Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2013
02/06/2013CN102270640B Heavy-current whole-wafer total-pressure-contact flat-plate encapsulated IGBT (Insulated Gate Bipolar Transistor) and manufacturing method thereof
02/06/2013CN102243994B Method of growing silicon-based gallium arsenide material with inverted V-shaped silicon dioxide groove structure
02/06/2013CN102237364B Manufacturing method of storage device
02/06/2013CN102237288B Method for detecting surface passivation effect of GaN field effect transistor
02/06/2013CN102214555B Method for thinning sapphire wafer
02/06/2013CN102185044B High-power light emitting diode (LED) liquid silicone rubber encapsulation method and encapsulation mould
02/06/2013CN102176425B Cartesian robot cluster tool architecture
02/06/2013CN102157489B Semiconductor device and manufacturing method of semiconductor device
02/06/2013CN102148176B Lifting device and semiconductor device processing equipment with same
02/06/2013CN102142456B Bipolar junction transistor with high gain constant beta and manufacturing method thereof
02/06/2013CN102130034B Loadlock and loadlock chamber using the same
02/06/2013CN102122626B Conveying device and method, and display panel assembly equipment and method applied thereby
02/06/2013CN102117828B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
02/06/2013CN102103995B Method for fabricating an integrated circuit device
02/06/2013CN102088019B Three-dimensional laminated element with an interconnect structure and manufacturing method thereof
02/06/2013CN102082071B Manufacturing method of ceramic spraying part
02/06/2013CN102074484B Method of attaching interconnection plate to semiconductor die within leadframe package
02/06/2013CN102050330B Mechanical arm and transport device provided with same
02/06/2013CN102047430B Field effect transistor and method for manufacturing the same
02/06/2013CN102047426B Semiconductor device and manufacturing method thereof
02/06/2013CN102034735B Method for improving uniformity of characteristic dimension of connecting hole
02/06/2013CN102024744B Semiconductor device and manufacture method thereof
02/06/2013CN102010667B Method for preparing aluminum wiring polishing solution of VLSI (Very Large-Scale Integration) circuit
02/06/2013CN102007610B Nitride-based semiconductor device and method for fabricating the same
02/06/2013CN101996957B Semiconductor device having semiconductor chip and metal plate and method for manufacturing the same
02/06/2013CN101946315B High efficiency electro-static chucks for semiconductor wafer processing
02/06/2013CN101924138B MOS (Metal Oxide Semiconductor) device structure for preventing floating-body effect and self-heating effect and preparation method thereof
02/06/2013CN101872767B Silicon nitride trap layer olive-shaped energy band gap structure and manufacturing method thereof of SONOS (Silicon Oxide Nitride Oxide Semiconductor) component
02/06/2013CN101872173B Method and system for semiconductor product level control
02/06/2013CN101840917B Integrate circuit and subassembly
02/06/2013CN101825898B Control system with fault diagnosis function and method
02/06/2013CN101809107B Adhesive composition, electronic component-mounted substrate using the adhesive composition, and semiconductor device
02/06/2013CN101800187B Transfer chamber and method for preventing adhesion of particle
02/06/2013CN101800183B Combined semiconductor apparatus with thin semiconductor films
02/06/2013CN101799840B Routing method for double patterning design
02/06/2013CN101794942B Elastic contact and method of manufacturing the same, and contact substrate and method of manufacturing the same
02/06/2013CN101790785B Stage apparatus
02/06/2013CN101783283B Handling device and electronic component testing system
02/06/2013CN101765912B Method for producing an electronic component and electronic component
02/06/2013CN101752383B One-time programmable memory and manufacture and programming reading method
02/06/2013CN101713066B Method for depositing film and film deposition apparatus
02/06/2013CN101681853B Mobile binding in an electronic connection
02/06/2013CN101673768B Low voltage high density trench-gated power device with uniformly doped channel and its edge termination technique
02/06/2013CN101661952B Amorphous oxide semiconductor and thin film transistor using the same
02/06/2013CN101587872B Semiconductor device, method for mounting semiconductor device, and mounting structure of semiconductor device
02/06/2013CN101568615B Polishing liquid composition
02/06/2013CN101548364B Top panel and plasma processing apparatus
02/06/2013CN101512748B Substrate conveying apparatus, and substrate conveying method
02/06/2013CN101494223B Semiconductor device and method of producing the same
02/06/2013CN101488514B Resistor conversion memory
02/06/2013CN101441993B Slot valve assembly part and operating method thereof
02/06/2013CN101419936B Splitting method for wafer
02/06/2013CN101405655B Negative-type photosensitive fluorinated aromatic resin composition
02/06/2013CN101373774B Integrated circuit memory devices and methods of fabricating same
02/06/2013CN101350376B Avalanche photodiode with edge breakdown suppression
02/06/2013CN101313397B Carbon nanotubes solder composite for high performance interconnect
02/06/2013CN101167190B Diamond transistor and method of manufacture thereof
02/06/2013CN101034719B 半导体装置及其制造方法 Semiconductor device and manufacturing method
02/06/2013CN101027761B Planarizing a semiconductor structure to form replacement metal gates
02/05/2013USRE43980 Laser decapsulation method
02/05/2013US8370249 Enhanced parimutuel wagering
02/05/2013US8369978 Adjusting polishing rates by using spectrographic monitoring of a substrate during processing
02/05/2013US8369144 Semiconductor device and method of manufacturing the same
02/05/2013US8368870 Exposure apparatus and device manufacturing method
02/05/2013US8368735 Light emitting array for printing or copying
02/05/2013US8368416 In-process system level test before surface mount
02/05/2013US8368235 Resin sealing method of semiconductor device
02/05/2013US8368231 Chipstack package and manufacturing method thereof
02/05/2013US8368228 Area efficient through-hole connections
02/05/2013US8368227 Semiconductor element and package having semiconductor element
02/05/2013US8368226 Die power structure
02/05/2013US8368216 Semiconductor package
02/05/2013US8368215 Semiconductor device and method of manufacturing the same
02/05/2013US8368213 Low fabrication cost, fine pitch and high reliability solder bump
02/05/2013US8368211 Solderable top metalization and passivation for source mounted package
02/05/2013US8368204 Chip structure and process for forming the same
02/05/2013US8368201 Method for embedding a component in a base
02/05/2013US8368197 Semiconductor package and method of manufacturing the semiconductor package
02/05/2013US8368189 Auxiliary leadframe member for stabilizing the bond wire process
02/05/2013US8368187 Semiconductor device and method of forming air gap adjacent to stress sensitive region of the die
02/05/2013US8368184 Silicon device structure, and sputtering target used for forming the same
02/05/2013US8368177 Integrated circuit with ESD structure
02/05/2013US8368175 Capacitor, semiconductor device having the same, and method of producing them
02/05/2013US8368170 Reducing device performance drift caused by large spacings between active regions
02/05/2013US8368169 Semiconductor device having a device isolation structure
02/05/2013US8368167 Schottky diode with extended forward current capability
02/05/2013US8368161 Solid-state image capturing device, method of manufacturing solid-state image capturing device, and image capturing apparatus
02/05/2013US8368154 Three dimensional folded MEMS technology for multi-axis sensor systems
02/05/2013US8368153 Wafer level package of MEMS microphone and manufacturing method thereof
02/05/2013US8368152 MEMS device etch stop
02/05/2013US8368151 Semiconductor device
02/05/2013US8368147 Strained semiconductor device with recessed channel
02/05/2013US8368146 FinFET devices
02/05/2013US8368142 Semiconductor device and method of manufacturing the same
02/05/2013US8368133 Memory constructions comprising magnetic materials
02/05/2013US8368132 Ferroelectric memory and manufacturing method thereof
02/05/2013US8368124 Electromechanical devices having etch barrier layers
02/05/2013US8368118 Semiconductor structure having an ELOG on a thermally and electrically conductive mask
02/05/2013US8368117 III-nitride materials including low dislocation densities and methods associated with the same
02/05/2013US8368110 Side view LED package structure