layer and manufacturing method thereof
12/30/2009CN101616541A Printed circuit board as well as manufacture method and associated equipment thereof
12/30/2009CN101616540A Printed circuit board and method of manufacturing the same