| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/05/1977 | US4033656 Low profile integrated circuit socket |
| 06/28/1977 | US4032964 Multiple hybrid semiconductor structure |
| 06/28/1977 | US4032962 High density semiconductor integrated circuit layout |
| 06/28/1977 | US4032960 Anisotropic resistor for electrical feed throughs |
| 06/28/1977 | US4032949 Integrated circuit fusing technique |
| 06/28/1977 | US4032706 Resin-encased microelectronic module |
| 06/28/1977 | US4032350 Printing paste vehicle, gold dispensing paste and method of using the paste in the manufacture of microelectronic circuitry components |
| 06/28/1977 | US4032058 Beam-lead integrated circuit structure and method for making the same including automatic registration of beam-leads with corresponding dielectric substrate leads |
| 06/21/1977 | US4030952 Method of MOS circuit fabrication |
| 06/21/1977 | US4030948 Polyimide containing silicones as protective coating on semiconductor device |
| 06/21/1977 | US4030943 Planar process for making high frequency ion implanted passivated semiconductor devices and microwave integrated circuits |
| 06/21/1977 | US4030180 Longitudinally fed component insertion apparatus |
| 06/14/1977 | US4029562 Forming feedthrough connections for multi-level interconnections metallurgy systems |
| 06/14/1977 | US4029522 Method to fabricate ion-implanted layers with abrupt edges to reduce the parasitic resistance of Schottky barrier fets and bipolar transistors |
| 06/14/1977 | US4029141 Cooling device for components which dissipate large amounts of heat |
| 06/07/1977 | US4028723 Cooling device for heat generation member |
| 06/07/1977 | US4028722 Contact bonded packaged integrated circuit |
| 06/07/1977 | US4027728 Vapor cooling device for semiconductor device |
| 06/07/1977 | US4027383 Integrated circuit packaging |
| 05/31/1977 | US4027326 Metallic support carrier for semiconductor elements |
| 05/31/1977 | US4026759 Method of making ingrown lead frame with strain relief |
| 05/31/1977 | US4026742 Plasma etching process for making a microcircuit device |
| 05/31/1977 | US4026008 Semiconductor lead structure and assembly and method for fabricating same |
| 05/31/1977 | US4025997 Ceramic mounting and heat sink device |
| 05/24/1977 | US4025716 Integrated circuits, ceramic |
| 05/24/1977 | US4025669 Multiple pass method of applying printing paste upon a substrate |
| 05/24/1977 | US4024677 Method of manufacturing an electric timepiece and electric timepiece obtained by carrying out this method |
| 05/24/1977 | US4024629 Fabrication techniques for multilayer ceramic modules |
| 05/17/1977 | US4024570 Simplified housing structure including a heat sink for a semiconductor unit |
| 05/17/1977 | US4024568 Transistor with base/emitter encirclement configuration |
| 05/17/1977 | US4024567 Semiconductor device having Al-Mn or Al-Mn-Si alloy electrodes |
| 05/17/1977 | US4024565 Deep diode solid state transformer |
| 05/17/1977 | US4024561 Field effect transistor monitors |
| 05/17/1977 | US4023997 Method of placing an oriented array of devices on a releasable mounting |
| 05/17/1977 | US4023616 Thyristor cooling arrangement |
| 05/10/1977 | USRE29218 Packaged semiconductor device for microwave use |
| 05/10/1977 | US4023198 High frequency, high power semiconductor package |
| 05/10/1977 | US4023197 Integrated circuit chip carrier and method for forming the same |
| 05/10/1977 | US4023053 Variable capacity diode device |
| 05/10/1977 | US4022932 Resist reflow method for making submicron patterned resist masks |
| 05/10/1977 | US4022931 Process for making semiconductor device |
| 05/03/1977 | US4021839 Diode package |
| 05/03/1977 | US4021838 Semiconductor integrated circuit devices |
| 04/26/1977 | US4020399 Vapor cooling device for dissipating heat of semiconductor elements |
| 04/26/1977 | US4020206 Thick-film circuit on a substrate with through-contacts between conductor paths on opposite sides of the substrate |
| 04/26/1977 | US4019803 Solder substrate clip |
| 04/26/1977 | US4019248 High voltage junction semiconductor device fabrication |
| 04/19/1977 | US4019098 Heat pipe cooling system for electronic devices |
| 04/19/1977 | US4019094 Static control shorting clip for semiconductor package |
| 04/19/1977 | US4018613 Diode encapsulation glass |
| 04/19/1977 | US4018491 Carrier for devices |
| 04/19/1977 | US4017963 Semiconductor assembly and method |
| 04/12/1977 | US4017890 Intermetallic compound layer in thin films for improved electromigration resistance |
| 04/12/1977 | US4017889 Ternary barrier structure for conductive electrodes |
| 04/12/1977 | US4017886 Discrete semiconductor device having polymer resin as insulator and method for making the same |
| 04/12/1977 | US4017821 Circuit assembly as for a T-element |
| 04/12/1977 | US4017769 Integrated circuits and method of producing the same |
| 04/12/1977 | US4017495 Encapsulation of integrated circuits |
| 04/12/1977 | US4017340 Semiconductor element having a polymeric protective coating and glass coating overlay |
| 04/12/1977 | US4017266 Process for making a brazed lead electrode, and product thereof |
| 04/05/1977 | US4016587 Raised source and drain IGFET device and method |
| 04/05/1977 | US4016016 Method of simultaneously forming a polycrystalline silicon gate and a single crystal extension of said gate in silicon on sapphire MOS devices |
| 04/05/1977 | US4015987 Laminating metal foil, photoresist, etching; plating nickel, gold |
| 03/29/1977 | US4015279 Edgeless transistor |
| 03/29/1977 | US4015173 Support for mounting the electronic components of a single phase unit for an inverter |
| 03/29/1977 | US4015071 Microelectronic circuit case |
| 03/22/1977 | US4013612 Epoxy composition for encasing semiconductor devices |
| 03/22/1977 | US4013489 Process for forming a low resistance interconnect in MOS N-channel silicon gate integrated circuit |
| 03/22/1977 | US4013337 Connection lugs in the form of a comb for power transistors |
| 03/22/1977 | US4012835 Method of forming a dual in-line package |
| 03/15/1977 | US4012770 Cooling a heat-producing electrical or electronic component |
| 03/15/1977 | US4012769 Heat sink with parallel flat faces |
| 03/15/1977 | US4012768 Semiconductor package |
| 03/15/1977 | US4012767 Electrical interconnections for semi-conductor devices |
| 03/15/1977 | US4012766 Semiconductor package and method of manufacture thereof |
| 03/15/1977 | US4012765 Lead frame for plastic encapsulated semiconductor assemblies |
| 03/15/1977 | US4012764 Semiconductor integrated circuit device |
| 03/15/1977 | US4012762 Semiconductor field effect device having oxygen enriched polycrystalline silicon |
| 03/15/1977 | US4012756 Method of inhibiting hillock formation in films and film thereby and multilayer structure therewith |
| 03/15/1977 | US4012723 Magnetic bubble memory packaging arrangement and its method of fabrication |
| 03/15/1977 | US4012263 Alkali-free glasses |
| 03/08/1977 | US4011581 MOSFET antiparasitic layer |
| 03/08/1977 | US4011144 Methods of forming metallization patterns on beam lead semiconductor devices |
| 03/01/1977 | US4010489 High power semiconductor device cooling apparatus and method |
| 03/01/1977 | US4010488 Electronic apparatus with optional coupling |
| 03/01/1977 | US4010143 Molding compound containing N-methyl-Z pyrrolidone and method |
| 03/01/1977 | US4009752 Warp-resistant heat sink |
| 02/22/1977 | US4009485 Semiconductor pellet assembly mounted on ceramic substrate |
| 02/22/1977 | US4009481 Metal semiconductor diode |
| 02/22/1977 | US4009423 Liquid cooled heat exchanger for electronic power supplies |
| 02/22/1977 | US4009057 Method of manufacturing a semiconductor device |
| 02/22/1977 | US4009054 Terrestrial solar cell generator |
| 02/15/1977 | US4008487 Semiconductor component with pressure contact |
| 02/15/1977 | US4008486 Compression-assembled semiconductor device with nesting circular flanges and flexible locating ring |
| 02/15/1977 | US4008484 Semiconductor device having multilayered electrode structure |
| 02/08/1977 | US4007479 Fixture for an integrated circuit chip |
| 02/08/1977 | US4007477 Assembly of a recessed heat sink and a semiconductor device sealed within the recess in the heat sink and thermally connected to the heat sink |
| 02/08/1977 | US4007476 Technique for passivating semiconductor devices |
| 02/08/1977 | US4007402 Three phase full wave rectifier assembly |
| 02/08/1977 | US4007097 Process for selectively applying a metal coating to the metallic parts of elements which pass through an insulator |