Patents for H05K 1 - Printed circuits (98,583)
12/2009
12/30/2009CN101616539A High-power device heat dissipation structure and implementation method thereof
12/30/2009CN101616538A Flexible printed circuit module
12/30/2009CN101616537A Part welding pad wiring structure of flexible printed circuit board
12/30/2009CN101616536A Circuit board with electrostatic discharge protection as well as liquid crystal module and electronic device applying same
12/30/2009CN101616535A Wiring board and wiring board manufacturing method
12/30/2009CN101616534A Multi-layer printing wiring board and manufacture method thereof
12/30/2009CN100576977C Bare chip embedded PCB and method of the same
12/30/2009CN100576976C Production method for circuit board directly embedded in passive component
12/30/2009CN100576968C Wired circuit board
12/30/2009CN100576967C Circuit board and liquid discharging apparatus
12/30/2009CN100576962C Warming apparatus with heater produced by PCB
12/30/2009CN100576534C Hybrid integrated circuit device and method for manufacturing same
12/30/2009CN100576532C Structure of semiconductor element embedding in carrier plate and its manufacture method
12/30/2009CN100576379C Method of forming sheet having foreign material portions used for forming multilayer wiring board and sheet having foreign portion
12/30/2009CN100576023C Line and liquid crystal display panel applying same
12/30/2009CN100575401C Brown oxide pretreatment composition, and method for improving adhesion of polyimide surface
12/30/2009CN100575378C Thermosetting polycarbodiimide copolymer
12/29/2009US7639903 Daisy chain optical interconnect
12/29/2009US7639510 Telecommunications chassis having a repeater card
12/29/2009US7639184 Method for forming radio frequency antenna
12/29/2009US7638715 Printed circuit board and manufacturing method therefor
12/29/2009US7638714 Structure and manufacturing method of substrate board
12/29/2009US7638419 Method of fabricating a via attached to a bond pad utilizing a tapered interconnect
12/29/2009US7637816 System and method for combining low-power signals and high-power signals on a single circuit board in a gaming machine
12/29/2009US7637004 Electronic device manufacturing method and supporter
12/29/2009CA2554802C Resin composition for ghz-band electronic component and ghz-band electronic component
12/29/2009CA2285509C Improved polycarboxy/polyol fiberglass binder
12/24/2009US20090316374 Reduced Porosity High-K Thin Film Mixed Grains for Thin Film Capacitor Applications
12/24/2009US20090316373 PCB having chips embedded therein and method of manfacturing the same
12/24/2009US20090316370 Electromagnetic noise suppressor, structure with electromagnetic noise suppressing function and their manufacturing methods
12/24/2009US20090316369 Tool-less vertical pcba insulator and support/shipping brace
12/24/2009US20090316368 USB Package With Bistable Sliding Mechanism
12/24/2009US20090316300 Printed circuit board and method of manufacturing the same
12/24/2009US20090315856 Flexible printed circuit, touch panel, display panel and display
12/24/2009US20090315855 Flexible printed circuit, touch panel, display panel and display
12/24/2009US20090315849 Transparent conductive multilayer body and touch panel made of the same
12/24/2009US20090315701 Sensing circuit board communications module assembly
12/24/2009US20090315190 Wiring board, semiconductor device using wiring board and their manufacturing methods
12/24/2009US20090315158 Wiring board and electrical signal transmission system
12/24/2009US20090314634 Electromagnetic noise suppressor, structure with electromagnetic noise suppressing function and their manufacturing methods
12/24/2009US20090314539 Electromagnetic noise suppressor, article with electromagnetic noise suppressing function and their manufacturing methods
12/24/2009US20090314538 Dual epoxy dielectric and photosensitive solder mask coatings, and processes of making same
12/24/2009US20090314537 Conductive connecting pin and package substrate
12/24/2009US20090314536 Printed circuit board, electric instrument, and semiconductor package
12/24/2009US20090314535 Printed Board
12/24/2009US20090314534 Electronic component
12/24/2009US20090314533 Adhesive for bonding circuit members, circuit board and process for its production
12/24/2009US20090314532 Thermosetting resin composition, dry film including thermosetting resin composition, and multilayer printed wiring board including thermosetting resin composition
12/24/2009US20090314531 Method of making multilayered construction for use in resistors and capacitors
12/24/2009US20090314530 Method of aligning nanotubes and wires with an etched feature
12/24/2009US20090314529 Aqueous printable electrical conductors (xink)
12/24/2009US20090314528 Wiring board and wiring board manufacturing method
12/24/2009US20090314527 Semiconductor device and manufacturing method thereof
12/24/2009US20090314526 Resin Film, Adhesive Sheet, Circuit Board, and Electronic Apparatus
12/24/2009US20090314525 Mold for Wiring Substrate Formation and Process for Producing the Same, Wiring Substrate and Process for Producing the Same, Process for Producing Multilayered Laminated Wiring Substrate and Method for Viahole Formation
12/24/2009US20090314524 Method of manufacturing hybrid structure of multi-layer substrates and hybrid structure thereof
12/24/2009US20090314523 Adhesive sheet with base for flexible printed wiring boards, production method therefor, multilayer flexible printed wiring board and flex-rigid printed wiring board
12/24/2009US20090314522 Printed Circuit Board With Additional Functional Elements, Method of Production and Use
12/24/2009US20090314521 Method for Producing Parts for Passive Electronic Components and Parts Produced
12/24/2009US20090314520 Method and Apparatus for Spraying on a Track, in Particular a Conductor Track, and Electrical Component with a Conductor Track
12/24/2009US20090314519 Direct layer laser lamination for electrical bump substrates, and processes of making same
12/24/2009US20090314411 Electromagnetic noise suppressor, article with electromagnetic noise suppressing function and their manufacturing methods
12/24/2009US20090313819 Methods for Manufacturing a Panel of Electronic Component Protection Devices
12/24/2009DE202009005276U1 Multimedia-Netzwerkfilter Multimedia Network Filter
12/24/2009DE102008029410A1 Transmission-line device, has heat sink thermally connected to printed circuit board, and recess filled with thermal conducting medium in contact region for region of potential difference between position of circuit board and heat sink
12/24/2009DE102008028300A1 Leiterplatte mit flexiblem Bereich und Verfahren zur Herstellung Printed circuit board with a flexible area and methods of making
12/24/2009DE102008002532A1 Verfahren zur Herstellung einer elektronischen Baugruppe A process for preparing an electronic assembly
12/24/2009DE102007022425B4 Beleuchtungsmodule Lighting Modules
12/24/2009DE102006025453B4 Halbleiterschaltungsanordnung Semiconductor circuitry
12/23/2009WO2009154295A1 Collective ceramic substrate, manufacturing method for the substrate, ceramic substrate, and ceramic circuit substrate
12/23/2009WO2009153647A1 Wire harness and production method therefor
12/23/2009WO2009153094A1 Arrangement for decoupling stress in a substrate with a chip
12/23/2009WO2009120633A3 Semiconductor package with embedded magnetic component and method of manufacture
12/23/2009WO2009113043A3 10g xfp compliant pcb
12/23/2009EP2136610A1 Multilayer wiring board and its manufacturing method
12/23/2009EP2136401A1 Process and apparatus for tri-dimensional interconnection of electronic devices
12/23/2009EP2136400A1 Radiating member, circuit board using the member, electronic part module, and method for manufacturing the module
12/23/2009EP2136300A1 Multiple channel modules and bus systems
12/23/2009EP2135885A1 Resin composition for forming insulating layer of printed wiring board
12/23/2009EP2135494A1 Panel devices comprising electric circuit boards and method for the production thereof
12/23/2009EP1980143B1 Printed circuit board with additional functional elements, method of production and use
12/23/2009CN201369877Y Installing structure of common mode inductors on embedded type PCB
12/23/2009CN201369876Y Multifunctional electronic circuit board
12/23/2009CN201369875Y Complete distribution structure of printed circuit board
12/23/2009CN201369874Y Complete typesetting structure of printed circuit board
12/23/2009CN101611659A Circuit connecting adhesive film, connecting structure and method for manufacturing the connecting structure
12/23/2009CN101611658A Electronic device with flip module having low height
12/23/2009CN101611657A Production process of printed circuits on which electronic components without leading wire are soldered.
12/23/2009CN101610646A Electrical connection structure as well as technology and circuit board structure thereof
12/23/2009CN101610639A Multidirectional separated scalable interconnected mother board
12/23/2009CN101610638A Line motherboard
12/23/2009CN101610637A Method of arranging components of circuit board for optimal heat dissipation and circuit apparatus
12/23/2009CN101610636A Electromagnetic bandgap structure, and printed circuit board
12/23/2009CN101610635A Circuit board structure and technology thereof
12/23/2009CN101610634A Flexible printed circuit board, touch panel, display panel and display
12/23/2009CN101610633A Flexible printed circuit board, touch panel, display panel and display
12/23/2009CN101609228A Light source module of LCD backlight module and direct type backlight source
12/23/2009CN101608077A Nano-copper conductive ink preparation method
12/23/2009CN101608051A Insulating resin and preparation method thereof as well as insulating resin copper coated plate containing insulating resin
12/23/2009CN100574573C Multi-layer printed circuit board and method for manufacturing same