Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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02/06/2013 | CN102270640B Heavy-current whole-wafer total-pressure-contact flat-plate encapsulated IGBT (Insulated Gate Bipolar Transistor) and manufacturing method thereof |
02/06/2013 | CN102243994B Method of growing silicon-based gallium arsenide material with inverted V-shaped silicon dioxide groove structure |
02/06/2013 | CN102237364B Manufacturing method of storage device |
02/06/2013 | CN102237288B Method for detecting surface passivation effect of GaN field effect transistor |
02/06/2013 | CN102214555B Method for thinning sapphire wafer |
02/06/2013 | CN102185044B High-power light emitting diode (LED) liquid silicone rubber encapsulation method and encapsulation mould |
02/06/2013 | CN102176425B Cartesian robot cluster tool architecture |
02/06/2013 | CN102157489B Semiconductor device and manufacturing method of semiconductor device |
02/06/2013 | CN102148176B Lifting device and semiconductor device processing equipment with same |
02/06/2013 | CN102142456B Bipolar junction transistor with high gain constant beta and manufacturing method thereof |
02/06/2013 | CN102130034B Loadlock and loadlock chamber using the same |
02/06/2013 | CN102122626B Conveying device and method, and display panel assembly equipment and method applied thereby |
02/06/2013 | CN102117828B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
02/06/2013 | CN102103995B Method for fabricating an integrated circuit device |
02/06/2013 | CN102088019B Three-dimensional laminated element with an interconnect structure and manufacturing method thereof |
02/06/2013 | CN102082071B Manufacturing method of ceramic spraying part |
02/06/2013 | CN102074484B Method of attaching interconnection plate to semiconductor die within leadframe package |
02/06/2013 | CN102050330B Mechanical arm and transport device provided with same |
02/06/2013 | CN102047430B Field effect transistor and method for manufacturing the same |
02/06/2013 | CN102047426B Semiconductor device and manufacturing method thereof |
02/06/2013 | CN102034735B Method for improving uniformity of characteristic dimension of connecting hole |
02/06/2013 | CN102024744B Semiconductor device and manufacture method thereof |
02/06/2013 | CN102010667B Method for preparing aluminum wiring polishing solution of VLSI (Very Large-Scale Integration) circuit |
02/06/2013 | CN102007610B Nitride-based semiconductor device and method for fabricating the same |
02/06/2013 | CN101996957B Semiconductor device having semiconductor chip and metal plate and method for manufacturing the same |
02/06/2013 | CN101946315B High efficiency electro-static chucks for semiconductor wafer processing |
02/06/2013 | CN101924138B MOS (Metal Oxide Semiconductor) device structure for preventing floating-body effect and self-heating effect and preparation method thereof |
02/06/2013 | CN101872767B Silicon nitride trap layer olive-shaped energy band gap structure and manufacturing method thereof of SONOS (Silicon Oxide Nitride Oxide Semiconductor) component |
02/06/2013 | CN101872173B Method and system for semiconductor product level control |
02/06/2013 | CN101840917B Integrate circuit and subassembly |
02/06/2013 | CN101825898B Control system with fault diagnosis function and method |
02/06/2013 | CN101809107B Adhesive composition, electronic component-mounted substrate using the adhesive composition, and semiconductor device |
02/06/2013 | CN101800187B Transfer chamber and method for preventing adhesion of particle |
02/06/2013 | CN101800183B Combined semiconductor apparatus with thin semiconductor films |
02/06/2013 | CN101799840B Routing method for double patterning design |
02/06/2013 | CN101794942B Elastic contact and method of manufacturing the same, and contact substrate and method of manufacturing the same |
02/06/2013 | CN101790785B Stage apparatus |
02/06/2013 | CN101783283B Handling device and electronic component testing system |
02/06/2013 | CN101765912B Method for producing an electronic component and electronic component |
02/06/2013 | CN101752383B One-time programmable memory and manufacture and programming reading method |
02/06/2013 | CN101713066B Method for depositing film and film deposition apparatus |
02/06/2013 | CN101681853B Mobile binding in an electronic connection |
02/06/2013 | CN101673768B Low voltage high density trench-gated power device with uniformly doped channel and its edge termination technique |
02/06/2013 | CN101661952B Amorphous oxide semiconductor and thin film transistor using the same |
02/06/2013 | CN101587872B Semiconductor device, method for mounting semiconductor device, and mounting structure of semiconductor device |
02/06/2013 | CN101568615B Polishing liquid composition |
02/06/2013 | CN101548364B Top panel and plasma processing apparatus |
02/06/2013 | CN101512748B Substrate conveying apparatus, and substrate conveying method |
02/06/2013 | CN101494223B Semiconductor device and method of producing the same |
02/06/2013 | CN101488514B Resistor conversion memory |
02/06/2013 | CN101441993B Slot valve assembly part and operating method thereof |
02/06/2013 | CN101419936B Splitting method for wafer |
02/06/2013 | CN101405655B Negative-type photosensitive fluorinated aromatic resin composition |
02/06/2013 | CN101373774B Integrated circuit memory devices and methods of fabricating same |
02/06/2013 | CN101350376B Avalanche photodiode with edge breakdown suppression |
02/06/2013 | CN101313397B Carbon nanotubes solder composite for high performance interconnect |
02/06/2013 | CN101167190B Diamond transistor and method of manufacture thereof |
02/06/2013 | CN101034719B 半导体装置及其制造方法 Semiconductor device and manufacturing method |
02/06/2013 | CN101027761B Planarizing a semiconductor structure to form replacement metal gates |
02/05/2013 | USRE43980 Laser decapsulation method |
02/05/2013 | US8370249 Enhanced parimutuel wagering |
02/05/2013 | US8369978 Adjusting polishing rates by using spectrographic monitoring of a substrate during processing |
02/05/2013 | US8369144 Semiconductor device and method of manufacturing the same |
02/05/2013 | US8368870 Exposure apparatus and device manufacturing method |
02/05/2013 | US8368735 Light emitting array for printing or copying |
02/05/2013 | US8368416 In-process system level test before surface mount |
02/05/2013 | US8368235 Resin sealing method of semiconductor device |
02/05/2013 | US8368231 Chipstack package and manufacturing method thereof |
02/05/2013 | US8368228 Area efficient through-hole connections |
02/05/2013 | US8368227 Semiconductor element and package having semiconductor element |
02/05/2013 | US8368226 Die power structure |
02/05/2013 | US8368216 Semiconductor package |
02/05/2013 | US8368215 Semiconductor device and method of manufacturing the same |
02/05/2013 | US8368213 Low fabrication cost, fine pitch and high reliability solder bump |
02/05/2013 | US8368211 Solderable top metalization and passivation for source mounted package |
02/05/2013 | US8368204 Chip structure and process for forming the same |
02/05/2013 | US8368201 Method for embedding a component in a base |
02/05/2013 | US8368197 Semiconductor package and method of manufacturing the semiconductor package |
02/05/2013 | US8368189 Auxiliary leadframe member for stabilizing the bond wire process |
02/05/2013 | US8368187 Semiconductor device and method of forming air gap adjacent to stress sensitive region of the die |
02/05/2013 | US8368184 Silicon device structure, and sputtering target used for forming the same |
02/05/2013 | US8368177 Integrated circuit with ESD structure |
02/05/2013 | US8368175 Capacitor, semiconductor device having the same, and method of producing them |
02/05/2013 | US8368170 Reducing device performance drift caused by large spacings between active regions |
02/05/2013 | US8368169 Semiconductor device having a device isolation structure |
02/05/2013 | US8368167 Schottky diode with extended forward current capability |
02/05/2013 | US8368161 Solid-state image capturing device, method of manufacturing solid-state image capturing device, and image capturing apparatus |
02/05/2013 | US8368154 Three dimensional folded MEMS technology for multi-axis sensor systems |
02/05/2013 | US8368153 Wafer level package of MEMS microphone and manufacturing method thereof |
02/05/2013 | US8368152 MEMS device etch stop |
02/05/2013 | US8368151 Semiconductor device |
02/05/2013 | US8368147 Strained semiconductor device with recessed channel |
02/05/2013 | US8368146 FinFET devices |
02/05/2013 | US8368142 Semiconductor device and method of manufacturing the same |
02/05/2013 | US8368133 Memory constructions comprising magnetic materials |
02/05/2013 | US8368132 Ferroelectric memory and manufacturing method thereof |
02/05/2013 | US8368124 Electromechanical devices having etch barrier layers |
02/05/2013 | US8368118 Semiconductor structure having an ELOG on a thermally and electrically conductive mask |
02/05/2013 | US8368117 III-nitride materials including low dislocation densities and methods associated with the same |
02/05/2013 | US8368110 Side view LED package structure |