Patents for H05K 1 - Printed circuits (98,583) |
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12/30/2009 | CN101616539A High-power device heat dissipation structure and implementation method thereof |
12/30/2009 | CN101616538A Flexible printed circuit module |
12/30/2009 | CN101616537A Part welding pad wiring structure of flexible printed circuit board |
12/30/2009 | CN101616536A Circuit board with electrostatic discharge protection as well as liquid crystal module and electronic device applying same |
12/30/2009 | CN101616535A Wiring board and wiring board manufacturing method |
12/30/2009 | CN101616534A Multi-layer printing wiring board and manufacture method thereof |
12/30/2009 | CN100576977C Bare chip embedded PCB and method of the same |
12/30/2009 | CN100576976C Production method for circuit board directly embedded in passive component |
12/30/2009 | CN100576968C Wired circuit board |
12/30/2009 | CN100576967C Circuit board and liquid discharging apparatus |
12/30/2009 | CN100576962C Warming apparatus with heater produced by PCB |
12/30/2009 | CN100576534C Hybrid integrated circuit device and method for manufacturing same |
12/30/2009 | CN100576532C Structure of semiconductor element embedding in carrier plate and its manufacture method |
12/30/2009 | CN100576379C Method of forming sheet having foreign material portions used for forming multilayer wiring board and sheet having foreign portion |
12/30/2009 | CN100576023C Line and liquid crystal display panel applying same |
12/30/2009 | CN100575401C Brown oxide pretreatment composition, and method for improving adhesion of polyimide surface |
12/30/2009 | CN100575378C Thermosetting polycarbodiimide copolymer |
12/29/2009 | US7639903 Daisy chain optical interconnect |
12/29/2009 | US7639510 Telecommunications chassis having a repeater card |
12/29/2009 | US7639184 Method for forming radio frequency antenna |
12/29/2009 | US7638715 Printed circuit board and manufacturing method therefor |
12/29/2009 | US7638714 Structure and manufacturing method of substrate board |
12/29/2009 | US7638419 Method of fabricating a via attached to a bond pad utilizing a tapered interconnect |
12/29/2009 | US7637816 System and method for combining low-power signals and high-power signals on a single circuit board in a gaming machine |
12/29/2009 | US7637004 Electronic device manufacturing method and supporter |
12/29/2009 | CA2554802C Resin composition for ghz-band electronic component and ghz-band electronic component |
12/29/2009 | CA2285509C Improved polycarboxy/polyol fiberglass binder |
12/24/2009 | US20090316374 Reduced Porosity High-K Thin Film Mixed Grains for Thin Film Capacitor Applications |
12/24/2009 | US20090316373 PCB having chips embedded therein and method of manfacturing the same |
12/24/2009 | US20090316370 Electromagnetic noise suppressor, structure with electromagnetic noise suppressing function and their manufacturing methods |
12/24/2009 | US20090316369 Tool-less vertical pcba insulator and support/shipping brace |
12/24/2009 | US20090316368 USB Package With Bistable Sliding Mechanism |
12/24/2009 | US20090316300 Printed circuit board and method of manufacturing the same |
12/24/2009 | US20090315856 Flexible printed circuit, touch panel, display panel and display |
12/24/2009 | US20090315855 Flexible printed circuit, touch panel, display panel and display |
12/24/2009 | US20090315849 Transparent conductive multilayer body and touch panel made of the same |
12/24/2009 | US20090315701 Sensing circuit board communications module assembly |
12/24/2009 | US20090315190 Wiring board, semiconductor device using wiring board and their manufacturing methods |
12/24/2009 | US20090315158 Wiring board and electrical signal transmission system |
12/24/2009 | US20090314634 Electromagnetic noise suppressor, structure with electromagnetic noise suppressing function and their manufacturing methods |
12/24/2009 | US20090314539 Electromagnetic noise suppressor, article with electromagnetic noise suppressing function and their manufacturing methods |
12/24/2009 | US20090314538 Dual epoxy dielectric and photosensitive solder mask coatings, and processes of making same |
12/24/2009 | US20090314537 Conductive connecting pin and package substrate |
12/24/2009 | US20090314536 Printed circuit board, electric instrument, and semiconductor package |
12/24/2009 | US20090314535 Printed Board |
12/24/2009 | US20090314534 Electronic component |
12/24/2009 | US20090314533 Adhesive for bonding circuit members, circuit board and process for its production |
12/24/2009 | US20090314532 Thermosetting resin composition, dry film including thermosetting resin composition, and multilayer printed wiring board including thermosetting resin composition |
12/24/2009 | US20090314531 Method of making multilayered construction for use in resistors and capacitors |
12/24/2009 | US20090314530 Method of aligning nanotubes and wires with an etched feature |
12/24/2009 | US20090314529 Aqueous printable electrical conductors (xink) |
12/24/2009 | US20090314528 Wiring board and wiring board manufacturing method |
12/24/2009 | US20090314527 Semiconductor device and manufacturing method thereof |
12/24/2009 | US20090314526 Resin Film, Adhesive Sheet, Circuit Board, and Electronic Apparatus |
12/24/2009 | US20090314525 Mold for Wiring Substrate Formation and Process for Producing the Same, Wiring Substrate and Process for Producing the Same, Process for Producing Multilayered Laminated Wiring Substrate and Method for Viahole Formation |
12/24/2009 | US20090314524 Method of manufacturing hybrid structure of multi-layer substrates and hybrid structure thereof |
12/24/2009 | US20090314523 Adhesive sheet with base for flexible printed wiring boards, production method therefor, multilayer flexible printed wiring board and flex-rigid printed wiring board |
12/24/2009 | US20090314522 Printed Circuit Board With Additional Functional Elements, Method of Production and Use |
12/24/2009 | US20090314521 Method for Producing Parts for Passive Electronic Components and Parts Produced |
12/24/2009 | US20090314520 Method and Apparatus for Spraying on a Track, in Particular a Conductor Track, and Electrical Component with a Conductor Track |
12/24/2009 | US20090314519 Direct layer laser lamination for electrical bump substrates, and processes of making same |
12/24/2009 | US20090314411 Electromagnetic noise suppressor, article with electromagnetic noise suppressing function and their manufacturing methods |
12/24/2009 | US20090313819 Methods for Manufacturing a Panel of Electronic Component Protection Devices |
12/24/2009 | DE202009005276U1 Multimedia-Netzwerkfilter Multimedia Network Filter |
12/24/2009 | DE102008029410A1 Transmission-line device, has heat sink thermally connected to printed circuit board, and recess filled with thermal conducting medium in contact region for region of potential difference between position of circuit board and heat sink |
12/24/2009 | DE102008028300A1 Leiterplatte mit flexiblem Bereich und Verfahren zur Herstellung Printed circuit board with a flexible area and methods of making |
12/24/2009 | DE102008002532A1 Verfahren zur Herstellung einer elektronischen Baugruppe A process for preparing an electronic assembly |
12/24/2009 | DE102007022425B4 Beleuchtungsmodule Lighting Modules |
12/24/2009 | DE102006025453B4 Halbleiterschaltungsanordnung Semiconductor circuitry |
12/23/2009 | WO2009154295A1 Collective ceramic substrate, manufacturing method for the substrate, ceramic substrate, and ceramic circuit substrate |
12/23/2009 | WO2009153647A1 Wire harness and production method therefor |
12/23/2009 | WO2009153094A1 Arrangement for decoupling stress in a substrate with a chip |
12/23/2009 | WO2009120633A3 Semiconductor package with embedded magnetic component and method of manufacture |
12/23/2009 | WO2009113043A3 10g xfp compliant pcb |
12/23/2009 | EP2136610A1 Multilayer wiring board and its manufacturing method |
12/23/2009 | EP2136401A1 Process and apparatus for tri-dimensional interconnection of electronic devices |
12/23/2009 | EP2136400A1 Radiating member, circuit board using the member, electronic part module, and method for manufacturing the module |
12/23/2009 | EP2136300A1 Multiple channel modules and bus systems |
12/23/2009 | EP2135885A1 Resin composition for forming insulating layer of printed wiring board |
12/23/2009 | EP2135494A1 Panel devices comprising electric circuit boards and method for the production thereof |
12/23/2009 | EP1980143B1 Printed circuit board with additional functional elements, method of production and use |
12/23/2009 | CN201369877Y Installing structure of common mode inductors on embedded type PCB |
12/23/2009 | CN201369876Y Multifunctional electronic circuit board |
12/23/2009 | CN201369875Y Complete distribution structure of printed circuit board |
12/23/2009 | CN201369874Y Complete typesetting structure of printed circuit board |
12/23/2009 | CN101611659A Circuit connecting adhesive film, connecting structure and method for manufacturing the connecting structure |
12/23/2009 | CN101611658A Electronic device with flip module having low height |
12/23/2009 | CN101611657A Production process of printed circuits on which electronic components without leading wire are soldered. |
12/23/2009 | CN101610646A Electrical connection structure as well as technology and circuit board structure thereof |
12/23/2009 | CN101610639A Multidirectional separated scalable interconnected mother board |
12/23/2009 | CN101610638A Line motherboard |
12/23/2009 | CN101610637A Method of arranging components of circuit board for optimal heat dissipation and circuit apparatus |
12/23/2009 | CN101610636A Electromagnetic bandgap structure, and printed circuit board |
12/23/2009 | CN101610635A Circuit board structure and technology thereof |
12/23/2009 | CN101610634A Flexible printed circuit board, touch panel, display panel and display |
12/23/2009 | CN101610633A Flexible printed circuit board, touch panel, display panel and display |
12/23/2009 | CN101609228A Light source module of LCD backlight module and direct type backlight source |
12/23/2009 | CN101608077A Nano-copper conductive ink preparation method |
12/23/2009 | CN101608051A Insulating resin and preparation method thereof as well as insulating resin copper coated plate containing insulating resin |
12/23/2009 | CN100574573C Multi-layer printed circuit board and method for manufacturing same |