Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2014
11/18/2014US8890322 Semiconductor apparatus and method of manufacturing semiconductor apparatus
11/18/2014US8890321 Method of semiconducotr integrated circuit fabrication
11/18/2014US8890319 Chip to package interface
11/18/2014US8890318 Middle of line structures
11/18/2014US8890316 Implementing decoupling devices inside a TSV DRAM stack
11/18/2014US8890314 Package configurations for low EMI circuits
11/18/2014US8890309 Circuit module and method of producing circuit module
11/18/2014US8890308 Integrated circuit package and method of forming the same
11/18/2014US8890305 Semiconductor device
11/18/2014US8890304 Fan-out microelectronic unit WLP having interconnects comprising a matrix of a high melting point, a low melting point and a polymer material
11/18/2014US8890299 Bonded semiconductor structures and methods of forming same
11/18/2014US8890296 Wafer level chip scale package
11/18/2014US8890294 Stack semiconductor package and manufacturing the same
11/18/2014US8890292 Method for manufacturing semiconductor device, and semiconductor substrate
11/18/2014US8890291 Silicon wafer and manufacturing method thereof
11/18/2014US8890289 Semiconductor device and manufacturing method therefor
11/18/2014US8890288 MOM capacitor having local interconnect metal plates and related method
11/18/2014US8890287 Integrated nano-farad capacitors and method of formation
11/18/2014US8890286 Vertically integrated systems
11/18/2014US8890285 Vertically integrated systems
11/18/2014US8890284 Semiconductor device
11/18/2014US8890283 Wafer with recessed plug
11/18/2014US8890282 Integrated circuit devices including through-silicon via (TSV) contact pads electronically insulated from a substrate
11/18/2014US8890280 Trench-type semiconductor power devices
11/18/2014US8890276 Three-dimensional integrated structure capable of detecting a temperature rise
11/18/2014US8890271 Silicon nitride light pipes for image sensors
11/18/2014US8890264 Non-planar III-V field effect transistors with conformal metal gate electrode and nitrogen doping of gate dielectric interface
11/18/2014US8890260 Polysilicon design for replacement gate technology
11/18/2014US8890259 SCR apparatus and method for adjusting the sustaining voltage
11/18/2014US8890258 Semiconductor device and method of forming the same
11/18/2014US8890256 Structure for heavy ion tolerant device, method of manufacturing the same and structure thereof
11/18/2014US8890255 Structure and method for stress latching in non-planar semiconductor devices
11/18/2014US8890254 Airgap structure and method of manufacturing thereof
11/18/2014US8890252 Semiconductor device having switching element and free wheel diode and method for controlling the same
11/18/2014US8890249 Bulk FinFET ESD device
11/18/2014US8890246 Shielding for high-voltage semiconductor-on-insulator devices
11/18/2014US8890245 Raised source/drain structure for enhanced strain coupling from stress liner
11/18/2014US8890243 Semiconductor device
11/18/2014US8890240 Apparatus and method for power MOS transistor
11/18/2014US8890238 Power semiconductor devices, structures, and related methods
11/18/2014US8890234 Nonvolatile semiconductor memory device
11/18/2014US8890232 Methods and apparatus for non-volatile memory cells with increased programming efficiency
11/18/2014US8890231 Nonvolatile semiconductor memory device with a narrowing charge storage layer
11/18/2014US8890230 Semiconductor device
11/18/2014US8890226 Strained channel dynamic random access memory devices
11/18/2014US8890225 Structure and method for single gate non-volatile memory device having a capacitor well doping design with improved coupling efficiency
11/18/2014US8890221 Backside illuminated image sensor pixels with dark field microlenses
11/18/2014US8890218 Semiconductor device
11/18/2014US8890216 Methods and apparatus for measuring analytes using large scale FET arrays
11/18/2014US8890214 Method of manufacturing sidewall spacers on a memory device
11/18/2014US8890213 Semiconductor wafer, electronic device, a method of producing semiconductor wafer, and method of producing electronic device
11/18/2014US8890209 Strained GE-ON-insulator structure and method for forming the same
11/18/2014US8890208 Group III nitride epitaxial substrate for semiconductor device, semiconductor device, and process for producing group III nitride epitaxial substrate for semiconductor device
11/18/2014US8890205 Semiconductor component and an operating method for a protective circuit against light attacks
11/18/2014US8890200 Light emitting device and lighting apparatus having the same
11/18/2014US8890193 Semiconductor light emitting apparatus having stacked reflective dielectric films
11/18/2014US8890191 Chip package and method for forming the same
11/18/2014US8890176 Light emitting device package and light unit having the same
11/18/2014US8890175 Nitride-based semiconductor element and method for fabricating the same
11/18/2014US8890172 Method for manufacturing an electro-optical device
11/18/2014US8890171 Method of fabricating single-layer graphene
11/18/2014US8890170 Silicon carbide substrate, semiconductor device and method for manufacturing silicon carbide substrate
11/18/2014US8890169 Semiconductor device
11/18/2014US8890168 Enhancement mode GaN HEMT device
11/18/2014US8890165 Method of forming polycrystalline silicon layer, thin film transistor, organic light emitting diode display device having the same, and methods of fabricating the same
11/18/2014US8890163 Semiconductor device including metal silicide layer and method for manufacturing the same
11/18/2014US8890145 Thin film transistors and methods for manufacturing the same
11/18/2014US8890119 Vertical nanowire transistor with axially engineered semiconductor and gate metallization
11/18/2014US8890117 Nanowire circuit architecture
11/18/2014US8890115 Stable and metastable nanowires displaying locally controllable properties
11/18/2014US8890112 Controlling ferroelectricity in dielectric films by process induced uniaxial strain
11/18/2014US8890110 Vertical memory device and method of fabricating the same
11/18/2014US8890106 Hybrid circuit of nitride-based transistor and memristor
11/18/2014US8890103 Semiconductor substrate suitable for the realisation of electronic and/or optoelectronic devices and relative manufacturing process
11/18/2014US8890071 Method for assembling and hermetically sealing an encapsulating package
11/18/2014US8890026 Method for cutting processing target
11/18/2014US8890024 Annealing apparatus using two wavelengths of continuous wave laser radiation
11/18/2014US8890018 Method and apparatus for improved sorting of diced substrates
11/18/2014US8889980 Thick-film pastes containing lead—tellurium—lithium—oxides, and their use in the manufacture of semiconductor devices
11/18/2014US8889979 Thick-film pastes containing lead—tellurium—lithium—titanium—oxides, and their use in the manufacture of semiconductor devices
11/18/2014US8889569 Systems and methods for non-periodic pulse sequential lateral soldification
11/18/2014US8889568 Method and apparatus for producing silicon nitride film
11/18/2014US8889567 Apparatus and methods for low K dielectric layers
11/18/2014US8889566 Low cost flowable dielectric films
11/18/2014US8889565 Selective removal of oxygen from metal-containing materials
11/18/2014US8889564 Suspended nanowire structure
11/18/2014US8889563 Method and apparatus for etching the silicon oxide layer of a semiconductor substrate
11/18/2014US8889562 Double patterning method
11/18/2014US8889561 Double sidewall image transfer process
11/18/2014US8889560 Methods of forming fine patterns for semiconductor device
11/18/2014US8889559 Methods of forming a pattern on a substrate
11/18/2014US8889558 Methods of forming a pattern on a substrate
11/18/2014US8889557 Substrate treating method, temporary fixing composition and semiconductor device
11/18/2014US8889555 Polishing agent for copper polishing and polishing method using same
11/18/2014US8889553 Method for polishing through-silicon via (TSV) wafers and a polishing composition used in the method
11/18/2014US8889552 Semiconductor device having dual metal silicide layers and method of manufacturing the same
11/18/2014US8889551 Depositing device and method for manufacturing organic light emitting diode display using the same
11/18/2014US8889550 Lithographic method for making networks of conductors connected by vias
11/18/2014US8889549 Methods of forming conductive structures using a sacrificial liner layer
11/18/2014US8889548 On-chip RF shields with backside redistribution lines
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