Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2014
11/13/2014US20140332931 Compensation Devices
11/13/2014US20140332924 E-fuse with hybrid metallization
11/13/2014US20140332923 E-fuse with hybrid metallization
11/13/2014US20140332922 Programmable electrical fuse with temperature gradient between anode and cathode
11/13/2014US20140332919 Termination design for nanotube mosfet
11/13/2014US20140332908 Chip package and method for forming the same
11/13/2014US20140332906 High-voltage transistor device and production method
11/13/2014US20140332897 Low Noise and High Performance LSI Device
11/13/2014US20140332896 Semiconductor device and method for forming the same
11/13/2014US20140332886 Single poly plate low on resistance extended drain metal oxide semiconductor device
11/13/2014US20140332875 Vertical memory devices and method of manufacturing the same
11/13/2014US20140332872 Semiconductor device and method for forming the same
11/13/2014US20140332867 Semiconductor device and manufacturing method thereof
11/13/2014US20140332864 Method for Providing a Gate Metal Layer of a Transistor Device and Associated Transistor
11/13/2014US20140332861 Fin structure with varying isolation thickness
11/13/2014US20140332853 Method and apparatus for reduced parasitics and improved multi-finger transistor thermal impedance
11/13/2014US20140332850 Epitaxial Growth of Crystalline Material
11/13/2014US20140332849 Semiconductor device and method of manufacturing the same
11/13/2014US20140332845 Topside structures for an insulated gate bipolar transistor (igbt) device to achieve improved device perforemances
11/13/2014US20140332844 A process method and structure for high voltage mosfets
11/13/2014US20140332818 Low temperature polysilicon film, thin film transistor, manufacturing method thereof and display panel
11/13/2014US20140332814 Methods for the synthesis of arrays of thin crystal grains of layered semiconductors sns2 and sns at designed locations
11/13/2014US20140332813 Semiconductor device
11/13/2014US20140332812 Wafer and system and method for testing the wafer
11/13/2014US20140332811 Semiconductor device with bond and probe pads
11/13/2014US20140332810 Temporary liquid thermal interface material for surface tension adhesion and thermal control
11/13/2014US20140332784 Organic light emitting device, display unit, and device comprising a display unit
11/13/2014US20140332759 Electrode, an electronic device, and a method for manufacturing an optoelectronic device
11/13/2014US20140332513 Device for drilling a substrate and a method for drilling a substrate
11/13/2014US20140332374 Stable photoelectrode surfaces and methods
11/13/2014US20140332251 Metal Wiring and Method of Manufacturing the Same, and Metal Wiring Substrate and Method of Manufacturing the Same
11/13/2014US20140332161 Apparatus for spatial and temporal control of temperature on a substrate
11/13/2014US20140332037 Controls of Ambient Environment During Wafer Drying Using Proximity Head
11/13/2014US20140332036 Device and method for treating substrate surfaces
11/13/2014US20140332034 Process comprising water vapor for haze elimination and residue removal
11/13/2014US20140332033 Flux Residue Cleaning System and Method
11/13/2014US20140331930 Methods and systems for electric field deposition of nanowires and other devices
11/13/2014US20140331928 Method of forming a germanium thin film
11/13/2014US20140331915 Method of growing heteroepitaxial single crystal or large grained semiconductor films on glass substrates and devices thereon
11/13/2014US20140331493 Method of fabricating a package substrate
11/13/2014US20140331462 Packaging Process Tools and Packaging Methods for Semiconductor Devices
11/13/2014US20140331440 Substrate cleaning apparatus
11/11/2014US8886487 Bridge fault removal apparatus, bridge fault removal method, and computer readable medium comprising computer program code for removing bridge fault
11/11/2014US8886354 Methods, systems and apparatus for rapid exchange of work material
11/11/2014US8886277 Micro-electrode array package using liquid crystal polymer and manufacturing method thereof
11/11/2014US8885404 Non-volatile storage system with three layer floating gate
11/11/2014US8885391 Semiconductor device and semiconductor memory device including transistor and capacitor
11/11/2014US8885389 Continuous mesh three dimensional non-volatile storage with vertical select devices
11/11/2014US8885383 Flash memory and layout method thereof
11/11/2014US8885140 Substrate treatment apparatus, substrate treatment method and non-transitory storage medium
11/11/2014US8884650 High-frequency semiconductor switching circuit
11/11/2014US8884640 Integrated high-speed probe system
11/11/2014US8884639 Methods, apparatus and articles of manufacture for testing a plurality of singulated die
11/11/2014US8884448 Flip chip interconnection with double post
11/11/2014US8884447 Semiconductor device and method of manufacturing the same
11/11/2014US8884445 Semiconductor chip and stacked semiconductor package having the same
11/11/2014US8884443 Substrate for semiconductor package and process for manufacturing
11/11/2014US8884442 Method for producing a semiconductor component with a through-contact and semiconductor component with through-contact
11/11/2014US8884440 Integrated circuit device including through-silicon via structure having offset interface
11/11/2014US8884439 Joining electrode, method of manufacturing the same, semiconductor device, and method of manufacturing the same
11/11/2014US8884438 Magnetic microinductors for integrated circuit packaging
11/11/2014US8884437 Electrical device with protruding contact elements and overhang regions over a cavity
11/11/2014US8884436 Semiconductor device, memory system and method of manufacturing the semiconductor device
11/11/2014US8884433 Circuitry component and method for forming the same
11/11/2014US8884431 Packaging methods and structures for semiconductor devices
11/11/2014US8884427 Low CTE interposer without TSV structure
11/11/2014US8884424 Semiconductor package with single sided substrate design and manufacturing methods thereof
11/11/2014US8884422 Flip-chip fan-out wafer level package for package-on-package applications, and method of manufacture
11/11/2014US8884419 Integrated circuit packaging configurations
11/11/2014US8884418 Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps
11/11/2014US8884415 IC package with stainless steel leadframe
11/11/2014US8884413 Leadframes, air-cavity packages, and electronic devices with offset vent holes, and methods of their manufacture
11/11/2014US8884410 Method for manufacturing a microelectronic package comprising at least one microelectronic device
11/11/2014US8884406 Etch depth determination structure
11/11/2014US8884403 Semiconductor die array structure
11/11/2014US8884402 Circuit layout structure
11/11/2014US8884397 Memory device and storage apparatus
11/11/2014US8884396 Semiconductor device and manufacturing method thereof
11/11/2014US8884395 Schottky diode and method for fabricating the same
11/11/2014US8884390 Backside illumination image sensor chips and methods for forming the same
11/11/2014US8884389 Magnetoresistive element and method of manufacturing the same
11/11/2014US8884383 Semiconductor device and method of testing the same
11/11/2014US8884379 Strain engineering in semiconductor devices by using a piezoelectric material
11/11/2014US8884377 Conductive line structures and methods of forming the same
11/11/2014US8884375 Semiconductor integrated circuit device
11/11/2014US8884374 CMOS device and fabrication method
11/11/2014US8884373 Semiconductor device
11/11/2014US8884372 Analog signal compatible CMOS switch as an integrated peripheral to a standard microcontroller
11/11/2014US8884371 SOI substrate and manufacturing method thereof
11/11/2014US8884370 Narrow body field-effect transistor structures with free-standing extension regions
11/11/2014US8884366 Semiconductor device with buried bit lines
11/11/2014US8884365 Trench-gate field effect transistor
11/11/2014US8884362 Semiconductor device and manufacturing method of the same
11/11/2014US8884357 Vertical NAND and method of making thereof using sequential stack etching and landing pad
11/11/2014US8884353 Semiconductor memory device including a stacked gate having a charge storage layer and a control gate, and method of manufacturing the same
11/11/2014US8884351 Hybrid electrical contacts
11/11/2014US8884347 Photoelectric conversion device, package structure therefor, and method of manufacturing photoelectric conversion device
11/11/2014US8884346 Semiconductor structure
11/11/2014US8884345 Graphene electronic device and method of fabricating the same
11/11/2014US8884344 Self-aligned contacts for replacement metal gate transistors
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