Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2014
11/06/2014US20140329371 Soi substrate, method for manufacturing the same, and semiconductor device
11/06/2014US20140329370 Layer transfer of silicon onto iii-nitride material for heterogenous integration
11/06/2014US20140329367 Methods of fabricating semiconductor devices including implanted regions for providing low-resistance contact to buried layers and related devices
11/06/2014US20140329366 Method for fabricating semiconductor device
11/06/2014US20140329363 Fiber-containing resin substrate, sealed substrate having semiconductor device mounted thereon, sealed wafer having semiconductor device formed thereon, a semiconductor apparatus, and method for manufacturing semiconductor apparatus
11/06/2014US20140329360 Method of manufacturing lead frame
11/06/2014US20140329359 Process for making a semiconductor system
11/06/2014US20140329353 Manufacturing method of semiconductor device, semiconductor device and electronic apparatus
11/06/2014US20140329345 Manufacturing method of organic light emitting diode display
11/06/2014US20140329344 Testing an electrical connection of a device cap
11/06/2014US20140329343 Method and system for monitoring crystallization of amorphous silicon thin film, and method of manufacturing thin film transistor by using the method and system
11/06/2014US20140329341 Bonding method, bonding apparatus and bonding system
11/06/2014US20140329340 Heat treatment method and heat treatment apparatus
11/06/2014US20140329057 Photo-curable composition and patterning method
11/06/2014US20140329011 Composition and method for low temperature chemical vapor deposition of silicon-containing films including silicon carbonitride and silicon oxycarbonitride films
11/06/2014US20140328742 Method for producing group iii nitride crystal, group iii nitride crystal, and semiconductor device
11/06/2014US20140328654 Scalable stockers with automatic handling buffer
11/06/2014US20140328128 NAND String Utilizing Floating Body Memory Cell
11/06/2014US20140327665 Pixel circuit, display device, and method of driving pixel circuit
11/06/2014US20140327470 Field programmable gate array utilizing two-terminal non-volatile memory
11/06/2014US20140327202 Device and method for aligning and holding a plurality of singulated semiconductor components in receiving pockets of a terminal carrier
11/06/2014US20140327157 Semiconductor device and method for manufacturing same
11/06/2014US20140327151 Through substrate via structures and methods of forming the same
11/06/2014US20140327147 Semiconductor device and method for fabricating the same
11/06/2014US20140327143 Semiconductor device having groove-shaped via-hole
11/06/2014US20140327142 Metal contacts to group iv semiconductors by inserting interfacial atomic monolayers
11/06/2014US20140327141 Copper interconnect structure and method for forming the same
11/06/2014US20140327140 Integrated circuits and methods for fabricating integrated circuits with improved contact structures
11/06/2014US20140327139 Contact liner and methods of fabrication thereof
11/06/2014US20140327136 Semiconductor device having under-bump metallization (ubm) structure and method of forming the same
11/06/2014US20140327134 Metal bump structure for use in driver ic and method for forming the same
11/06/2014US20140327133 Metal bump structure for use in driver ic and method for forming the same
11/06/2014US20140327128 Cooling System for Molded Modules and Corresponding Manufacturing Methods
11/06/2014US20140327127 Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip
11/06/2014US20140327125 Semiconductor package structure and fabrication method thereof
11/06/2014US20140327118 Power semiconductor device and fabricating method thereof
11/06/2014US20140327117 Optically tuned hardmask for multi-patterning applications
11/06/2014US20140327112 Method to delineate crystal related defects
11/06/2014US20140327106 Bipolar junction transistors with self-aligned terminals
11/06/2014US20140327103 Semiconductor Device with an Electrode Buried in a Cavity
11/06/2014US20140327084 Dual shallow trench isolation (sti) field effect transistor (fet) and methods of forming
11/06/2014US20140327083 Combination-type transistor and method for manufacturing same
11/06/2014US20140327064 Method for fabricating a metal-insulator-metal (mim) capacitor having capacitor dielectric layer formed by atomic layer deposition (ald)
11/06/2014US20140327057 Power Semiconductor Device with a Double Metal Contact
11/06/2014US20140327055 Replacement gate process and device manufactured using the same
11/06/2014US20140327053 Semiconductor Device Including Trench Transistor Cell Array and Manufacturing Method
11/06/2014US20140327050 Standard cell having cell height being non-integral multiple of nominal minimum pitch
11/06/2014US20140327047 Fet dielectric reliability enhancement
11/06/2014US20140327013 Method for manufacturing a thick eptaxial layer of gallium nitride on a silicon or similar substrate and layer obtained using said method
11/06/2014US20140327006 Active Device Substrate and Manufacturing Method Thereof
11/06/2014US20140327004 Lead Frame Strips with Support Members
11/06/2014US20140327003 Removable indicator structure in electronic chips of a common substrate for process adjustment
11/06/2014US20140326955 Planar transistors with nanowires cointegrated on a soi utbox substrate
11/06/2014US20140326409 Plasma processing apparatus and method
11/06/2014US20140326408 Mask pattern for hole patterning and method for fabricating semiconductor device using the same
11/06/2014US20140326281 Substrate treatment apparatus
11/06/2014US20140326184 Cooling pedestal with coating of diamond-like carbon
11/06/2014US20140326176 A support including an electrostatic substrate carrier
11/06/2014US20140325772 Load port module
11/04/2014USRE45232 Method of forming a contact plug for a semiconductor device
11/04/2014US8881297 Access arbitration module and system for semiconductor fabrication equipment and methods for using and operating the same
11/04/2014US8881087 Power routing with integrated decoupling capacitance
11/04/2014US8881086 Integrated circuit devices and methods and apparatuses for designing integrated circuit devices
11/04/2014US8880849 Apparatus, method, system and executable module for configuration and operation of adaptive integrated circuitry having fixed, application specific computational elements
11/04/2014US8880227 Component temperature control by coolant flow control and heater duty cycle control
11/04/2014US8880210 Methods and apparatus for processing substrates using model-based control
11/04/2014US8880165 Biocompatible bonding method and electronics package suitable for implantation
11/04/2014US8879598 Emitting device with compositional and doping inhomogeneities in semiconductor layers
11/04/2014US8879596 Semiconductor laser
11/04/2014US8879595 Quantum cascade structures on metamorphic buffer layer structures
11/04/2014US8879326 Nonvolatile semiconductor memory device including plural memory cells and a dummy cell coupled to an end of a memory cell
11/04/2014US8879233 Electrostatic chuck with polymer protrusions
11/04/2014US8879071 Multiple optical wavelength interferometric testing methods for the development and evaluation of subwavelength sized features within semiconductor devices and materials, wafers, and monitoring all phases of development and manufacture
11/04/2014US8878561 Screening method, screening device and program
11/04/2014US8878368 Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging
11/04/2014US8878367 Substrate structure with through vias
11/04/2014US8878365 Semiconductor device having a conductive layer reliably formed under an electrode pad
11/04/2014US8878364 Method for fabricating semiconductor device and semiconductor device
11/04/2014US8878363 Fermi-level unpinning structures for semiconductive devices, processes of forming same, and systems containing same
11/04/2014US8878362 Copper interconnects having a titanium—titanium nitride assembly between copper and compound semiconductor
11/04/2014US8878361 Leadless package system having external contacts
11/04/2014US8878359 Semiconductor device and method of forming insulating layer around semiconductor die
11/04/2014US8878357 Electronic component device, method of manufacturing the same and wiring substrate
11/04/2014US8878353 Structure for microelectronic packaging with bond elements to encapsulation surface
11/04/2014US8878348 Semiconductor device and method of assembling same
11/04/2014US8878345 Structural body and method for manufacturing semiconductor substrate
11/04/2014US8878342 Using alloy electrodes to dope memristors
11/04/2014US8878341 Graphene-based composite materials, method of manufacture and applications thereof
11/04/2014US8878339 Chip-component structure and method of producing same
11/04/2014US8878338 Capacitor for interposers and methods of manufacture thereof
11/04/2014US8878337 Integrated circuit structure having a capacitor structured to reduce dishing of metal layers
11/04/2014US8878336 Fuse
11/04/2014US8878335 Method and system for providing fusing after packaging of semiconductor devices
11/04/2014US8878334 Integrated circuit resistors with reduced parasitic capacitance
11/04/2014US8878333 Semiconductor device having improved RF characteristics and moisture resistance and method for manufacturing the same
11/04/2014US8878332 NAND flash memory device
11/04/2014US8878331 Method for manufacturing insulated-gate MOS transistors
11/04/2014US8878330 Integrated high voltage divider
11/04/2014US8878321 Magnetoresistive element and producing method thereof
11/04/2014US8878311 Integrated circuit having raised source drains devices with reduced silicide contact resistance and methods to fabricate same
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