Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2014
11/18/2014US8889023 Plasma processing apparatus and plasma processing method
11/18/2014US8889022 Methods of forming asymmetric spacers on various structures on integrated circuit products
11/18/2014US8889021 Process condition sensing device and method for plasma chamber
11/18/2014US8889020 Process for improving critical dimension uniformity of integrated circuit arrays
11/18/2014US8889017 Method for producing silicon waveguides on non-SOI substrate
11/18/2014US8888952 Apparatus for wet treatment of plate-like articles
11/18/2014US8888951 Plasma processing apparatus and electrode for same
11/18/2014US8888950 Apparatus for plasma processing and method for plasma processing
11/18/2014US8888949 Plasma processing equipment and gas distribution apparatus thereof
11/18/2014US8888925 Nozzle, substrate processing apparatus, and substrate processing method
11/18/2014US8888920 Imprint system, imprint method, and non-transitory computer storage medium
11/18/2014US8888919 Wafer carrier with sloped edge
11/18/2014US8888917 Restricted radiated heating assembly for high temperature processing
11/18/2014US8888916 Thermal reactor with improved gas flow distribution
11/18/2014US8888914 Process for producing layered member and layered member
11/18/2014US8888869 Systems, methods and apparatuses for magnetic processing of solar modules
11/18/2014US8888435 Industrial robot with overlapping first hand and second hand during time of linear transport
11/18/2014US8888434 Container storage add-on for bare workpiece stocker
11/18/2014US8888433 Reduced capacity carrier and method of use
11/18/2014US8888387 Coating and developing apparatus and method
11/18/2014US8888329 Light emitting diode module with three part color matching
11/18/2014US8888229 Method for forming a layer, method for manufacturing an active matrix substrate, and method for manufacturing a multilayered wiring substrate
11/18/2014US8888087 Susceptor support portion and epitaxial growth apparatus including susceptor support portion
11/18/2014US8888086 Apparatus with surface protector to inhibit contamination
11/18/2014US8888085 Devices and methodologies for handling wafers
11/18/2014US8887741 Liquid processing apparatus, liquid processing method and storage medium
11/18/2014US8887657 Film forming system and method using application nozzle
11/18/2014US8887650 Temperature-controlled purge gate valve for chemical vapor deposition chamber
11/18/2014US8887383 Electrode structure and method for forming bump
11/13/2014US20140335702 Preparation of cerium-containing precursor and deposition of cerium-containing films
11/13/2014US20140335701 Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium
11/13/2014US20140335700 Carbon Layers for High Temperature Processes
11/13/2014US20140335699 Application of Fluids to Substrates
11/13/2014US20140335698 Component of a plasma processing apparatus having a protective in situ formed layer on a plasma exposed surface
11/13/2014US20140335697 Pulsed dielectric etch process for in-situ metal hard mask shape control to enable void-free metallization
11/13/2014US20140335696 Plasma processing apparatus and plasma processing method
11/13/2014US20140335695 External uv light sources to minimize asymmetric resist pattern trimming rate for three dimensional semiconductor chip manufacture
11/13/2014US20140335694 Methods of Fabricating Substrates
11/13/2014US20140335693 Substrate processing method, program, control apparatus, film forming apparatus, and substrate processing system
11/13/2014US20140335692 Method for forming a resist under layer film and patterning process
11/13/2014US20140335690 Semiconductor device and method for manufacturing the same
11/13/2014US20140335689 Method of Fabricating a Semiconductor Interconnect Structure
11/13/2014US20140335687 Method of making a conductive pillar bump with non-metal sidewall protection structure
11/13/2014US20140335685 Methods of annealing after deposition of gate layers
11/13/2014US20140335684 Manufacturing method and manufacturing apparatus of semiconductor device
11/13/2014US20140335683 Method for producing gallium nitride
11/13/2014US20140335682 Semiconductor device and manufacturing method thereof
11/13/2014US20140335681 Graphene transferring methods, device manufacturing method using the same, and substrate structures including graphene
11/13/2014US20140335680 Multi-layer amorphous silicon structure with improved poly-silicon quality after excimer laser anneal
11/13/2014US20140335679 Methods for etching a substrate
11/13/2014US20140335677 Method for separating epitaxial layer from growth substrate
11/13/2014US20140335676 Method for manufacturing a composite wafer having a graphite core, and composite wafer having a graphite core
11/13/2014US20140335674 Manufacturing method of semiconductor device
11/13/2014US20140335672 Process for manufacturing semiconductor transistor device
11/13/2014US20140335669 Embedded non-volatile memory
11/13/2014US20140335662 Methods for forming package-on-package structures having buffer dams
11/13/2014US20140335659 Method of manufacturing semiconductor device
11/13/2014US20140335658 Semiconductor device and method of land grid array packaging with bussing lines
11/13/2014US20140335657 Stack packages having fastening element and halogen-free inter-package connector
11/13/2014US20140335655 Integrated circuit package system with mounting structure
11/13/2014US20140335654 Method and Apparatus for Semiconductor Device Fabrication Using a Reconstituted Wafer
11/13/2014US20140335649 Compound semiconductor precursor ink composition, method for forming a chalcogenide semiconductor film, and method for forming a photovoltaic device
11/13/2014US20140335646 Method for Forming Metal Silicide Layers
11/13/2014US20140335633 Separation method, computer storage medium, and separation system
11/13/2014US20140335632 Manufacturing method of semiconductor device, and semiconductor device
11/13/2014US20140335631 Semiconductor defect characterization
11/13/2014US20140335412 Process for fabricating nanowire arrays
11/13/2014US20140334806 Dome cooling using compliant material
11/13/2014US20140334060 Electrostatic chuck having thermally isolated zones with minimal crosstalk
11/13/2014US20140334059 Electrostatic chuck and semiconductor manufacturing device
11/13/2014US20140333936 Thickness measuring system and method for a bonding layer
11/13/2014US20140333910 Immersion photolithography system and method using microchannel nozzles
11/13/2014US20140333505 Semiconductor package having integrated antenna pad
11/13/2014US20140333325 Test module device and a test method for monitoring the stability of processes
11/13/2014US20140333006 Apparatus for molding a semiconductor wafer and process therefor
11/13/2014US20140332986 Semiconductor Device and Method of Forming Adhesive Material to Secure Semiconductor Die to Carrier in WLCSP
11/13/2014US20140332978 Optical wiring substrate, manufacturing method of optical wiring substrate and optical module
11/13/2014US20140332976 Semiconductor package and fabrication method thereof
11/13/2014US20140332974 Providing a void-free filled interconnect structure in a layer of a package substrate
11/13/2014US20140332973 Inline measurement of through-silicon via depth
11/13/2014US20140332969 Chip package and method for forming the same
11/13/2014US20140332965 High Performance Refractory Metal / Copper Interconnects To Eliminate Electromigration
11/13/2014US20140332964 Interconnect structures containing nitrided metallic residues
11/13/2014US20140332963 Interconnect with hybrid metallization
11/13/2014US20140332962 Device and Method for Reducing Contact Resistance of a Metal
11/13/2014US20140332961 Cu/CuMn BARRIER LAYER AND FABRICATING METHOD THEREOF
11/13/2014US20140332959 Method of manufacturing semiconductor device and semiconductor device
11/13/2014US20140332958 Method for Manufacturing Dummy Gate in Gate-Last Process and Dummy Gate in Gate-Last Process
11/13/2014US20140332957 Semiconductor package and manufacturing method thereof
11/13/2014US20140332956 Integrated circuit package with spatially varied solder resist opening dimension
11/13/2014US20140332953 Chip arrangement, and method for forming a chip arrangement
11/13/2014US20140332952 Semiconductor structure and method for testing the same
11/13/2014US20140332943 Barrel-plating quad flat no-lead (qfn) packaging structures and method for manufacturing the same
11/13/2014US20140332941 System, method and apparatus for leadless surface mounted semiconductor package
11/13/2014US20140332939 Dual Lead Frame Semiconductor Package and Method of Manufacture
11/13/2014US20140332936 Package arrangement and method of forming the same
11/13/2014US20140332935 MgO-Based Coating for Electrically Insulating Semiconductive Substrates and Production Method Thereof
11/13/2014US20140332934 Substrates for semiconductor devices
11/13/2014US20140332933 Semiconductor structure and method for forming the same
11/13/2014US20140332932 Shallow trench and fabrication method
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